Calorimetry of Polymer Metallization:  Copper, Calcium, and Chromium on PMDA-ODA Polyimide

2003 ◽  
Vol 125 (13) ◽  
pp. 3995-3998 ◽  
Author(s):  
Richard Murdey ◽  
J. Todd Stuckless
Keyword(s):  
Polymer Metallization

scholarly journals Volumetric 3D‐Printed Antennas, Manufactured via Selective Polymer Metallization

2019 ◽  
Vol 13 (6) ◽  
Author(s):  
Dmitry Filonov ◽  
Sergey Kolen ◽  
Andrey Shmidt ◽  
Yosi Shacham‐Diamand ◽  
Amir Boag ◽  
...  
Keyword(s):  
Printed Antennas ◽  
Polymer Metallization ◽  
3D Printed ◽  
3D Printed Antennas

Fundamental Aspects of Polymer Metallization

2002 ◽  
pp. 73-96 ◽  
Author(s):  
F. Faupel ◽  
V. Zaporojtchenko ◽  
T. Strunskus ◽  
J. Erichsen ◽  
K. Dolgner ◽  
...  
Keyword(s):  
Polymer Metallization

Fundamental Aspects Of Polymer Metallization

1998 ◽  
Vol 511 ◽  
Author(s):  
F. Faupel ◽  
T. Strunskus ◽  
M. Kiene ◽  
A. Thran ◽  
C. V. Bechtolsheim ◽  
...  
Keyword(s):  
Metal Ions ◽  
Elevated Temperatures ◽  
Deposition Process ◽  
Interfacial Chemistry ◽  
Interface Formation ◽  
Structural Investigations ◽  
Metal Diffusion ◽  
Lower Reactivity ◽  
Polymer Metallization ◽  
Means Of Transmission

ABSTRACTValuable information on the structure and formation of metal-polymer interfaces originates from radiotracer measurements of metal diffusion at the interface, structural investigations by means of transmission electron microscopy, and computer simulations on the interplay of atomic metal diffusion and aggregation. Moreover, X-ray photoemission spectroscopy has largely contributed to our present understanding of the interfacial chemistry and the early stages of interface formation. While reactive metals always form relatively sharp interfaces with polymers, metals of lower reactivity diffuse into polymers at elevated temperatures and have a very strong tendency to agglomerate. The extent of diffusion appears to be determined by the initial stage of the deposition process. Here sticking coefficients recently measured for metals on virgin polymer surfaces deviate markedly from unity. Diffusion into the polymer increases strongly at low deposition rates. No significant diffusion is expected from a continuous metal film unless metal ions are formed at the interface. Metal ions are highly mobile and do not aggregate due to electrostatic repulsion. The model emerging from these observations allows us to predict the salient features of interface formation between metals and polymers in general and particularly with respect to the new low-k polymers.

Potentiostatic Cu-Zn Alloying for Polymer Metallization Using Medium-Low Temperature Ionic Liquid Baths

2013 ◽  
Vol 160 (9) ◽  
pp. D417-D421 ◽  
Author(s):  
Atsushi Kitada ◽  
Kozo Yanase ◽  
Takashi Ichii ◽  
Hiroyuki Sugimura ◽  
Kuniaki Murase
Keyword(s):  
Ionic Liquid ◽  
Low Temperature ◽  
Polymer Metallization

Ultrasonic System Design and Calculation for Polymer Metallization

2015 ◽  
Vol 760 ◽  
pp. 263-268 ◽  
Author(s):  
Gheorghe Amza ◽  
Dan Nitoi ◽  
Cătălin Amza ◽  
Zoia Apostolescu ◽  
Constantin Gheorghe Opran
Keyword(s):  
Electrical Conductivity ◽  
Wear Resistance ◽  
System Design ◽  
Base Material ◽  
Ultrasonic Field ◽  
Vibration Modes ◽  
Ultrasonic Activation ◽  
Polymer Metallization ◽  
Low Wear ◽  
Metallization Process

Paper presents ultrasonic system design and calculation for metallization process of the polymer pieces. Because of some bad properties like: very low hardness, very low wear resistance, no electrical conductivity and no open fire resistance, polymer parts has to be reinforced with different materials. A new method is represented by ultrasonic field metallization process which has certain advantages. The work presents the analytic calculation for the ultrasonic field and vibration modes of the ultrasonic system used for a polymer base material ultrasonic activation.

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