Silicon-Based Embedded Trenches of Active Antennas for High-Responsivity Omnidirectional Photodetection at Telecommunication Wavelengths

2019 ◽  
Vol 11 (3) ◽  
pp. 3150-3159 ◽  
Author(s):  
Keng-Te Lin ◽  
Chih-Jie Chan ◽  
Yu-Sheng Lai ◽  
Lung-Tai Shiu ◽  
Ching-Che Lin ◽  
...  
2020 ◽  
Vol 7 (21) ◽  
pp. 2001039
Author(s):  
Shun Yasunaga ◽  
Hidetoshi Takahashi ◽  
Tomoyuki Takahata ◽  
Isao Shimoyama ◽  
Tetsuo Kan

2009 ◽  
Vol 105 (2) ◽  
pp. 024513 ◽  
Author(s):  
Guillaume Pedroza ◽  
Olivier Gilard ◽  
Marie-Lise Bourqui ◽  
Laurent Bechou ◽  
Yannick Deshayes ◽  
...  

Author(s):  
M. S. Kukurudziak ◽  
O. P. Andreeva ◽  
V. M. Lipka

The paper presents the results of development, optimization and improvement of p–i–n photodiode technology based on high-resistance p-type silicon with increased responsivity at a wavelength of 1060 nm. The optimal material was selected and the technological modes optimal for solving the set task were established and worked out іn the course of research.


2020 ◽  
Vol 45 (5) ◽  
pp. 1088 ◽  
Author(s):  
Wei-Ting Hung ◽  
Devesh Barshilia ◽  
Rikmantra Basu ◽  
H. H. Cheng ◽  
Guo-En Chang

2021 ◽  
Vol 9 (10) ◽  
pp. 3504-3512
Author(s):  
Ji Eun Kim ◽  
Won Tae Kang ◽  
Van Tu Vu ◽  
Young Rae Kim ◽  
Yong Seon Shin ◽  
...  

As the tight contact interface of the lateral PN junction enables high responsivity, specific detectivity, and fast response speed, atomic-scale two-dimensional (2D) lateral PN heterostructures are emerging as viable alternatives to silicon-based photodiodes.


2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000054-000058
Author(s):  
Martin Oppermann ◽  
Joerg Schroth ◽  
Felix Thurow

Modern Active Electronically Steered Antennas (AESA) are operating in different platforms and systems. Inside EADS/CASSIDIAN the focus on X-Band antennas today is in airborne and fighter nose radars, in satellite based SAR antennas (Synthetic Aperture Radar) for earth observation and ground surveillance and security radars. Active antennas are assembled with hundreds or even thousands of T/R modules. This paper will describe an example of a so called standardized module solution based on LTCC package technology. State-of-the-art modules are assembled with active components like MMICs realized in GaAs technology, e.g. Low Noise Amplifier (LNA) and High Power Amplifier (HPA), Silicon based devices and passives. Assembly technologies are optimized for high yield series production inside CASSIDIAN MicroWave Factory. New semiconductor technologies, like GaN (Gallium Nitride) are enablers for a new T/R module generation. GaN/SiC based MMICs with higher power density compared with GaAs based devices are technological challenges for innovative thermal management solutions and assembly alternatives. GaN power devices are soldered on modern heatsink materials with high thermal conductivity and matched CTE (between MMIC and heatsink). Results of thermal simulations comparing different heatsink materials in combination with soldering techniques will be discussed and an optimized solution will be shown. Another type of T/R Module technology based on RF-PCB and packaged MMICs will be discussed. Future applications of ground-based security radars, active antenna products with a one-dimensional array and needs for cost-effective solutions seem to be SMD-based products. Different packages, e.g. QFN (Quad Flat Pack no Lead) and ceramic based (HTCC), mainly for power devices will be shown and compared.


1999 ◽  
Vol 09 (PR8) ◽  
pp. Pr8-101-Pr8-107
Author(s):  
F. J. Martí ◽  
A. Castro ◽  
J. Olivares ◽  
C. Gómez-Aleixandre ◽  
J. M. Albella
Keyword(s):  

2001 ◽  
Vol 11 (PR3) ◽  
pp. Pr3-861-Pr3-867 ◽  
Author(s):  
S. M. Zemskova ◽  
J. A. Haynes ◽  
K. M. Cooley

1996 ◽  
Vol 444 ◽  
Author(s):  
Hyeon-Seag Kim ◽  
D. L. Polla ◽  
S. A. Campbell

AbstractThe electrical reliability properties of PZT (54/46) thin films have been measured for the purpose of integrating this material with silicon-based microelectromechanical systems. Ferroelectric thin films of PZT were prepared by metal organic decomposition. The charge trapping and degradation properties of these thin films were studied through device characteristics such as hysteresis loop, leakage current, fatigue, dielectric constant, capacitancevoltage, and loss factor measurements. Several unique experimental results have been found. Different degradation processes were verified through fatigue (bipolar stress), low and high charge injection (unipolar stress), and high field stressing (unipolar stress).


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