Novel Three-Dimensional Zinc Oxide Superstructures for High Dielectric Constant Polymer Composites Capable of Withstanding High Electric Field

2012 ◽  
Vol 116 (47) ◽  
pp. 24887-24895 ◽  
Author(s):  
Wei Wu ◽  
Xingyi Huang ◽  
Shengtao Li ◽  
Pingkai Jiang ◽  
Tanaka Toshikatsu
Keyword(s):  
Dielectric Constant ◽  
Zinc Oxide ◽  
Electric Field ◽  
Polymer Composites ◽  
High Dielectric Constant ◽  
Three Dimensional ◽  
High Electric Field ◽  
High Dielectric

Ceramic–Polymer Composites with High Dielectric Constant

2007 ◽  
Vol 19 (10) ◽  
pp. 1369-1372 ◽  
Author(s):  
M. Arbatti ◽  
X. Shan ◽  
Z.-Y. Cheng
Keyword(s):  
Dielectric Constant ◽  
Polymer Composites ◽  
High Dielectric Constant ◽  
High Dielectric

High dielectric constant and low loss of polymeric dielectric composites filled by carbon nanotubes adhering BaTiO3 hybrid particles

RSC Advances ◽  
2015 ◽  
Vol 5 (37) ◽  
pp. 29017-29021 ◽  
Author(s):  
Z. D. Liu ◽  
Y. Feng ◽  
W. L. Li
Keyword(s):  
Carbon Nanotubes ◽  
Dielectric Constant ◽  
Chemical Vapor Deposition ◽  
Polymer Composites ◽  
Vapor Deposition ◽  
High Dielectric Constant ◽  
Chemical Vapor ◽  
Hybrid Particles ◽  
Low Loss ◽  
High Dielectric

We reported the preparation of carbon nanotubes adhering BaTiO3 nanoparticles (BT@CNTs) via chemical vapor deposition (CVD) and the method to obtain the polymer composites with high dielectric constant and low loss.

scholarly journals Polymer Composites with Improved Dielectric Properties: A Review

2021 ◽  
Vol 66 (2) ◽  
pp. 166
Author(s):  
B. Ghule ◽  
M. Laad
Keyword(s):  
Dielectric Constant ◽  
Energy Storage ◽  
Dielectric Properties ◽  
Polymer Composites ◽  
High Dielectric Constant ◽  
Dielectric Materials ◽  
Filler Material ◽  
Filler Materials ◽  
K Value ◽  
High Dielectric

Materials exhibiting high dielectric constant (k) values find applications in capacitors, gate dielectrics, dielectric elastomers, energy storage device, while materials with low dielectric constant are required in electronic packaging and other such applications. Traditionally, high k value materials are associated with high dielectric losses, frequency-dependent dielectric behavior, and high loading of a filler. Materials with low k possess a low thermal conductivity. This creates the new challenges in the development of dielectric materials in both kinds of applications. Use of high dielectric constant filler materials increases the dielectric constant. In this study,the factors affecting the dielectric constant and the dielectric strength of polymer composites are explored. The present work aims to study the effect of various parameters affecting the dielectric properties of the materials. The factors selected in this study are the type of a polymer, type of a filler material used, size, shape, loading level and surface modification of a filler material, and method of preparation of the polymer composites. The study is focused on the dielectric enhancement of polymer nanocomposites used in the field of energy storage devices. The results show that the core-shell structured approach for high dielectric constant materials incorporated in a polymer matrix improves the dielectric constant of the polymer composite.

Effects of High Dielectric Constant Abrasives on ECMP

2011 ◽  
Vol 121-126 ◽  
pp. 3263-3267
Author(s):  
Wei Si Li ◽  
Dong Ming Guo ◽  
Zhu Ji Jin ◽  
Zhe Wang ◽  
Ze Wei Yuan
Keyword(s):  
Dielectric Constant ◽  
Electric Field ◽  
Chemical Mechanical Polishing ◽  
High Dielectric Constant ◽  
Removal Rate ◽  
Mechanical Polishing ◽  
Polished Surface ◽  
Rutile Tio2 ◽  
Planarization Process ◽  
High Dielectric

ECMP (Electro-Chemical Mechanical Polishing) presents high removal rate, low polishing pressure and good polished surface because the action of electrochemistry accelerates copper dissolution. It is considered to be a most promising novel Cu planarization process to replace traditional CMP (Chemical Mechanical Polishing). However, the micro asperity heights of coarse surface are often too small compared to the distance between anode and cathode, so the asperities are difficult to be selectively removed. In this paper, high dielectric constant abrasives were used in ECMP to solve this problem. High dielectric constant abrasives can improve the distribution of electric field, amplify the gradient of electric field and enhance the ability of selective removal. Based on the results of experiments, rutile TiO2, as one of high dielectric constant abrasives, is better than SiO2 and anatase TiO2 in ECMP process. The material removal rate of electrolyte containing rutile TiO2 is 0.078mg/min, and the surface roughness is Ra18.2nm.

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