Dielectric measurements of water in the radio and microwave frequencies by time domain reflectometry

1988 ◽  
Vol 92 (21) ◽  
pp. 6149-6150 ◽  
Author(s):  
M. Merabet ◽  
T. K. Bose
Keyword(s):  
Time Domain ◽  
Time Domain Reflectometry ◽  
Dielectric Measurements ◽  
Microwave Frequencies

scholarly journals Application of electric polarization to contaminant detection in soils

1989 ◽  
Vol 26 (4) ◽  
pp. 536-550 ◽  
Author(s):  
Raymond N. Yong ◽  
Edward J. Hoppe
Keyword(s):  
Contaminant Transport ◽  
Time Domain ◽  
Mineral Exploration ◽  
Electric Polarization ◽  
Induced Polarization ◽  
Time Domain Reflectometry ◽  
Dielectric Measurements ◽  
Polarization Method ◽  
Contaminant Detection ◽  
Nonpolar Liquids

Preliminary experiments indicate the feasibility of constructing for field use a contaminant-detection instrumentation based on dielectric measurements. This study applies the technique of time-domain reflectometry to assess characteristic "signatures" of some selected contaminants and soil–contaminant mixtures. The results imply that a proper differentiation between various signatures can be attained, allowing an assessment in regard to soil–contaminant status. The proposed technique is similar in principle to the induced-polarization method applied in mineral exploration. Key words: electric polarization, contaminant transport, dielectrics, induced polarization, nonpolar liquids, time-domain reflectometry, relaxation, contaminant–soil interaction.

Advanced Non-Destructive Fault Isolation Techniques for PCB Substrates Using Magnetic Current Imaging and Terahertz Time Domain Reflectometry

2018 ◽  
Author(s):  
Daechul Choi ◽  
Yoonseong Kim ◽  
Jongyun Kim ◽  
Han Kim
Keyword(s):  
Time Domain ◽  
Quantum Interference ◽  
Flip Chip ◽  
Imaging System ◽  
Time Domain Reflectometry ◽  
Fault Isolation ◽  
Magnetic Current ◽  
Isolation Techniques ◽  
Super Conducting ◽  
Non Destructive

Abstract In this paper, we demonstrate cases for actual short and open failures in FCB (Flip Chip Bonding) substrates by using novel non-destructive techniques, known as SSM (Scanning Super-conducting Quantum Interference Device Microscopy) and Terahertz TDR (Time Domain Reflectometry) which is able to pinpoint failure locations. In addition, the defect location and accuracy is verified by a NIR (Near Infra-red) imaging system which is also one of the commonly used non-destructive failure analysis tools, and good agreement was made.

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