Low-temperature annealed PbS quantum dot films for scalable and flexible ambipolar thin-film-transistors and circuits

2014 ◽  
Vol 2 (48) ◽  
pp. 10305-10311 ◽  
Author(s):  
Chan Ho Jo ◽  
Jae Hyun Kim ◽  
Jaekyun Kim ◽  
Jiwan Kim ◽  
Min Suk Oh ◽  
...  
Author(s):  
Mai Xuan Dung ◽  
Mai Van Tuan ◽  
Hoang Quang Bac ◽  
Dinh Thi Cham ◽  
Le Quang Trung ◽  
...  

Zinc oxide (ZnO) has been widely deployed as electron conducting layer in emerging photovoltaics including quantum dot, perovskite and organic solar cells. Reducing the curing temperature of ZnO layer to below 200 oC is an essential requirement to reduce the cell fabrication cost enabled by large-scale processes such as ink-jet printing, spin coating or roll-roll printing. Herein, we present a novel water-based ZnO precursor stabilized with labile NH3, which allow us to spin coat crystalline ZnO thin films with temperatures below 200 oC. Thin film transistors (TFTs) and diode-type quantum dot solar cells (QD SCs) were fabricated using ZnO as electron conduction layer.  In the QD SCs, a p-type 1,2-ethylenedithiol treated PbS QDs with a bandgap of 1.4 eV was spin-coated on top of ZnO layer by a layer-by-layer solid state ligand exchange process. Electron mobility of ZnO was about 0.1 cm2V-1s-1 as determined from TFT measurements. Power conversion efficiency of solar cells: FTO/ZnO/PbS/Au-Ag was 3.0% under AM1.5 irradiation conditions. The possibility of deposition of ZnO at low temperatures demonstrated herein is of important for solution processed electronic and optoelectronic devices.  Keywords ZnO, low-temperature, quantum dots, solar cells, TFTs References [1] A. Janotti, A. Janotti, C.G. Van De Walle-fundamental of ZnO as a semiconductor, Reports on Progress in Physics, 72 (2009) 126501.[2] H. You, Y. Lin-investigation of the sol-gel method on the flexible ZnO device, International Journal of Electrochemical Science, 7 (2012) 9085–9094.[3] Y. Lin, C. Hsu, M. Tseng, J. Shyue, F. Tsai-stable and high-performance flexible ZnO thin-film transistors by atomic layer deposition, Applied Materials &Interfaces, 7(40) (2015) 22610–22617.[4] C. Lin, S. Tsai, M. Chang-Spontaneous growth by sol-gel process of low temperature ZnO as cathode buffer layer in flexible inverted organic solar cells, Organic Electronics, 46 (2017) 218-255.[5] H. Park, I. Ryu, J. Kim, S. Jeong, S. Yim, S. Jang-PbS quantum dot solar cells integrated with sol−gel-derived ZnO as an n‑type charge-selective layer, Journal of Physical Chemistry C, 118(2014) 17374−17382.[6] Y. Sun, J.H. Seo, C.J. Takacs, J. Seifter, A.J. Heeger-inverted polymer solar cells integrated with a low- temperature-annealed sol-gel-derived ZnO film as an electron transport layer Advanced Materials, 23(2011) 1679–1683.[7] V.A. Online, R. Suriano, C. Bianchi, M. Levi, S. Turri, G. Griffini-the role of sol-gel chemistry in low-temperature formation of ZnO buffer layers for polymer solar cells with improved performance, RSC Advances, 6(2016) 46915-46924.[8] X. D. Mai, J. An, H. Song, J. Jang-inverted Schottky quantum dot solar cells with enhanced carrier extraction and air-stability, Journal of Materials Chemistry A, 2 (2014) 20799–20805.[9] H. Choi, J. Lee, X.D. Mai, M.C. Beard, S.S. Yoon, S. Jeong - supersonically spray-coated colloidal quantum dot ink solar cells, Scientific Report, 7(2017) 622.[10] C.R. Newman, C.D. Frisbie, A. Demetrio, S. Filho, J. Bre- introduction to organic thin film transistors and design of n-channel organic semiconductors, Chemistry Materials, 16(2004) 4436-4451.[11] M. Asad, N. Abdul, Chapter 9: Sol-Gel-Derived Doped ZnO Thin Films: Processing, Properties, and Applications, in Recent Applications in Sol-Gel Synthesis, Edt:C. Usha. InTech, Rijeka, Croatia, 2017. [12] D. Guo, K. Sato, S. Hibino, T. Takeuchi, H. Bessho, K. Kato, Low-temperature preparation of (002)-oriented ZnO thin films by sol–gel method, Thin Solid Films, 550 (2014), 250-258. [13] S. T. Meyers, J. T. Anderson, C. M. Hung, J. Thompson, J. F. Wager, D. A. Keszler, Aqueous Inorganic Inks for Low-Temperature Fabrication of ZnO TFTs, J. Am. Chem. Soc, 130 (2008), 17603-17609.


