Polyimide-Side-Chain Tethered Polyhedral Oligomeric Silsesquioxane Nanocomposites for Low-Dielectric Film Applications

2003 ◽  
Vol 15 (19) ◽  
pp. 3721-3727 ◽  
Author(s):  
Chyi-Ming Leu ◽  
Yao-Te Chang ◽  
Kung-Hwa Wei
Keyword(s):  
Dielectric Film ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Side Chain ◽  
Low Dielectric ◽  
Oligomeric Silsesquioxane

scholarly journals Functional Polyimide/Polyhedral Oligomeric Silsesquioxane Nanocomposites

Polymers ◽  
2018 ◽  
Vol 11 (1) ◽  
pp. 26 ◽  
Author(s):  
Mohamed Mohamed ◽  
Shiao Kuo
Keyword(s):  
Mechanical Characteristics ◽  
Chemical Resistance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Surface Hydrophobicity ◽  
Low Dielectric Constant ◽  
Hybrid Nanocomposite ◽  
Low Dielectric ◽  
Redox Stability ◽  
Oligomeric Silsesquioxane ◽  
Physical Blending

The preparation of hybrid nanocomposite materials derived from polyhedral oligomeric silsesquioxane (POSS) nanoparticles and polyimide (PI) has recently attracted much attention from both academia and industry, because such materials can display low water absorption, high thermal stability, good mechanical characteristics, low dielectric constant, flame retardance, chemical resistance, thermo-redox stability, surface hydrophobicity, and excellent electrical properties. Herein, we discussed the various methods that have been used to insert POSS nanoparticles into PI matrices, through covalent chemical bonding and physical blending, as well as the influence of the POSS units on the physical properties of the PIs.

Toughening of cyanate resin with low dielectric constant by glycidyl polyhedral oligomeric silsesquioxane

2016 ◽  
Vol 29 (4) ◽  
pp. 458-466 ◽  
Author(s):  
Jian Jiao ◽  
Li-zhen Zhao ◽  
Yu Xia ◽  
Lei Wang
Keyword(s):  
Dielectric Constant ◽  
High Performance ◽  
Polyhedral Oligomeric Silsesquioxane ◽  
Low Dielectric Constant ◽  
Curing Agent ◽  
Melt Blending ◽  
Elongation At Break ◽  
Low Dielectric ◽  
Oligomeric Silsesquioxane ◽  
Scanning Electron

In this article, a high-performance hybrid material was prepared by melt blending from glycidyl polyhedral oligomeric silsesquioxane (G-POSS) and bisphenol-A cyanate ester (CE), using triethylamine as the curing agent. The structure of the hybrid was characterized by Fourier transform infrared spectroscopy and scanning electron microscopy (SEM), and the transparency properties, mechanical properties, dielectric properties, thermal performance, and wet fastness were studied. The results showed that G-POSS was uniformly distributed in the CE matrix and could obviously accelerate the curing reaction of the resin. Large amounts of corrugated and scaled structures were observed on the fractures of G-POSS/CE by the SEM photos. When the G-POSS content increased to 7 phr, the tensile strength (75.45 MPa), elongation at break (3.19%), and impact strength (23.76 kJ m−2) reached maximum values, representing increases of 21.75%, 27.6%, and 157.98% relative to that of pure CE, respectively, which indicated that the addition of G-POSS can significantly improve the toughness of G-POSS/CE composites. When the G-POSS content increased to 4 phr, the dielectric constant decreased from 3.27 to the minimum value of 3.05. The heat resistance and wet fastness of G-POSS/CE hybrid materials decreased with increasing G-POSS content.

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