Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials

2017 ◽  
Vol 9 (36) ◽  
pp. 30909-30917 ◽  
Author(s):  
Jin Chen ◽  
Xingyi Huang ◽  
Bin Sun ◽  
Yuxin Wang ◽  
Yingke Zhu ◽  
...  
Keyword(s):  
Boron Nitride ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Boron Nitride Nanosheets ◽  
Vertically Aligned ◽  
Interface Materials

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

2012 ◽  
Vol 134 (2) ◽  
Author(s):  
Joseph R. Wasniewski ◽  
David H. Altman ◽  
Stephen L. Hodson ◽  
Timothy S. Fisher ◽  
Anuradha Bulusu ◽  
...  
Keyword(s):  
Steady State ◽  
High Performance ◽  
Applied Pressure ◽  
Test Facility ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Vertically Aligned ◽  
Performance Results ◽  
Interface Materials

The next generation of thermal interface materials (TIMs) are currently being developed to meet the increasing demands of high-powered semiconductor devices. In particular, a variety of nanostructured materials, such as carbon nanotubes (CNTs), are interesting due to their ability to provide low resistance heat transport from device-to-spreader and compliance between materials with dissimilar coefficients of thermal expansion (CTEs), but few application-ready configurations have been produced and tested. Recently, we have undertaken major efforts to develop functional nanothermal interface materials (nTIMs) based on short, vertically aligned CNTs grown on both sides of a thin interposer foil and interfaced with substrate materials via metallic bonding. A high-precision 1D steady-state test facility has been utilized to measure the performance of nTIM samples, and more importantly, to correlate performance to the controllable parameters. In this paper, we describe our material structures and the myriad permutations of parameters that have been investigated in their design. We report these nTIM thermal performance results, which include a best to-date thermal interface resistance measurement of 3.5 mm2 K/W, independent of applied pressure. This value is significantly better than a variety of commercially available, high-performance thermal pads and greases we tested, and compares favorably with the best results reported for CNT-based materials in an application-representative setting.

Fabrication of oriented hBN scaffolds for thermal interface materials

RSC Advances ◽  
2016 ◽  
Vol 6 (20) ◽  
pp. 16489-16494 ◽  
Author(s):  
Heng Shen ◽  
Chao Cai ◽  
Jing Guo ◽  
Zhenchao Qian ◽  
Ning Zhao ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Templating Method ◽  
Vertically Aligned ◽  
Interface Materials ◽  
Ice Templating

Three dimensional scaffolds of hBN microplatelets prepared by ice templating method are used to fabricate hBN/PDMS composites with vertically aligned hBN for thermal interface materials.

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

2015 ◽  
Vol 137 (3) ◽  
Author(s):  
Andrew J. McNamara ◽  
Yogendra Joshi ◽  
Zhuomin Zhang ◽  
Kyoung-sik Moon ◽  
Ziyin Lin ◽  
...  
Keyword(s):  
Carbon Nanotube ◽  
Thermal Resistance ◽  
Prolonged Exposure ◽  
Silicon Substrates ◽  
Thermal Interface Materials ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Ir Microscopy ◽  
Vertically Aligned ◽  
Interface Materials

Recently, much attention has been given to reducing the thermal resistance attributed to thermal interface materials (TIMs) in electronic devices, which contribute significantly to the overall package thermal resistance. Thermal transport measured experimentally through several vertically aligned carbon nanotube (VACNT) array TIMs anchored to copper and silicon substrates is considered. A steady-state infrared (IR) microscopy experimental setup was designed and utilized to measure the cross-plane total thermal resistance of VACNT TIMs. Overall thermal resistance for the anchored arrays ranged from 4 to 50 mm2 KW-1. These values are comparable to the best current TIMs used for microelectronic packaging. Furthermore, thermal stability after prolonged exposure to a high-temperature environment and thermal cycling tests shows limited deterioration for an array anchored using a silver-loaded thermal conductive adhesive (TCA).

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