An unprecedented two-fold interpenetrated heterometallic 4664 network constructed by five-connected copper metal nodes

2001 ◽  
pp. 1064-1065 ◽  
Author(s):  
Long Pan ◽  
Nancy Ching ◽  
Xiaoying Huang ◽  
Jing Li
Keyword(s):  
Copper Metal

Penggunaan Limbah Logam Tembaga yang Didaur Ulang untuk Antibakteri dan Degradasi Metil Merah Secara Fotolisis

2019 ◽  
Vol 4 (1) ◽  
pp. 15
Author(s):  
Ariyetti Ariyetti ◽  
Muhammad Nasir ◽  
Safni Safni ◽  
Syukri Darajat
Keyword(s):  
Escherichia Coli ◽  
Staphylococcus Aureus ◽  
Silver Nitrate ◽  
Copper Sulfate ◽  
Bacterial Growth ◽  
Methyl Red ◽  
Copper Metal ◽  
Sulfate Hydrate ◽  
Red Dye ◽  
And Staphylococcus Aureus

<p><em>Metil merah merupakan salah satu zat warna golongan azo yang sering digunakan dalam industri dan laboratorium. Penggunaan metil merah dapat menimbulkan efek terhadap kesehatan dan lingkungan. Oleh sebab itu dilakukan metode fotodegradasi dengan menggunakan semikonduktor dan radiasi sinar tampak. Semikonduktor yang digunakan yaitu berbahan dasar tembaga sulfat hidrat dan perak nitrat. Prekusor tembaga sulfat hidrat dibuat dari pengolahan limbah logam tembaga hasil pemotongan tembaga yang ada di bengkel Lembaga Ilmu Pengetahuan Indonesia (LIPI) Bandung. Bahan semikonduktor juga memiliki kemampuan dalam menghambat pertumbuhan bakteri. Hasil optimum yang didapatkan dalam proses fotodegradasi dan antibakteri merupakan gabungan antara kedua prekusor tembaga sulfat hidrat dan perak nitrat dengan bantuan penyinaran. Kemampuan dalam menghambat pertumbuhan bakteri didapatkan persentase kematian 100 % untuk masing-masing bakteri, yaitu Escherichia coli dan Staphylococcus aureus. Aktifitas fotokatalitiknya dengan konsentrasi semikonduktor 10 ppm untuk mendegradasi zat warna metil merah 5 ppm, selama 23 jam, dimana persentase degradasi yang didapatkan dengan penyinaran lebih tinggi dibandingkan dengan tanpa penyinaran. Pengaruh pH larutan terhadap degradasi metil merah yaitu optimum pada pH 12 (basa).</em></p><p><em><br /></em></p><p><em>Methyl red is one of the azo group dyes that is often used in industry and laboratories. The use of methyl red can have an effect on health and the environment. Therefore photodegradation method is done by using semiconductor and visible light radiation. The semiconductor used is based on copper sulfate hydrate and silver nitrate. The copper sulphate hydrate precursor is made from the processing of copper-cut copper metal waste in the workshop of the Indonesian Institute of Sciences (LIPI) in Bandung. Semiconductor materials also have the ability to inhibit bacterial growth. The optimum results obtained in the photodegradation and antibacterial process are a combination of both copper sulfate hydrate precursor and silver nitrate with the help of irradiation. The ability to inhibit bacterial growth obtained 100% mortality for each bacterium, namely Escherichia coli and Staphylococcus aureus. Photocatalytic activity with 10 ppm semiconductor concentration to degrade methyl red dye 5 ppm, for 23 hours, where the percentage of degradation obtained by irradiation is higher than without irradiation. The effect of pH of the solution on the degradation of methyl red is optimum at pH 12 (base).</em></p>

Hyperfine Interactions in Copper Sites of Dielectric and Superconducting Copper Metal Oxides

2020 ◽  
Vol 46 (11) ◽  
pp. 1100-1102
Author(s):  
E. I. Terukov ◽  
A. V. Marchenko ◽  
A. A. Luzhkov ◽  
P. P. Seregin ◽  
K. B. Shakhovich
Keyword(s):  
Metal Oxides ◽  
Hyperfine Interactions ◽  
Copper Metal ◽  
Copper Sites

scholarly journals Electroplated Copper Metal Contacts on Perovskite Solar Cells

Solar RRL ◽  
2021 ◽  
Author(s):  
Thibaud Hatt ◽  
Özde Ş. Kabakli ◽  
Patricia S. C. Schulze ◽  
Armin Richter ◽  
Stefan W. Glunz ◽  
...  
Keyword(s):  
Solar Cells ◽  
Perovskite Solar Cells ◽  
Metal Contacts ◽  
Copper Metal ◽  
Electroplated Copper

scholarly journals Effect of Copper Addition on the AlCoCrFeNi High Entropy Alloys Properties via the Electroless Plating and Powder Metallurgy Technique

Crystals ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 540
Author(s):  
Mohamed Ali Hassan ◽  
Hossam M. Yehia ◽  
Ahmed S. A. Mohamed ◽  
Ahmed Essa El-Nikhaily ◽  
Omayma A. Elkady
Keyword(s):  
Compressive Strength ◽  
Powder Metallurgy ◽  
Atomic Radius ◽  
The Other ◽  
High Entropy Alloy ◽  
Coating Process ◽  
High Entropy Alloys ◽  
Powder Metallurgy Technique ◽  
Copper Metal ◽  
High Entropy

To improve the AlCoCrFeNi high entropy alloys’ (HEAs’) toughness, it was coated with different amounts of Cu then fabricated by the powder metallurgy technique. Mechanical alloying of equiatomic AlCoCrFeNi HEAs for 25 h preceded the coating process. The established powder samples were sintered at different temperatures in a vacuum furnace. The HEAs samples sintered at 950˚C exhibit the highest relative density. The AlCoCrFeNi HEAs model sample was not successfully produced by the applied method due to the low melting point of aluminum. The Al element’s problem disappeared due to encapsulating it with a copper layer during the coating process. Because the atomic radius of the copper metal (0.1278 nm) is less than the atomic radius of the aluminum metal (0.1431 nm) and nearly equal to the rest of the other elements (Co, Cr, Fe, and Ni), the crystal size powder and fabricated samples decreased by increasing the content of the Cu wt%. On the other hand, the lattice strain increased. The microstructure revealed that the complete diffusion between the different elements to form high entropy alloy material was not achieved. A dramatic decrease in the produced samples’ hardness was observed where it decreased from 403 HV at 5 wt% Cu to 191 HV at 20 wt% Cu. On the contrary, the compressive strength increased from 400.034 MPa at 5 wt% Cu to 599.527 MPa at 15 wt% Cu with a 49.86% increment. This increment in the compressive strength may be due to precipitating the copper metal on the particles’ surface in the nano-size, reducing the dislocations’ motion, increasing the stiffness of produced materials. The formability and toughness of the fabricated materials improved by increasing the copper’s content. The thermal expansion has increased gradually by increasing the Cu wt%.

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