Ambient atmosphere-processable, printable Cu electrodes for flexible device applications: structural welding on a millisecond timescale of surface oxide-free Cu nanoparticles

Nanoscale ◽  
2015 ◽  
Vol 7 (9) ◽  
pp. 3997-4004 ◽  
Author(s):  
Sang-Jin Oh ◽  
Yejin Jo ◽  
Eun Jung Lee ◽  
Sun Sook Lee ◽  
Young Hun Kang ◽  
...  
Keyword(s):  
Surface Oxide ◽  
Ambient Atmosphere ◽  
Cu Nanoparticles ◽  
Flexible Device ◽  
Device Applications ◽  
Cu Nanoparticle ◽  
Paper Substrates

We demonstrate Cu nanoparticle-derived printed conductive structures on plastic and paper substrates in air.

scholarly journals The improvement of CoZrTaB thin films on different substrates for flexible device applications

AIP Advances ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 025139
Author(s):  
Yanze Wu ◽  
I-Chen Yeng ◽  
Hongbin Yu
Keyword(s):  
Thin Films ◽  
Flexible Device ◽  
Device Applications

Phosphine ligand-coated Cu nanoparticle-catalyzed selective semihydrogenation of alkynes: electronic or hindrance effects of the ligand?

2020 ◽  
Vol 22 (29) ◽  
pp. 16905-16913
Author(s):  
Yafei Luo ◽  
Zheng Huang ◽  
Zhongzhu Chen ◽  
Zhigang Xu ◽  
Jianping Hu ◽  
...  
Keyword(s):  
Phosphine Ligand ◽  
Phosphine Ligands ◽  
Cu Nanoparticles ◽  
Cu Nanoparticle

The alkyne semihydrogenation catalyzed via phosphine ligands-coated Cu nanoparticles is explored in detail. The results indicate that the hindrance effect of ligand is favorable for improving the semihydrogenation selectivity of catalyst.

Molecular Dynamics Simulations of Diffusion of O2 and N2 Penetrants in Polydimethylsiloxane-Based Nanocomposites

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Douglas E. Spearot ◽  
Alex Sudibjo ◽  
Varun Ullal ◽  
Adam Huang
Keyword(s):  
Molecular Dynamics ◽  
Polymer Composites ◽  
Diffusion Coefficients ◽  
Metal Particle ◽  
Interatomic Potential ◽  
Md Simulations ◽  
Coarse Grained ◽  
Cu Nanoparticles ◽  
Cu Nanoparticle ◽  
Nanoparticle Inclusions

Recently, metal particle polymer composites have been proposed as sensing materials for micro corrosion sensors. To design the sensors, a detailed understanding of diffusion through metal particle polymer composites is necessary. Accordingly, in this work molecular dynamics (MD) simulations are used to study the diffusion of O2 and N2 penetrants in metal particle polymer nanocomposites composed of an uncross-linked polydimethylsiloxane (PDMS) matrix with Cu nanoparticle inclusions. PDMS is modeled using a hybrid interatomic potential with explicit treatment of Si and O atoms along the chain backbone and coarse-grained methyl side groups. In most models examined in this work, MD simulations show that diffusion coefficients of O2 and N2 molecules in PDMS-based nanocomposites are lower than that in pure PDMS. Nanoparticle inclusions act primarily as geometric obstacles for the diffusion of atmospheric penetrants, reducing the available porosity necessary for diffusion, with instances of O2 and N2 molecule trapping also observed at or near the PDMS/Cu nanoparticle interfaces. In models with the smallest gap between Cu nanoparticles, MD simulations show that O2 and N2 diffusion coefficients are higher than that in pure PDMS at the lowest temperatures studied. This is due to PDMS chain confinement at low temperatures in the presence of the Cu nanoparticles, which induces low-density regions within the PDMS matrix. MD simulations show that the role of temperature on diffusion can be modeled using the Williams–Landel–Ferry equation, with parameters influenced by nanoparticle content and spacing.

(Invited) Low-Temperature Processed InGaZnO MES-FET for Flexible Device Applications

2017 ◽  
Vol 79 (1) ◽  
pp. 43-48 ◽  
Author(s):  
Mamoru Furuta ◽  
Yusaku Magari ◽  
Shinsuke Hashimoto ◽  
Kenichiro Hamada
Keyword(s):  
Low Temperature ◽  
Flexible Device ◽  
Device Applications

Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology

2020 ◽  
Vol 2020 (1) ◽  
pp. 000113-000118
Author(s):  
Eiji Nakamura ◽  
Toyohiro Aoki ◽  
Ryota Yamaguchi ◽  
Nobuhiro Sekine ◽  
Kuniaki Sueoka ◽  
...  
Keyword(s):  
Cross Sections ◽  
Molten Solder ◽  
The Novel ◽  
Cu Nanoparticles ◽  
Shear Testing ◽  
Injection Molded ◽  
Sintering Conditions ◽  
Cu Nanoparticle

Abstract We have previously developed a novel plating-free bumping process using Cu nanopaste and Injection Molded Solder (IMS) technology. In the present study, we investigated the further detail about the microstructural and mechanical properties of sintered Cu nanoparticles formed into a pillar shape. By analyzing cross-sections of Cu nanoparticle pillars sintered in various conditions, we clarified how the sintering conditions affect the microstructural features, including the size and numbers of Cu grains and voids inside sintered Cu nanoparticles. In addition, we conducted the shear testing for the obtained Cu pillars to evaluate relationships between the mechanical strength and the microstructural features. We found that the results of the shear testing were consistent with the microstructural features of the sintered Cu nanoparticles. Finally, we injected molten solder onto the Cu nanoparticle pillars to evaluate the overall feasibility of the developed process. It was confirmed that the molten solder injected by IMS process has good wettability against the sintered Cu nanoparticles, which resulted in the successful bump formation without solder missing. In addition, The IMC layer between the sintered Cu nanoparticles and injected solder was formed well. These results proved the quality of microbumps fabricated by the novel bumping process using Cu nanopaste and IMS.

Mechanical properties of ZnO thin films deposited on polyester substrates used in flexible device applications

2010 ◽  
Vol 519 (1) ◽  
pp. 325-330 ◽  
Author(s):  
Konstantinos A. Sierros ◽  
Derrick A. Banerjee ◽  
Nicholas J. Morris ◽  
Darran R. Cairns ◽  
Ioannis Kortidis ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Zno Thin Films ◽  
Flexible Device ◽  
Device Applications
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