Low-temperature oxygenation of methane into formic acid with molecular oxygen in the presence of hydrogen catalysed by Pd0.08Cs2.5H1.34PVMo11O4 0

1997 ◽  
pp. 1295-1296 ◽  
Author(s):  
Noritaka Mizuno ◽  
Hiromi Ishige ◽  
Yasuhiro Seki ◽  
Makoto Misono ◽  
Don-Jin Suh ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Molecular Oxygen

scholarly journals Resin-supported iridium complex for low-temperature vanillin hydrogenation using formic acid in water

RSC Advances ◽  
2021 ◽  
Vol 11 (26) ◽  
pp. 15835-15840
Author(s):  
Christene A. Smith ◽  
Francesco Brandi ◽  
Majd Al-Naji ◽  
Ryan Guterman
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Iridium Complex ◽  
Molecular Catalysis

Solid-supported molecular catalysis for biorefinery. Hydrogenation using formic acid in water at low temperature.

scholarly journals Crystallization and preliminary X-ray characterization of the 2,4′-dihydroxyacetophenone dioxygenase fromAlcaligenessp. 4HAP

2014 ◽  
Vol 70 (6) ◽  
pp. 823-826 ◽  
Author(s):  
G. Beaven ◽  
A. Bowyer ◽  
P. Erskine ◽  
S. P. Wood ◽  
A. McCoy ◽  
...  
Keyword(s):  
Synchrotron Radiation ◽  
Formic Acid ◽  
Molecular Oxygen ◽  
Aromatic Ring ◽  
Bond Cleavage ◽  
Its Sequence ◽  
Hydroxybenzoic Acid ◽  
X Ray

The enzyme 2,4′-dihydroxyacetophenone dioxygenase (or DAD) catalyses the conversion of 2,4′-dihydroxyacetophenone to 4-hydroxybenzoic acid and formic acid with the incorporation of molecular oxygen. Whilst the vast majority of dioxygenases cleave within the aromatic ring of the substrate, DAD is very unusual in that it is involved in C—C bond cleavage in a substituent of the aromatic ring. There is evidence that the enzyme is a homotetramer of 20.3 kDa subunits each containing nonhaem iron and its sequence suggests that it belongs to the cupin family of dioxygenases. By the use of limited chymotrypsinolysis, the DAD enzyme fromAlcaligenessp. 4HAP has been crystallized in a form that diffracts synchrotron radiation to a resolution of 2.2 Å.

A theoretical kinetics study on low-temperature reactions of methyl acetate radicals with molecular oxygen

2018 ◽  
Vol 196 ◽  
pp. 45-53 ◽  
Author(s):  
Qinghui Meng ◽  
Xudong Zhao ◽  
Lidong Zhang ◽  
Peng Zhang ◽  
Liusi Sheng
Keyword(s):  
Low Temperature ◽  
Molecular Oxygen ◽  
Methyl Acetate ◽  
Kinetics Study

scholarly journals A low temperature aqueous formate fuel cell using cobalt hexacyanoferrate as a non-noble metal oxidation catalyst

2020 ◽  
Vol 4 (12) ◽  
pp. 6227-6233
Author(s):  
Lijuan Han ◽  
Jesús González-Cobos ◽  
Irene Sánchez-Molina ◽  
Stefano Giancola ◽  
Scott J. Folkman ◽  
...  
Keyword(s):  
Fuel Cell ◽  
Low Temperature ◽  
Formic Acid ◽  
Prussian Blue ◽  
Formic Acid Oxidation ◽  
Oxidation Catalyst ◽  
Acid Oxidation ◽  
Metal Oxidation ◽  
Metal Free ◽  
Cobalt Hexacyanoferrate

Prussian blue is applied as the anode in the first reported metal-free fuel cell for formic acid oxidation.

Effective low-temperature hydrogenolysis of lignin using carbon-supported ruthenium and formic acid as reducing agent

2019 ◽  
Vol 126 ◽  
pp. 30-34 ◽  
Author(s):  
Weisheng Yang ◽  
Xiang Li ◽  
Xu Du ◽  
Yulin Deng ◽  
Hongqi Dai
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Reducing Agent

scholarly journals High Pressure/Low Temperature Polymorphism in 2,6-Dimethylpyridine–Formic Acid Cocrystals

2017 ◽  
Vol 17 (4) ◽  
pp. 1647-1653 ◽  
Author(s):  
Rachael Lee ◽  
Dmitry S. Yufit ◽  
Michael R. Probert ◽  
Jonathan W. Steed
Keyword(s):  
High Pressure ◽  
Low Temperature ◽  
Formic Acid

scholarly journals Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

Metals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 315 ◽  
Author(s):  
Liangliang He ◽  
Junlong Li ◽  
Xin Wu ◽  
Fengwen Mu ◽  
Yinghui Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Material Selection ◽  
Structure Design ◽  
Acid Vapor ◽  
Higher Temperature ◽  
Cu Bonding ◽  
Bonding Method ◽  
Sintered Ag ◽  
Pt Catalyzed

With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 °C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag2O microparticles. The Cu oxide layer at the interface after bonding can be eliminated, which improves the bond strength and electrical conductivity of the joint. A metallic bond contact between the sintered Ag and the Cu substrate is obtained without interfacial solid solution and intermetallic phases, and the shear strength is comparable to previous bonding at a higher temperature. The bonding mechanisms were figured out by comparing the bonding with and without the Pt-catalyzed formic acid vapor. This ultra-low temperature Ag-Cu bonding method may create more flexibilities in the structure design and material selection for power device integration.

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