MC4:  A Hypothetical Three-Dimensional Organometallic Net with Metal−Metal Bonding and Polyacetylene Substructures

1996 ◽  
Vol 118 (42) ◽  
pp. 10294-10302 ◽  
Author(s):  
Norman Goldberg ◽  
Huang Tang ◽  
Nancy Kroohs ◽  
Roald Hoffmann
Keyword(s):  
Three Dimensional ◽  
Metal Bonding ◽  
Metal Metal

Damascene-Patterned Metal-Adhesive (Cu-BCB) Redistribution Layers

2006 ◽  
Vol 970 ◽  
Author(s):  
Ronald J. Gutmann ◽  
J. Jay McMahon ◽  
Jian-Qiang Lu
Keyword(s):  
Bonding Strength ◽  
Adhesive Bonding ◽  
Process Integration ◽  
Three Dimensional ◽  
Adhesive Layer ◽  
Wafer Level ◽  
Technology Platform ◽  
Metal Bonding ◽  
Wafer Level Packaging ◽  
Metal Metal

ABSTRACTA monolithic, wafer-level three-dimensional (3D) technology platform is described that is compatible with next-generation wafer level packaging (WLP) processes. The platform combines the advantages of both (1) high bonding strength and adaptability to IC wafer topography variations with spin-on dielectric adhesive bonding and (2) process integration and via-area advantages of metal-metal bonding. A copper-benzocyclobutene (Cu-BCB) process is described that incorporates single-level damascene-patterned Cu vias with partially-cured BCB as the bonding adhesive layer. A demonstration vehicle consisting of a two-wafer stack of 2-4 μm diameter vias has shown the bondability of both Cu-to-Cu and BCB-to-BCB. Planarization conditions to achieve BCB-BCB bonding with low-resistance Cu-Cu contacts have been examined, with wafer-scale planarization requirements compared to other 3D platforms. Concerns about stress induced at the tantalum (Ta) liner-to-BCB interface resulting in partial delamination are discussed. While across-wafer uniformity has not been demonstrated, the viability of this WLP-compatible 3D platform has been shown.

Metal-metal bonding and mixed-valent tantalum in La2Ta3S2O8

1992 ◽  
Vol 98 (1) ◽  
pp. 82-89 ◽  
Author(s):  
Theodore D. Brennan ◽  
James A. Ibers
Keyword(s):  
Metal Bonding ◽  
Metal Metal

Metal-Metal Bonding in Biology: EXAFS Evidence for a 2.5 .ANG. Copper-Copper Bond in the CuA Center of Cytochrome Oxidase

Biochemistry ◽  
1994 ◽  
Vol 33 (34) ◽  
pp. 10401-10407 ◽  
Author(s):  
Ninian J. Blackburn ◽  
Mary E. Barr ◽  
William H. Woodruff ◽  
John van der Ooost ◽  
Simon de Vries
Keyword(s):  
Cytochrome Oxidase ◽  
Metal Bonding ◽  
Metal Metal

scholarly journals Metal-metal bonding and structures of trinickel and tricobalt dipyridylamido complexes from surface-enhanced Raman spectra

2010 ◽  
Vol 41 (12) ◽  
pp. 1694-1699 ◽  
Author(s):  
Szu-Hsueh Lai ◽  
Chung-Jen Hsiao ◽  
Yu-Min Huang ◽  
I-Chia Chen ◽  
Wen-Zhen Wang ◽  
...  
Keyword(s):  
Raman Spectra ◽  
Metal Bonding ◽  
Metal Metal ◽  
Surface Enhanced ◽  
Surface Enhanced Raman
Sign in / Sign up

Export Citation Format

Share Document