Effective low-temperature hydrogenolysis of lignin using carbon-supported ruthenium and formic acid as reducing agent

2019 ◽  
Vol 126 ◽  
pp. 30-34 ◽  
Author(s):  
Weisheng Yang ◽  
Xiang Li ◽  
Xu Du ◽  
Yulin Deng ◽  
Hongqi Dai
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Reducing Agent

Photochemical and Electrochemical Reduction of Carbon Dioxide Catalyzed by a Polyoxometalate-Organic Photosensitizer Complex

2018 ◽  
Author(s):  
Chandan Dey ◽  
Ronny Neumann
Keyword(s):  
Carbon Dioxide ◽  
Cyclic Voltammetry ◽  
Formic Acid ◽  
Electrochemical Reduction ◽  
Mass Spectroscopy ◽  
Photochemical Reactions ◽  
Reducing Agent ◽  
Covalent Attachment ◽  
Hybrid Complex ◽  
Open Face

<p>A manganese substituted Anderson type polyoxometalate, [MnMo<sub>6</sub>O<sub>24</sub>]<sup>9-</sup>, tethered with an anthracene photosensitizer was prepared and used as catalyst for CO<sub>2</sub> reduction. The polyoxometalate-photosensitizer hybrid complex, obtained by covalent attachment of the sensitizer to only one face of the planar polyoxometalate, was characterized by NMR, IR and mass spectroscopy. Cyclic voltammetry measurements show a catalytic response for the reduction of carbon dioxide, thereby suggesting catalysis at the manganese site on the open face of the polyoxometalate. Controlled potentiometric electrolysis showed the reduction of CO<sub>2</sub> to CO with a TOF of ~15 sec<sup>-1</sup>. Further photochemical reactions showed that the polyoxometalate-anthracene hybrid complex was active for the reduction of CO<sub>2</sub> to yield formic acid and/or CO in varying amounts dependent on the reducing agent used. Control experiments showed that the attachment of the photosensitizer to [MnMo<sub>6</sub>O<sub>24</sub>]<sup>9-</sup> is necessary for photocatalysis.</p><div><br></div>

scholarly journals Resin-supported iridium complex for low-temperature vanillin hydrogenation using formic acid in water

RSC Advances ◽  
2021 ◽  
Vol 11 (26) ◽  
pp. 15835-15840
Author(s):  
Christene A. Smith ◽  
Francesco Brandi ◽  
Majd Al-Naji ◽  
Ryan Guterman
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Iridium Complex ◽  
Molecular Catalysis

Solid-supported molecular catalysis for biorefinery. Hydrogenation using formic acid in water at low temperature.

scholarly journals A low temperature aqueous formate fuel cell using cobalt hexacyanoferrate as a non-noble metal oxidation catalyst

2020 ◽  
Vol 4 (12) ◽  
pp. 6227-6233
Author(s):  
Lijuan Han ◽  
Jesús González-Cobos ◽  
Irene Sánchez-Molina ◽  
Stefano Giancola ◽  
Scott J. Folkman ◽  
...  
Keyword(s):  
Fuel Cell ◽  
Low Temperature ◽  
Formic Acid ◽  
Prussian Blue ◽  
Formic Acid Oxidation ◽  
Oxidation Catalyst ◽  
Acid Oxidation ◽  
Metal Oxidation ◽  
Metal Free ◽  
Cobalt Hexacyanoferrate

Prussian blue is applied as the anode in the first reported metal-free fuel cell for formic acid oxidation.

scholarly journals High Pressure/Low Temperature Polymorphism in 2,6-Dimethylpyridine–Formic Acid Cocrystals

2017 ◽  
Vol 17 (4) ◽  
pp. 1647-1653 ◽  
Author(s):  
Rachael Lee ◽  
Dmitry S. Yufit ◽  
Michael R. Probert ◽  
Jonathan W. Steed
Keyword(s):  
High Pressure ◽  
Low Temperature ◽  
Formic Acid

scholarly journals Robust Ag-Cu Sintering Bonding at 160 °C via Combining Ag2O Microparticle Paste and Pt-Catalyzed Formic Acid Vapor

Metals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 315 ◽  
Author(s):  
Liangliang He ◽  
Junlong Li ◽  
Xin Wu ◽  
Fengwen Mu ◽  
Yinghui Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Formic Acid ◽  
Material Selection ◽  
Structure Design ◽  
Acid Vapor ◽  
Higher Temperature ◽  
Cu Bonding ◽  
Bonding Method ◽  
Sintered Ag ◽  
Pt Catalyzed

With the assistance of Pt-catalyzed formic acid vapor, robust Ag-Cu bonding was realized at an ultra-low temperature of 160 °C under 3 MPa for 30 min via the sintering of Ag nanoparticles in situ generated from Ag2O microparticles. The Cu oxide layer at the interface after bonding can be eliminated, which improves the bond strength and electrical conductivity of the joint. A metallic bond contact between the sintered Ag and the Cu substrate is obtained without interfacial solid solution and intermetallic phases, and the shear strength is comparable to previous bonding at a higher temperature. The bonding mechanisms were figured out by comparing the bonding with and without the Pt-catalyzed formic acid vapor. This ultra-low temperature Ag-Cu bonding method may create more flexibilities in the structure design and material selection for power device integration.

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