Dipolarization Fronts: Tangential Discontinuities? On the Spatial Range of Validity of the MHD Jump Conditions

2019 ◽  
Vol 124 (12) ◽  
pp. 9963-9975 ◽  
Author(s):  
D. Schmid ◽  
M. Volwerk ◽  
F. Plaschke ◽  
R. Nakamura ◽  
W. Baumjohann ◽  
...  
Keyword(s):  
Jump Conditions ◽  
Spatial Range ◽  
Tangential Discontinuities

scholarly journals Kinetic Models of Tangential Discontinuities in the Solar Wind

2020 ◽  
Vol 891 (1) ◽  
pp. 86 ◽  
Author(s):  
T. Neukirch ◽  
I. Y. Vasko ◽  
A. V. Artemyev ◽  
O. Allanson
Keyword(s):  
Solar Wind ◽  
Kinetic Models ◽  
Tangential Discontinuities

Instability of tangential discontinuities in pinching plasmas

1999 ◽  
Vol 62 (1) ◽  
pp. 117-123 ◽  
Author(s):  
S. P. TSYBENKO
Keyword(s):  
Dispersion Relation ◽  
Simple Model ◽  
Current Pulse ◽  
Current Density ◽  
Strong Dependence ◽  
Plasma Instability ◽  
Tangential Discontinuity ◽  
Instability Increment ◽  
Tangential Discontinuities ◽  
A Current

A new mechanism for the formation of pinching plasma instability related to a tangential discontinuity is discussed. With this in mind we use a simple model of the Davydov–Zakharov class. It appears that there is a strong dependence of the instability increment on current density, resulting from the corresponding dispersion relation. Modulation of a current pulse is shown to be a possible way of stabilizing powerful discharges.

Jump conditions for a radiating relativistic gas

1994 ◽  
Vol 35 (6) ◽  
pp. 2878-2901 ◽  
Author(s):  
G. Alì ◽  
V. Romano
Keyword(s):  
Jump Conditions ◽  
Relativistic Gas

Jump conditions in hypersonic shocks

2004 ◽  
Vol 28 (3) ◽  
pp. 381-392 ◽  
Author(s):  
C. Michaut ◽  
C. Stehl� ◽  
S. Leygnac ◽  
T. Lanz ◽  
L. Boireau
Keyword(s):  
Jump Conditions

scholarly journals Surface Evolution During Semiconductor Processing

VLSI Design ◽  
1998 ◽  
Vol 6 (1-4) ◽  
pp. 379-384 ◽  
Author(s):  
Ganesh Rajagopalan ◽  
Vadali Mahadev ◽  
Timothy S. Cale
Keyword(s):  
Riemann Problem ◽  
Surface Profile ◽  
Numerical Implementation ◽  
Jump Conditions ◽  
Semiconductor Processing ◽  
Explicit Integration ◽  
Surface Evolution ◽  
Left And Right ◽  
The Right ◽  
Surface Angle

We discuss our approach to using the Riemann problem to compute surface profile evolution during the simulation of deposition, etch and reflow processes. Each pair of segments which represents the surface is processed sequentially. For cases in which both segments are the same material, the Riemann problem is solved. For cases in which the two segments are different materials, two Riemann problems are solved. The material boundary is treated as the right segment for the left material and as the left segment for the right material. The critical equations for the analyses are the characteristics of the Riemann problem and the ‘jump conditions’ which represent continuity of the surface. Examples are presented to demonstrate selected situations. One limitation of the approach is that the velocity of the surface is not known as a function of the surface angle. Rather, it is known for the angles of the left and right segments. The rate as a function of angle must be assumed for the explicit integration procedure used. Numerical implementation is briefly discussed.

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