Stencil Printing of Liquid Metal upon Electrospun Nanofibers Enables High-Performance Flexible Electronics

ACS Nano ◽  
2021 ◽  
Author(s):  
Meng Wang ◽  
Chao Ma ◽  
Pierre Claver Uzabakiriho ◽  
Xi Chen ◽  
Zhongrong Chen ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
High Performance ◽  
Electrospun Nanofibers ◽  
Stencil Printing

scholarly journals Sequential Oxidation Strategy for the Fabrication of Liquid Metal Electrothermal Thin Film with Desired Printing and Functional Property

Micromachines ◽  
2021 ◽  
Vol 12 (12) ◽  
pp. 1539
Author(s):  
Jun-Heng Fu ◽  
Xu-Dong Zhang ◽  
Peng Qin ◽  
Jing Liu
Keyword(s):  
Thin Film ◽  
Liquid Metal ◽  
Composite Film ◽  
Flexible Electronics ◽  
High Performance ◽  
Polyimide Film ◽  
Great Promise ◽  
Metal Composite ◽  
Resistive Layer ◽  
Film Substrate

Room temperature liquid metal (LM) showcases a great promise in the fields of flexible functional thin film due to its favorable characteristics of flexibility, inherent conductivity, and printability. Current fabrication strategies of liquid metal film are substrate structure specific and sustain from unanticipated smearing effects. Herein, this paper reported a facile fabrication of liquid metal composite film via sequentially regulating oxidation to change the adhesion characteristics, targeting the ability of electrical connection and electrothermal conversion. The composite film was then made of the electrically resistive layer (oxidizing liquid metal) and the insulating Polyimide film (PI film) substrate, which has the advantages of electrical insulation and ultra-wide temperature working range, and its thickness is only 50 μm. The electrical resistance of composite film can maintain constant for 6 h and could work normally. Additionally, the heating film exhibited excellent thermal switching characteristics that can reach temperature equilibrium within 100 s, and recovery to ambient temperature within 50 s. The maximum working temperature of the as-prepared film is 115 °C, which is consistent with the result of the theoretical calculation, demonstrating a good electrothermal conversion capability. Finally, the heating application under extreme low temperature (−196 °C) was achieved. This conceptual study showed the promising value of the prototype strategy to the specific application areas such as the field of smart homes, flexible electronics, wearable thermal management, and high-performance heating systems.

Liquid metal-based nanocomposite materials: Fabrication technology and applications

Nanoscale ◽  
2021 ◽  
Author(s):  
Hiroki Ota ◽  
Nyamjargal Ochirkhuyag ◽  
Ryosuke Matsuda ◽  
Zihao Song ◽  
Fumika Nakamura ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Liquid Metals ◽  
Nanocomposite Materials ◽  
Fabrication Technology

Research on liquid metals has been steadily garnering more interest in recent times because the properties of these metals are conducive to flexible electronics applications; further, these metals are in...

Double-network hydrogel with adjustable surface morphology and multifunctional integration for flexible strain sensors

Soft Matter ◽  
2021 ◽  
Author(s):  
Yang Yu ◽  
Fengjin Xie ◽  
Xinpei Gao ◽  
Liqiang Zheng
Keyword(s):  
Surface Morphology ◽  
Flexible Electronics ◽  
High Performance ◽  
Strain Sensors ◽  
Next Generation ◽  
Double Network ◽  
Conductive Hydrogels

The next generation of high-performance flexible electronics has put forward new demands to the development of ionic conductive hydrogels. In recent years, many efforts have been made toward developing double-network...

Printable and Recyclable Conductive Ink Based on a Liquid Metal with Excellent Surface Wettability for Flexible Electronics

2021 ◽  
Vol 13 (6) ◽  
pp. 7443-7452
Author(s):  
Jianyu Xu ◽  
Hongda Guo ◽  
Hongyao Ding ◽  
Qiao Wang ◽  
Ziqing Tang ◽  
...  
Keyword(s):  
Liquid Metal ◽  
Flexible Electronics ◽  
Surface Wettability ◽  
Conductive Ink

Stretchable Systems

2021 ◽  
Author(s):  
Yogeenth Kumaresan ◽  
Nivasan Yogeswaran ◽  
Luigi G. Occhipinti ◽  
Ravinder Dahiya
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Electrical Response ◽  
Inorganic Compounds ◽  
Stretchable Electronics ◽  
Material Research ◽  
Active Materials ◽  
Challenges And Opportunities ◽  
Integration Techniques ◽  
Strain Invariant

Stretchable electronics is one of the transformative pillars of future flexible electronics. As a result, the research on new passive and active materials, novel designs, and engineering approaches has attracted significant interest. Recent studies have highlighted the importance of new approaches that enable the integration of high-performance materials, including, organic and inorganic compounds, carbon-based and layered materials, and composites to serve as conductors, semiconductors or insulators, with the ability to accommodate electronics on stretchable substrates. This Element presents a discussion about the strategies that have been developed for obtaining stretchable systems, with a focus on various stretchable geometries to achieve strain invariant electrical response, and summarises the recent advances in terms of material research, various integration techniques of high-performance electronics. In addition, some of the applications, challenges and opportunities associated with the development of stretchable electronics are discussed.

Convective Cooling of Compact Electronic Devices via Liquid Metals with Low Melting Points

2021 ◽  
Author(s):  
Guilin Liu ◽  
Jing Liu
Keyword(s):  
Heat Transfer ◽  
Melting Point ◽  
Liquid Metal ◽  
High Performance ◽  
Flow Resistance ◽  
Heat Dissipation ◽  
Liquid Metals ◽  
Electronic Devices ◽  
Convective Cooling ◽  
Heat Exchanger Design

Abstract The increasingly high power density of today's electronic devices requires the cooling techniques to produce highly effective heat dissipation performance with as little sacrifice as possible to the system compactness. Among the currently available thermal management schemes, the convective liquid metal cooling provides considerably high performance due to their unique thermal properties. This paper firstly reviews the studies on convective cooling using low-melting-point metals published in the past few decades. A group of equations for the thermophysical properties of In-Ga-Sn eutectic alloy is then documented by rigorous literature examination, following by a section of correlations for the heat transfer and flow resistance calculation to partially facilitate the designing work at the current stage. The urgent need to investigate the heat transfer and flow resistance of forced convection of low-melting-point metals in small/mini-channels, typical in compact electronic devices, is carefully argued. Some special aspects pertaining to the practical application of this cooling technique, including the entrance effect, mixed convection, and compact liquid metal heat exchanger design, are also discussed. Finally, future challenges and prospects are outlined.

High-Performance Antimony–Bismuth–Tin Positive Electrode for Liquid Metal Battery

2018 ◽  
Vol 30 (24) ◽  
pp. 8739-8746 ◽  
Author(s):  
Wang Zhao ◽  
Ping Li ◽  
Zhiwei Liu ◽  
Donglin He ◽  
Kun Han ◽  
...  
Keyword(s):  
Liquid Metal ◽  
High Performance ◽  
Positive Electrode ◽  
Liquid Metal Battery
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