Large Strain and Fracture Properties of Poly(dimethylacrylamide)/Silica Hybrid Hydrogels

2010 ◽  
Vol 43 (5) ◽  
pp. 2554-2563 ◽  
Author(s):  
Wei-Chun Lin ◽  
Wei Fan ◽  
Alba Marcellan ◽  
Dominique Hourdet ◽  
Costantino Creton
Keyword(s):  
Large Strain ◽  
Fracture Properties ◽  
Hybrid Hydrogels ◽  
Silica Hybrid

Reduction- and pH-Sensitive lipoic acid-modified Poly( l -lysine) and polypeptide/silica hybrid hydrogels/nanogels

Polymer ◽  
2016 ◽  
Vol 86 ◽  
pp. 32-41 ◽  
Author(s):  
Yi-Xuan Zhang ◽  
Yu-Fon Chen ◽  
Xuan-You Shen ◽  
Jin-Jia Hu ◽  
Jeng-Shiung Jan
Keyword(s):  
Lipoic Acid ◽  
Ph Sensitive ◽  
Hybrid Hydrogels ◽  
Silica Hybrid

Deep Indentation and Puncture of a Rigid Cylinder Inserted into a Soft Solid

Soft Matter ◽  
2021 ◽  
Author(s):  
Christopher Wade Barney ◽  
Chao Chen ◽  
Alfred J. Crosby
Keyword(s):  
Large Strain ◽  
Biological Tissues ◽  
Fracture Properties ◽  
Rigid Cylinder ◽  
Soft Solids ◽  
Deep Indentation

Deep indentation and puncture can be used to characterize the large strain elastic and fracture properties of soft solids and biological tissues. While this characterization method is growing in application...

Micromechanics Measurements Applied to Integrated Circuit Microelectronics

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Fracture Resistance ◽  
Interface Fracture ◽  
New Techniques ◽  
Fracture Properties ◽  
Engineered Structures ◽  
Mechanical And Fracture Properties ◽  
Interconnect Lines ◽  
Metallic Interconnect

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

Small and large strain behaviour of an unsaturated compacted silt

2008 ◽  
Vol 12 (3) ◽  
pp. 203-228 ◽  
Author(s):  
Said Taïbi ◽  
Jean-Marie Fleureau ◽  
Sigit Hadiwardoyo ◽  
Siba Kheirbek-Saoud
Keyword(s):  
Large Strain ◽  
Strain Behaviour

Comparison of the effects of wet straining and refining on the fracture properties of paper

2002 ◽  
Vol 17 (1) ◽  
pp. 45-49 ◽  
Author(s):  
Gongde Zhang ◽  
Eero Hiltunen ◽  
Jaakko E. Laine ◽  
Hannu Paulapuro ◽  
Heikki Kettunen ◽  
...  
Keyword(s):  
Fracture Properties
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