Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging

Qiang Jia; Guisheng Zou; Wengan Wang; Hui Ren; Hongqiang Zhang; Zhongyang Deng; Bin Feng; Lei Liu

doi:10.1021/acsami.9b20731

Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging

ACS Applied Materials & Interfaces ◽

10.1021/acsami.9b20731 ◽

2020 ◽

Vol 12 (14) ◽

pp. 16743-16752

Author(s):

Qiang Jia ◽

Guisheng Zou ◽

Wengan Wang ◽

Hui Ren ◽

Hongqiang Zhang ◽

...

Keyword(s):

Electronic Packaging ◽

Power Electronic ◽

Sintering Mechanism

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Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging

Applied Surface Science ◽

10.1016/j.apsusc.2021.149579 ◽

2021 ◽

pp. 149579

Author(s):

Qiang Jia ◽

Guisheng Zou ◽

Hongqiang Zhang ◽

Wengan Wang ◽

Hui Ren ◽

...

Keyword(s):

Electronic Packaging ◽

Power Electronic ◽

Sintering Mechanism

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Failure modes and FEM analysis of power electronic packaging

Finite Elements in Analysis and Design ◽

10.1016/s0168-874x(01)00094-4 ◽

2002 ◽

Vol 38 (7) ◽

pp. 601-612 ◽

Cited By ~ 96

Author(s):

Hua Ye ◽

Minghui Lin ◽

Cemal Basaran

Keyword(s):

Electronic Packaging ◽

Failure Modes ◽

Fem Analysis ◽

Power Electronic

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Advanced multiphysics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) ◽

10.1109/3dpeim.2016.7570563 ◽

2016 ◽

Cited By ~ 2

Author(s):

Xin Zhao ◽

Yang Xu ◽

Douglas C. Hopkins

Keyword(s):

Electronic Packaging ◽

High Performance ◽

Power Electronic ◽

Multiphysics Simulation ◽

Packaging Design

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Advanced multi-physics simulation for high performance power electronic packaging design

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) ◽

10.1109/3dpeim.2016.8048203 ◽

2016 ◽

Author(s):

Xin Zhao ◽

Yang Xu ◽

Douglas C. Hopkins

Keyword(s):

Electronic Packaging ◽

High Performance ◽

Power Electronic ◽

Packaging Design ◽

Physics Simulation

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Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging

IEEE Transactions on Power Electronics ◽

10.1109/tpel.2020.2978584 ◽

2020 ◽

Vol 35 (10) ◽

pp. 10892-10905 ◽

Cited By ~ 1

Author(s):

Asger Bjorn Jorgensen ◽

Stig Munk-Nielsen ◽

Christian Uhrenfeldt

Keyword(s):

Finite Element Analysis ◽

Finite Element ◽

Electronic Packaging ◽

Digital Design ◽

Power Electronic ◽

Element Analysis

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Trends of Power Electronic Packaging and Modeling

2008 10th Electronics Packaging Technology Conference ◽

10.1109/eptc.2008.4763404 ◽

2008 ◽

Cited By ~ 17

Author(s):

Yong Liu ◽

Scott Irving ◽

Timwah Luk ◽

Dan Kinzer

Keyword(s):

Electronic Packaging ◽

Power Electronic

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Electrochemical migration of sintered nanosilver under chloride-containing thin electrolyte layer for power electronic packaging

CORROSION ◽

10.5006/1909 ◽

2015 ◽

Author(s):

Yana Zheng ◽

Yunhui Mei ◽

Chaoyi Yan ◽

Guo-Quan Lu

Keyword(s):

Electronic Packaging ◽

Electrochemical Migration ◽

Power Electronic ◽

Electrolyte Layer ◽

Thin Electrolyte Layer

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Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging

2014 15th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2014.6922606 ◽

2014 ◽

Cited By ~ 4

Author(s):

Shancan Fu ◽

Yunhui Mei ◽

Xin Li ◽

Guo-Quan Lu

Keyword(s):

Electronic Packaging ◽

Pressureless Sintering ◽

Power Electronic ◽

Nanosilver Paste

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Partial discharge behaviour of power electronic packaging insulation

Proceedings of 1998 International Symposium on Electrical Insulating Materials. 1998 Asian International Conference on Dielectrics and Electrical Insulation. 30th Symposium on Electrical Insulating Materials (IEEE Cat. No.98TH8286) ◽

10.1109/iseim.1998.741806 ◽

2002 ◽

Cited By ~ 14

Author(s):

M. Berth

Keyword(s):

Electronic Packaging ◽

Partial Discharge ◽

Power Electronic ◽

Discharge Behaviour

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An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packaging

2013 14th International Conference on Electronic Packaging Technology ◽

10.1109/icept.2013.6756601 ◽

2013 ◽

Cited By ~ 3

Author(s):

Guo-Quan Lu ◽

Meiyu Wang ◽

Yunhui Mei ◽

Xin Li ◽

Lei Wang ◽

...

Keyword(s):

Electronic Packaging ◽

Bipolar Transistor ◽

Power Electronic ◽

Thermal Impedance ◽

Insulated Gate Bipolar Transistor ◽

Igbt Module

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