Simulating Interfacial Thermal Conductance at Metal-Solvent Interfaces: The Role of Chemical Capping Agents

2011 ◽  
Vol 115 (45) ◽  
pp. 22475-22483 ◽  
Author(s):  
Shenyu Kuang ◽  
J. Daniel Gezelter
2020 ◽  
Vol 515 ◽  
pp. 146046 ◽  
Author(s):  
Xiaoyan Liu ◽  
Fangyuan Sun ◽  
Luhua Wang ◽  
Zhixing Wu ◽  
Xitao Wang ◽  
...  

2020 ◽  
Vol 153 (20) ◽  
pp. 204703
Author(s):  
Hemanta Bhattarai ◽  
Kathie E. Newman ◽  
J. Daniel Gezelter

2016 ◽  
Vol 49 (46) ◽  
pp. 465301 ◽  
Author(s):  
Ying-Yan Zhang ◽  
Qing-Xiang Pei ◽  
Yiu-Wing Mai ◽  
Siu-Kai Lai

Carbon ◽  
2019 ◽  
Vol 144 ◽  
pp. 109-115 ◽  
Author(s):  
Zhiyong Wei ◽  
Fan Yang ◽  
Kedong Bi ◽  
Juekuan Yang ◽  
Yunfei Chen

Author(s):  
Hasan Babaei ◽  
Pawel Keblinski ◽  
J. M. Khodadadi

By utilizing molecular dynamics (MD) simulations, we study the interfacial thermal conductance at the interface of graphene and paraffin. In doing so, we conduct non-equilibrium heat source and sink simulations on systems of parallel and perpendicular configurations in which the heat flow is parallel and perpendicular to the surface of graphene, respectively. For the perpendicular configuration, graphene with different number of layers are considered. The results show that the interfacial thermal conductance decreases with the number of layers and converges to a value which is equal to the obtained conductance by using the parallel configuration. We also study the conductance for the solid phase paraffin. The results indicate that solid paraffin-graphene interfaces have higher conductance values with respect to the corresponding liquid phase systems.


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