Styrene hydrogenation performance of Pt nanoparticles with controlled size prepared by atomic layer deposition

2015 ◽  
Vol 5 (8) ◽  
pp. 4218-4223 ◽  
Author(s):  
Jianwei Li ◽  
Bin Zhang ◽  
Yao Chen ◽  
Jiankang Zhang ◽  
Huimin Yang ◽  
...  

Pt sub-nanoparticles supported on carbon nanotubes prepared by atomic layer deposition exhibit unusual catalytic performance for styrene hydrogenation.

2019 ◽  
Vol 16 (2) ◽  
pp. 855-862 ◽  
Author(s):  
Yang-Chih Hsueh ◽  
Chia-Te Hu ◽  
Chih-Chieh Wang ◽  
Chueh Liu ◽  
Tsong-Pyng Perng

2017 ◽  
Vol 7 (2) ◽  
pp. 322-329 ◽  
Author(s):  
Jiankang Zhang ◽  
Chaoqiu Chen ◽  
Shuai Chen ◽  
Qingmin Hu ◽  
Zhe Gao ◽  
...  

Highly active Pt nanoparticles deposited on CNTs were synthesized by atomic layer deposition used for hydrogen generation from AB hydrolysis.


2021 ◽  
Author(s):  
Marwa Atwa ◽  
Xiaoan Li ◽  
Zhaoxuan Wang ◽  
Samuel Dull ◽  
Shicheng Xu ◽  
...  

A self-supported, binder-free and scalable nanoporous carbon scaffold serves as an excellent host for the efficient and uniform atomic layer deposition of Pt nanoparticles, showing exemplary performance as a cathode catalyst layer in a PEM fuel cell.


2016 ◽  
Vol 27 (40) ◽  
pp. 405702 ◽  
Author(s):  
Sheng-Hsin Huang ◽  
Shih-Yun Liao ◽  
Chih-Chieh Wang ◽  
Chi-Chung Kei ◽  
Jon-Yiew Gan ◽  
...  

2015 ◽  
Vol 27 (3) ◽  
pp. 034001 ◽  
Author(s):  
Adriaan J M Mackus ◽  
Matthieu J Weber ◽  
Nick F W Thissen ◽  
Diana Garcia-Alonso ◽  
René H J Vervuurt ◽  
...  

Nanomaterials ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 1085 ◽  
Author(s):  
Kemelbay ◽  
Tikhonov ◽  
Aloni ◽  
Kuykendall

As one of the highest mobility semiconductor materials, carbon nanotubes (CNTs) have been extensively studied for use in field effect transistors (FETs). To fabricate surround-gate FETs— which offer the best switching performance—deposition of conformal, weakly-interacting dielectric layers is necessary. This is challenging due to the chemically inert surface of CNTs and a lack of nucleation sites—especially for defect-free CNTs. As a result, a technique that enables integration of uniform high-k dielectrics, while preserving the CNT’s exceptional properties is required. In this work, we show a method that enables conformal atomic layer deposition (ALD) of high-k dielectrics on defect-free CNTs. By depositing a thin Ti metal film, followed by oxidation to TiO2 under ambient conditions, a nucleation layer is formed for subsequent ALD deposition of Al2O3. The technique is easy to implement and is VLSI-compatible. We show that the ALD coatings are uniform, continuous and conformal, and Raman spectroscopy reveals that the technique does not induce defects in the CNT. The resulting bilayer TiO2/Al2O3 thin-film shows an improved dielectric constant of 21.7 and an equivalent oxide thickness of 2.7 nm. The electrical properties of back-gated and top-gated devices fabricated using this method are presented.


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