Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

RSC Advances ◽  
2015 ◽  
Vol 5 (120) ◽  
pp. 99058-99064 ◽  
Author(s):  
N. I. M. Nordin ◽  
S. M. Said ◽  
R. Ramli ◽  
K. Weide-Zaage ◽  
M. F. M. Sabri ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Corrosion Behaviour ◽  
Corrosion Products ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aluminium Addition ◽  
Sac105 Solder ◽  
Free Solder

(a) Al provides an enhanced passivation capability over SAC105 solder alloy. (b) Corrosion products on the surface consist of Al2CuO4, Al2O3, SnO and SnO2. (c) Al-added SAC105 is less susceptible to corrosion.

Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

2015 ◽  
Vol 754-755 ◽  
pp. 166-170 ◽  
Author(s):  
Nurul Razliana Abdul Razak ◽  
Nisrin Adli ◽  
Norainiza Saud ◽  
Sayyidah Amnah Musa
Keyword(s):  
Powder Metallurgy ◽  
Grain Boundaries ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Weight Percentage ◽  
Aluminium Addition ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of Al particles addition on the microstructure and microhardness of Sn-0.7Cu-xAl lead-free solder was systematically investigated. The Sn-0.7Cu-xAl solder alloy was successfully fabricated via powder metallurgy (PM) method which consists of mixing, compaction and sintering. Results show that the crystallization of Sn occurs in two different modifications; α-Sn and β-Sn, where the formation of β-Sn able to reinforce the solder matrix. The Al particles also distributed homogeneously along the grain boundaries. The microhardness was improved by 19% as the weight percentage of the Al particles increased up to 1.0 wt.%.

scholarly journals Correction: Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder

RSC Advances ◽  
2015 ◽  
Vol 5 (125) ◽  
pp. 103566-103566
Author(s):  
N. I. M. Nordin ◽  
S. M. Said ◽  
R. Ramli ◽  
K. Weide-Zaage ◽  
M. F. M. Sabri ◽  
...  
Keyword(s):  
Corrosion Behaviour ◽  
Lead Free ◽  
Lead Free Solder ◽  
Aluminium Addition ◽  
Free Solder

Correction for ‘Impact of aluminium addition on the corrosion behaviour of Sn–1.0Ag–0.5Cu lead-free solder’ by N. I. M. Nordin et al., RSC Adv., 2015, 5, 99058–99064.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

scholarly journals Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix

2020 ◽  
Author(s):  
Manoj Kumar Pal ◽  
Gréta Gergely ◽  
Dániel Koncz-Horváth ◽  
Zoltán Gácsi
Keyword(s):  
Silicon Carbide ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Solder Matrix ◽  
Microstructure Analysis ◽  
Lead Free ◽  
Lead Free Solder ◽  
Sac305 Solder ◽  
Small Change ◽  
Free Solder

Abstract The Sn-3.0Ag-0.5Cu solder alloy is a prominent candidate for the Pb-free solder, and SAC305 solder is generally employed in today’s electronic enterprise. In this study, the formation of intermetallic compounds (Cu6Sn5 and Ag3Sn) at the interface, average neighbour’s particle distance, and the morphological mosaic are examined by the addition of SiC and nickel-coated silicon carbide reinforcements within Sn-3.0Ag-0.5Cu solder. Results revealed that the addition of SiC and SiC(Ni) particles are associated with a small change to the average neighbor’s particle distance and a decrease of clustering rate to a certain limit of the Sn-3.0Ag-0.5Cu solder composites. Moreover, the development of the Cu6Sn5 and the structure of the Ag3Sn are improved with the addition of SiC and Ni coated SiC.

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

2020 ◽  
Vol 43 (12) ◽  
pp. 2883-2891
Author(s):  
Q.B. Tao ◽  
L. Benabou ◽  
Van Nhat Le ◽  
Ngoc Anh Thi Nguyen ◽  
Hung Nguyen‐Xuan
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Temperature Dependent ◽  
Lead Free Solder Alloy ◽  
Free Solder

Sn-Mg lead-free solder alloy: Effect of solidification thermal parameters on microstructural features and microhardness

2019 ◽  
Vol 6 (12) ◽  
pp. 126562 ◽  
Author(s):  
Clarissa B da Cruz ◽  
Thiago S Lima ◽  
Thiago A Costa ◽  
Crystopher Brito ◽  
Amauri Garcia ◽  
...  
Keyword(s):  
Solder Alloy ◽  
Thermal Parameters ◽  
Lead Free ◽  
Lead Free Solder ◽  
Alloy Effect ◽  
Lead Free Solder Alloy ◽  
Free Solder
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