Nucleation and growth of atomic layer deposition of HfO2 gate dielectric layers on silicon oxide: a multiscale modelling investigation

2009 ◽  
Vol 11 (19) ◽  
pp. 3701 ◽  
Author(s):  
A. Dkhissi ◽  
G. Mazaleyrat ◽  
A. Estève ◽  
M. Djafari Rouhani
2007 ◽  
Vol 25 (4) ◽  
pp. 1302-1308 ◽  
Author(s):  
Annelies Delabie ◽  
Geoffrey Pourtois ◽  
Matty Caymax ◽  
Stefan De Gendt ◽  
Lars-Åke Ragnarsson ◽  
...  

2019 ◽  
Vol 11 (7) ◽  
pp. 227-241 ◽  
Author(s):  
Annelies Delabie ◽  
Laura Nyns ◽  
Florence Bellenger ◽  
Matty Caymax ◽  
Thierry Conard ◽  
...  

2014 ◽  
Vol 118 (31) ◽  
pp. 17655-17661 ◽  
Author(s):  
Sicelo S. Masango ◽  
Lingxuan Peng ◽  
Laurence D. Marks ◽  
Richard P. Van Duyne ◽  
Peter C. Stair

2018 ◽  
Vol 924 ◽  
pp. 490-493 ◽  
Author(s):  
Muhammad I. Idris ◽  
Nick G. Wright ◽  
Alton B. Horsfall

3-Dimensional 4H-SiC metal-oxide-semiconductor capacitors have been fabricated to determine the effect of the sidewall on the characteristics of 3-Dimentional gate structures. Al2O3 deposited by Atomic Layer Deposition (ALD) was used as the gate dielectric layer on the trench structure. The 3-D MOS capacitors exhibit increasing accumulation capacitance with excellent linearity as the sidewall area increases, indicating that ALD results in a highly conformal dielectric film. The capacitance – voltage characteristics also show evidence of a second flatband voltage, located at a higher bias than that seen for purely planar devices on the same sample. We also observe that the oxide capacitance of planar and 3-D MOS capacitors increases with temperature. Finally, we have found that the 3-D MOS capacitor has a weaker temperature dependence of flatband voltage in comparison to the conventional planar MOS capacitor due to the incorporation of the (1120) plane in the sidewall.


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