Thermal Stability of High Performance Poly(aryl ether sulfones):Structure/Reactivity Relationships in the Pyrolysis of Oligomeric Model Compounds

1994 ◽  
Vol 33 (10) ◽  
pp. 2265-2271 ◽  
Author(s):  
Linda J. Broadbelt ◽  
Michael T. Klein ◽  
Barry D. Dean ◽  
Stephen M. Andrews
Keyword(s):  
Thermal Stability ◽  
High Performance ◽  
Aryl Ether ◽  
Model Compounds ◽  
Thermal Stability Of

Thermal Stability of High Performance Thermoelectric β-Zn4Sb3 in Argon

2011 ◽  
Vol 2011 (17) ◽  
pp. 2733-2737 ◽  
Author(s):  
Hao Yin ◽  
Birgitte L. Pedersen ◽  
Bo B. Iversen
Keyword(s):  
Thermal Stability ◽  
High Performance ◽  
Thermal Stability Of

Solution Blow Spun High Performance Co-Polyimide Nanofibers

2017 ◽  
Vol 898 ◽  
pp. 2181-2186
Author(s):  
Jing Li ◽  
Jun Rong Yu ◽  
Jing Zhu ◽  
Yan Wang ◽  
Zu Ming Hu ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Tensile Property ◽  
High Performance ◽  
Nanofiber Membrane ◽  
High Productivity ◽  
Thermal Imidization ◽  
Solution Blow Spinning ◽  
Ft Ir ◽  
Biphenyltetracarboxylic Dianhydride ◽  
Thermal Stability Of

Solution blow spinning (SBS) is an innovative nanofiber fabricating method with high productivity. 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA) / p-phenylenediamine (PDA) / 4,4'-oxydianiline (ODA) co-polyimide nanofiber membrane was efficiently produced by SBS followed by imidization from precursor polyamic acid (PAA) nanofiber membrane in the paper. The morphologies and structures of the obtained PAA and PI nanofiber membrane were examined by SEM and FT-IR. The effect of thermal imidization temperature on the tensile property was investigated. The thermal stability of polyimide nanofiber membrane was also characterized by TGA.

Thermal stability of Mg3Sb1.475Bi0.475Te0.05 high performance n-type thermoelectric investigated through powder X-ray diffraction and pair distribution function analysis

2018 ◽  
Vol 6 (35) ◽  
pp. 17171-17176 ◽  
Author(s):  
Lasse Rabøl Jørgensen ◽  
Jiawei Zhang ◽  
Christian Bonar Zeuthen ◽  
Bo Brummerstedt Iversen
Keyword(s):  
Thermal Stability ◽  
Distribution Function ◽  
Pair Distribution Function ◽  
High Performance ◽  
Function Analysis ◽  
X Ray Diffraction ◽  
X Ray ◽  
Thermal Stability Of

The thermal stability of the high performance n-type Te-doped Mg3Sb1.5Bi0.5 system is investigated.

scholarly journals Curing Kinetics and Thermal Stability of Epoxy Composites Containing Newly Obtained Nano-Scale Aluminum Hypophosphite (AlPO2)

Polymers ◽  
2020 ◽  
Vol 12 (3) ◽  
pp. 644 ◽  
Author(s):  
Farimah Tikhani ◽  
Shahab Moghari ◽  
Maryam Jouyandeh ◽  
Fouad Laoutid ◽  
Henri Vahabi ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
High Performance ◽  
Frequency Factor ◽  
Curing Temperature ◽  
Heating Rates ◽  
Scanning Calorimetry ◽  
Nano Scale ◽  
Aluminum Hypophosphite ◽  
Thermal Stability Of

