Dielectric Loss in Polyethylene Terephthalate below Glass Transition Temperature

1971 ◽  
Vol 230 (10) ◽  
pp. 46-47 ◽  
Author(s):  
BAY-SUNG HSU ◽  
SIK-HUNG KWAN
Keyword(s):  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Dielectric Loss ◽  
Polyethylene Terephthalate

scholarly journals Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Crystals ◽  
2020 ◽  
Vol 10 (3) ◽  
pp. 173
Author(s):  
Panpan Zhang ◽  
Ke Zhang ◽  
Shuliang Dou ◽  
Jiupeng Zhao ◽  
Xiangqiao Yan ◽  
...  
Keyword(s):  
Dielectric Constant ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Dielectric Loss ◽  
Breakdown Strength ◽  
Electric Breakdown ◽  
Practical Applications ◽  
The One ◽  
In Virtue Of

Several kinds of polyimide (PI) films stemmed out of 4, 4’–diaminodiphenyl ether, as well as various structurally various aromatic dianhydride, were prepared. The films’ mechanical, dielectric, and dynamic mechanical attributes were put under investigation. According the findings, the PI films’ performance is significantly different as a result of their diverse structure. PI’s dielectric constant and dielectric loss tangent of abides by the increasing order below: PMDA-PI>BTDA-PI>BPDA-PI. Moreover, the electric breakdown strength of BTDA-PI (478.90 kV/mm) presents a lot higher value compared to the one PMDA-PI (326.80 kV/mm) and BPDA-PI (357.07 kV/mm). In particular, BTDA-PI film possesses high electric breakdown strength about 478.90 kV/mm. In addition, PI’s glass transition temperature (Tg) are, respectively, 276 °C (BTDA-PI), and 290 °C (BPDA-PI), as well as 302 °C (PMDA-PI). Therefore, in virtue of their various structures and performances, practical applications of PI films can exert significant role in the electronics and microelectronics industries.

scholarly journals The Influence of Physical Fields on the Thermal or Dielectric Properties of Epoxy Composites

2016 ◽  
Vol 17 (4) ◽  
pp. 533-538
Author(s):  
Y.V. Bardadym ◽  
V.O. Vilensky
Keyword(s):  
Activation Energy ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Dielectric Loss ◽  
Topological Structure ◽  
Three Dimensional ◽  
External Factors ◽  
Structure Changes ◽  
Physical Fields

The latest developments in the field of materials to improve the physical and chemical properties is the use of physical modification of polymeric materials. The specimens of polyepoxy and composites on the base metal oxides CdO, PbO, Cr2O3 have been studied by methods of thermal and dielectric analysis. Blending physical fields during curing samples stimulates reduction of activation energy, but also contributes to the glass transition temperature and confirms the conclusion set conformational change in the interstitial fragments forming a grid Chemical oxirane polymers under the influence of external physical fields. Differences tanhesa dielectric loss determined topological structure changes due to the influence of external factors on the reaction polipryyednannya and forming a three-dimensional grid. Blending physical fields during curing samples stimulates reduction of activation energy, but also contributes to the glass transition temperature and confirms the conclusion set conformational change in the interstitial fragments forming a grid Chemical oxirane polymers under the influence of external physical fields. Differences tangents dielectric loss determined topological structure changes due to the influence of external factors on the reaction polyaddition and forming a three-dimensional grid.

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