2021 ◽  
Vol 723 ◽  
pp. 138594
Author(s):  
Qian Zhang ◽  
Cheng Ruan ◽  
Guodong Xia ◽  
Hongyu Gong ◽  
Sumei Wang

2014 ◽  
Vol 55 ◽  
pp. 99-105 ◽  
Author(s):  
Joohye Jung ◽  
Si Joon Kim ◽  
Keun Woo Lee ◽  
Doo Hyun Yoon ◽  
Yeong-gyu Kim ◽  
...  

2011 ◽  
Vol 1287 ◽  
Author(s):  
Anupama Mallikarjunan ◽  
Laura M Matz ◽  
Andrew D Johnson ◽  
Raymond N Vrtis ◽  
Manchao Xiao ◽  
...  

ABSTRACTThe electrical and physical quality of gate and passivation dielectrics significantly impacts the device performance of thin film transistors (TFTs). The passivation dielectric also needs to act as a barrier to protect the TFT device. As low temperature TFT processing becomes a requirement for novel applications and plastic substrates, there is a need for materials innovation that enables high quality plasma enhanced chemical vapor deposition (PECVD) gate dielectric deposition. In this context, this paper discusses structure-property relationships and strategies for precursor development in silicon nitride, silicon oxycarbide (SiOC) and silicon oxide films. Experiments with passivation SiOC films demonstrate the benefit of a superior precursor (LkB-500) and standard process optimization to enable lower temperature depositions. For gate SiO2 deposition (that are used with polysilicon TFTs for example), organosilicon precursors containing different types and amounts of Si, C, O and H bonding were experimentally compared to the industry standard TEOS (tetraethoxysilane) at different process conditions and temperatures. Major differences were identified in film quality especially wet etch rate or WER (correlating to film density) and dielectric constant (k) values (correlating to moisture absorption). Gate quality SiO2 films can be deposited by choosing precursors that can minimize residual Si-OH groups and enable higher density stable moisture-free films. For e.g., the optimized precursor AP-LTO® 770 is clearly better than TEOS for low temperature PECVD depositions based on density, WER, k charge density (measured by flatband voltage or Vfb); and leakage and breakdown voltage (Vbd) measurements. The design and development of such novel precursors is a key factor to successfully enable manufacturing of advanced low temperature processed devices.


ACS Omega ◽  
2017 ◽  
Vol 2 (10) ◽  
pp. 6968-6974 ◽  
Author(s):  
Clemente G. Alvarado-Beltrán ◽  
Jorge L. Almaral-Sánchez ◽  
Israel Mejia ◽  
Manuel A. Quevedo-López ◽  
Rafael Ramirez-Bon

2011 ◽  
Vol 326 (1) ◽  
pp. 23-27 ◽  
Author(s):  
Keunkyu Song ◽  
Chang Young Koo ◽  
Taehwan Jun ◽  
Daehee Lee ◽  
Youngmin Jeong ◽  
...  

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