Dense Vertically Aligned Copper Nanowire Composites as High Performance Thermal Interface Materials

2017 ◽  
Vol 9 (48) ◽  
pp. 42067-42074 ◽  
Author(s):  
Michael T. Barako ◽  
Scott G. Isaacson ◽  
Feifei Lian ◽  
Eric Pop ◽  
Reinhold H. Dauskardt ◽  
...  
Keyword(s):  
High Performance ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Copper Nanowire ◽  
Vertically Aligned ◽  
Interface Materials

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2011 ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of Thermal Interface Materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device to spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs). As a result, nano-Thermal Interface Materials (nTIMs) have been conceived and studied in recent years, but few application-ready configurations have been produced and tested. Over the past year, we have undertaken major efforts to develop functional nTIMs based on short, vertically-aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1-D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. Nearly 200 samples have been tested utilizing myriad permutations of such parameters, contributing to a deeper understanding and optimization of CNT growth characteristics and application processing conditions. In addition, we have catalogued thermal resistance results from a variety of commercially-available, high-performance thermal pads and greases. In this paper, we describe our material structures and the parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2-K/W, independent of applied pressure. This value is significantly better than all commercial materials we tested and compares favorably with the best results reported for CNT-based nTIMs in an application-representative setting.

scholarly journals Graphene-Based Thermal Interface Materials: An Application-Oriented Perspective on Architecture Design

Polymers ◽  
2018 ◽  
Vol 10 (11) ◽  
pp. 1201 ◽  
Author(s):  
Le Lv ◽  
Wen Dai ◽  
Aijun Li ◽  
Cheng-Te Lin
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Electronic Devices ◽  
Point Of View ◽  
Future Research ◽  
Thermal Interface Materials ◽  
Research Directions ◽  
Thermal Interface ◽  
Future Research Directions ◽  
Interface Materials

With the increasing power density of electrical and electronic devices, there has been an urgent demand for the development of thermal interface materials (TIMs) with high through-plane thermal conductivity for handling the issue of thermal management. Graphene exhibited significant potential for the development of TIMs, due to its ultra-high intrinsic thermal conductivity. In this perspective, we introduce three state-of-the-art graphene-based TIMs, including dispersed graphene/polymers, graphene framework/polymers and inorganic graphene-based monoliths. The advantages and limitations of them were discussed from an application point of view. In addition, possible strategies and future research directions in the development of high-performance graphene-based TIMs are also discussed.

Fabrication of oriented hBN scaffolds for thermal interface materials

RSC Advances ◽  
2016 ◽  
Vol 6 (20) ◽  
pp. 16489-16494 ◽  
Author(s):  
Heng Shen ◽  
Chao Cai ◽  
Jing Guo ◽  
Zhenchao Qian ◽  
Ning Zhao ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Templating Method ◽  
Vertically Aligned ◽  
Interface Materials ◽  
Ice Templating

Three dimensional scaffolds of hBN microplatelets prepared by ice templating method are used to fabricate hBN/PDMS composites with vertically aligned hBN for thermal interface materials.

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