Molecular Dynamics Study of the Role of the Free Surface on Block Copolymer Thin Film Morphology and Alignment

ACS Nano ◽  
2011 ◽  
Vol 5 (4) ◽  
pp. 2895-2907 ◽  
Author(s):  
Christopher Forrey ◽  
Kevin G. Yager ◽  
Samuel P. Broadaway
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


1996 ◽  
Vol 441 ◽  
Author(s):  
B. Sun ◽  
Z. Suo ◽  
W. Yang

AbstractDuring annealing of a polycrystalline thin film, grain-boundaries and film surfaces move. If the grain-boundaries move faster, the grains having the lowest free energy grow at the expense of others, resulting in a continuous film with large grains. If the film surfaces move faster, they groove along their junctions with the grain-boundaries, breaking the film to islands. This paper describes analytic solutions for steady surface motions, and discusses the morphology selection.


2007 ◽  
Vol 120 (2) ◽  
pp. 439-446 ◽  
Author(s):  
J. RaviPrakash ◽  
A.H. McDaniel ◽  
M. Horn ◽  
L. Pilione ◽  
P. Sunal ◽  
...  

2014 ◽  
Vol 47 (14) ◽  
pp. 4824-4829 ◽  
Author(s):  
Paul N. Patrone ◽  
Gregg M. Gallatin

2017 ◽  
Vol 12 ◽  
pp. 38-73
Author(s):  
Tomasz Wejrzanowski ◽  
Krzysztof Jan Kurzydlowski

The results of the studies presented here are devoted to understanding of microstructure effect on the processes and properties driven by diffusion. The role of various interfaces (intergranular, phase, free surface), as the high-energy defects, is underlined and investigated with special attention. The methodology relevant to analyses of the microstructural processes is first briefly presented. The capability and limitations of classical molecular dynamics, mesoscale Monte Carlo and cellular automaton techniques are described. Two examples of the diffusion driven processes analyzed at various length and time scale are shown: namely, grain growth in nanometallic materials and melting of thin embedded films. The modeling results are also accompanied with experimental studies. Thanks to application of numerical methods, models of relevant processes were proposed, which enabled to provide quantitative relationships between microstructure and the process kinetics. Such relationships can be later used for design of optimized materials for wide range of applications.


ACS Omega ◽  
2018 ◽  
Vol 3 (2) ◽  
pp. 2329-2339 ◽  
Author(s):  
Sergi Riera-Galindo ◽  
Adrián Tamayo ◽  
Marta Mas-Torrent

2010 ◽  
Vol 43 (6) ◽  
pp. 2880-2889 ◽  
Author(s):  
Chuanbing Tang ◽  
Su-mi Hur ◽  
Brian C. Stahl ◽  
Kulandaivelu Sivanandan ◽  
Michael Dimitriou ◽  
...  

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