scholarly journals Correction: Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

RSC Advances ◽  
2015 ◽  
Vol 5 (125) ◽  
pp. 103566-103566
Author(s):  
N. I. M. Nordin ◽  
S. M. Said ◽  
R. Ramli ◽  
K. Weide-Zaage ◽  
M. F. M. Sabri ◽  
...  
Keyword(s):  
Corrosion Behaviour ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aluminium Addition ◽  
Free Solder

Correction for ‘Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder’ by N. I. M. Nordin et al., RSC Adv., 2015, 5, 99058–99064.

Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

RSC Advances ◽  
2015 ◽  
Vol 5 (120) ◽  
pp. 99058-99064 ◽  
Author(s):  
N. I. M. Nordin ◽  
S. M. Said ◽  
R. Ramli ◽  
K. Weide-Zaage ◽  
M. F. M. Sabri ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Corrosion Behaviour ◽  
Corrosion Products ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aluminium Addition ◽  
Sac105 Solder ◽  
Free Solder

(a) Al provides an enhanced passivation capability over SAC105 solder alloy. (b) Corrosion products on the surface consist of Al2CuO4, Al2O3, SnO and SnO2. (c) Al-added SAC105 is less susceptible to corrosion.

Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

2015 ◽  
Vol 754-755 ◽  
pp. 166-170 ◽  
Author(s):  
Nurul Razliana Abdul Razak ◽  
Nisrin Adli ◽  
Norainiza Saud ◽  
Sayyidah Amnah Musa
Keyword(s):  
Powder Metallurgy ◽  
Grain Boundaries ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Weight Percentage ◽  
Aluminium Addition ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu-xAl lead-free solder was systematically investigated. The Sn-0.7Cu-xAl solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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