For the first time, nano-scale aluminum hypophosphite (AlPO2) was simply obtained in a two-step milling process and applied in preparation of epoxy nanocomposites varying concentration (0.1, 0.3, and 0.5 wt.% based on resin weight). Studying the cure kinetics and thermal stability of these nanocomposites would pave the way toward the design of high-performance nanocomposites for special applications. Scanning electron microscopy (SEM) and transmittance electron microscopy (TEM) revealed AlPO2 particles having domains less than 60 nm with high potential for agglomeration. Excellent (at heating rate of 5 °C/min) and Good (at heating rates of 10, 15 and 20 °C/min) cure states were detected for nanocomposites under nonisothermal differential scanning calorimetry (DSC). While the dimensionless curing temperature interval (ΔT*) was almost equal for epoxy/AlPO2 nanocomposites, dimensionless heat release (ΔH*) changed by densification of polymeric network. Quantitative cure analysis based on isoconversional Friedman and Kissinger methods gave rise to the kinetic parameters such as activation energy and the order of reaction as well as frequency factor. Variation of glass transition temperature (Tg) was monitored to explain the molecular interaction in the system, where Tg increased from 73.2 °C for neat epoxy to just 79.5 °C for the system containing 0.1 wt.% AlPO2. Moreover, thermogravimetric analysis (TGA) showed that nanocomposites were thermally stable.

The relative thermal stability of polymer model compounds

1962 ◽  
Vol 6 (19) ◽  
pp. 47-56 ◽  
Author(s):  
Desmond Sheehan ◽  
Alan P. Bentz ◽  
John C. Petropoulos
Keyword(s):  
Thermal Stability ◽  
Polymer Model ◽  
Model Compounds ◽  
Relative Thermal Stability ◽  
Thermal Stability Of

Thermal Stability of GaAs/InGaP and InGaP/(In)GaAs Interfaces

1995 ◽  
Vol 405 ◽  
Author(s):  
F. Hyuga ◽  
T. Nittono ◽  
K. Watanabe ◽  
T. Furuta
Keyword(s):  
Thermal Stability ◽  
Quantum Wells ◽  
Annealing Time ◽  
High Performance ◽  
High Reliability ◽  
Half Maximum ◽  
Single Quantum ◽  
Thermal Stabilities ◽  
Temperature Range ◽  
Thermal Stability Of

AbstractThermal stabilities of GaAs/InGaP and InGaP/(In)GaAs interfaces are investigated using InGaP/(In)GaAs/InGaP single quantum wells. Annealing is performed at a temperature range between 600 and 900 °C for 10 min. Positions and the full widths at half maximum (FWHM) of photoluminescence (PL) peaks are almost identical to those of as-grown ones up to 800 °C. Blue shifts of PL peaks and increased widths of their FWHM observed after 900 °C annealing are suppressed by shortening the annealing time to 0.1 sec. Annealing at 900 ‘C for 0.1 sec is sufficient to activate Si ions implanted into (In)GaAs layers. As a result, these thermal stabilities are able to provide high reliability and high performance of InGaP/(In)GaAs heterostructure MESFET ICs.

Thermal stability of lignin in ground pulp (GP) and the effect of lignin modification on GP’s thermal stability: TGA experiments with dimeric lignin model compounds and milled wood lignins

Holzforschung ◽  
2019 ◽  
Vol 73 (5) ◽  
pp. 493-499 ◽  
Author(s):  
Daisuke Ando ◽  
Fumiaki Nakatsubo ◽  
Hiroyuki Yano
Keyword(s):  
Thermal Stability ◽  
Model Compound ◽  
Pinus Densiflora ◽  
Wood Fiber ◽  
Model Compounds ◽  
Lignin Model Compounds ◽  
Oh Groups ◽  
Lignin Model Compound ◽  
Lignin Model ◽  
Thermal Stability Of

Abstract For ground pulp (GP) utilization in wood fiber composites as reinforced material, its thermal behavior is relevant. The contribution of lignin to thermal performance of GP from Pinus densiflora was the focus of the present study. Dimeric lignin model compounds and isolated milled wood lignins (MWLs) from three sources were submitted for thermogravimetric analysis (TGA). The temperatures leading to 1% weight loss (T per 1% WL) for the material were determined. The thermal stability of β-O-4 models was the lowest. Among the MWLs, the abaca MWL with its high β-O-4 content was the least thermostable. An acetylated nonphenolic β-O-4 lignin model compound showed that acetylation improves the thermal stability of this type of dimeric models. The acetylation of benzylic OH groups in β-O-4 linkages is especially relevant for the thermal resistance, which was also shown based on pre-acetylated benzylic OH groups in the GP before the total acetylation.

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