Polyhedral oligomeric silsesquioxane nanocomposites exhibiting ultra-low dielectric constants through POSS orientation into lamellar structures

2009 ◽  
Vol 19 (22) ◽  
pp. 3643 ◽  
Author(s):  
Ying-Ling Liu ◽  
Meng-Han Fangchiang
Keyword(s):  
Polyhedral Oligomeric Silsesquioxane ◽  
Dielectric Constants ◽  
Lamellar Structures ◽  
Low Dielectric ◽  
Oligomeric Silsesquioxane

Polyhedral Oligomeric Silsesquioxane (POSS)-Modified Thermoplastic and Thermosetting Nanocomposites: A Review

2008 ◽  
Vol 16 (8) ◽  
pp. 483-500 ◽  
Author(s):  
Jianqing Zhao ◽  
Yi Fu ◽  
Shumei Liu
Keyword(s):  
Processing Condition ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Physical And Mechanical Properties ◽  
Molecular Geometry ◽  
Surface Hydrophobicity ◽  
Dielectric Constants ◽  
Great Promise ◽  
Wide Range ◽  
Oligomeric Silsesquioxane ◽  
Mechanical Strengths

Polyhedral oligomeric silsesquioxane (POSS) nanoparticles have been successfully incorporated into thermoplastic and thermoset polymers via copolymerization, grafting, blending, surface bonding, or other transformations. A great promise in the development of a wide range of POSS-containing nanocomposites with diversely improved properties has been displayed. Thermal properties, viscoelastic properties, mechanical strengths, dielectric constants, surface hydrophobicity and flame-retardancy of the nanocomposites are easily varied to target properties by adjusting POSS structure, crosslink density, processing condition, etc. Investigations on the effects of POSS molecular geometry, composition, and concentration on physical and mechanical properties of resultant POSS-modified thermoplastic and thermosetting nanocomposites have been carefully reviewed in this article.

scholarly journals Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

Polymers ◽  
2018 ◽  
Vol 11 (1) ◽  
pp. 26 ◽  
Author(s):  
Mohamed Mohamed ◽  
Shiao Kuo
Keyword(s):  
Mechanical Characteristics ◽  
Chemical Resistance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Surface Hydrophobicity ◽  
Low Dielectric Constant ◽  
Hybrid Nanocomposite ◽  
Low Dielectric ◽  
Redox Stability ◽  
Oligomeric Silsesquioxane ◽  
Physical Blending

The preparation of hybrid nanocomposite materials derived from polyhedral oligomeric silsesquioxane (POSS) nanoparticles and polyimide (PI) has recently attracted much attention from both academia and industry, because such materials can display low water absorption, high thermal stability, good mechanical characteristics, low dielectric constant, flame retardance, chemical resistance, thermo-redox stability, surface hydrophobicity, and excellent electrical properties. Herein, we discussed the various methods that have been used to insert POSS nanoparticles into PI matrices, through covalent chemical bonding and physical blending, as well as the influence of the POSS units on the physical properties of the PIs.

Toughening of cyanate resin with low dielectric constant by glycidyl polyhedral oligomeric silsesquioxane

2016 ◽  
Vol 29 (4) ◽  
pp. 458-466 ◽  
Author(s):  
Jian Jiao ◽  
Li-zhen Zhao ◽  
Yu Xia ◽  
Lei Wang
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Low Dielectric Constant ◽  
Curing Agent ◽  
Melt Blending ◽  
Elongation At Break ◽  
Low Dielectric ◽  
Oligomeric Silsesquioxane ◽  
Scanning Electron

In this article, a high-performance hybrid material was prepared by melt blending from glycidyl polyhedral oligomeric silsesquioxane (G-POSS) and bisphenol-A cyanate ester (CE), using triethylamine as the curing agent. The structure of the hybrid was characterized by Fourier transform infrared spectroscopy and scanning electron microscopy (SEM), and the transparency properties, mechanical properties, dielectric properties, thermal performance, and wet fastness were studied. The results showed that G-POSS was uniformly distributed in the CE matrix and could obviously accelerate the curing reaction of the resin. Large amounts of corrugated and scaled structures were observed on the fractures of G-POSS/CE by the SEM photos. When the G-POSS content increased to 7 phr, the tensile strength (75.45 MPa), elongation at break (3.19%), and impact strength (23.76 kJ m−2) reached maximum values, representing increases of 21.75%, 27.6%, and 157.98% relative to that of pure CE, respectively, which indicated that the addition of G-POSS can significantly improve the toughness of G-POSS/CE composites. When the G-POSS content increased to 4 phr, the dielectric constant decreased from 3.27 to the minimum value of 3.05. The heat resistance and wet fastness of G-POSS/CE hybrid materials decreased with increasing G-POSS content.

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