Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene

2016 ◽  
Vol 8 (8) ◽  
pp. 5679-5686 ◽  
Author(s):  
Yong-Ho Ko ◽  
Jong-Dae Lee ◽  
Taeshik Yoon ◽  
Chang-Woo Lee ◽  
Taek-Soo Kim
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Layer By Layer ◽  
Lead Free Solder ◽  
Intermetallic Compound Growth ◽  
Free Solder

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

2019 ◽  
Vol 99 ◽  
pp. 62-73 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Jun-Hyuk Son ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Intermetallic Compound Growth ◽  
Free Solder

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

2017 ◽  
Vol 728 ◽  
pp. 992-1001 ◽  
Author(s):  
Junghwan Bang ◽  
Dong-Yurl Yu ◽  
Yong-Ho Ko ◽  
Min-Su Kim ◽  
Hiroshi Nishikawa ◽  
...  
Keyword(s):  
Mechanical Property ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Lead Free ◽  
Lead Free Solder ◽  
Compound Formation ◽  
Intermetallic Compound Formation ◽  
Free Solder

Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

2015 ◽  
Vol 815 ◽  
pp. 109-114 ◽  
Author(s):  
Yuan Wang ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Jing Wei Cheng ◽  
Hong Li ◽  
...  
Keyword(s):  
Shear Strength ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Melting Temperature ◽  
Hot Spot ◽  
Lead Free ◽  
Lead Free Solder ◽  
Interfacial Intermetallic Compound ◽  
Free Solder

The research on a new low-Ag lead-free solder has become a hot spot in the field of electronic packaging. In this work, the effects of Bi addition on microstructure, melting temperature, wettability of low-Ag solder, shear strength of solder joint and the growth of interfacial intermetallic compound (IMC) before and after thermal cycling were investigated. A moderate amount of Bi element resulted in the microstructural refinement and melting temperature reduction of Sn-0.2Ag-0.7Cu solder. Wetting test results showed that a small amount of Bi produced the significant effect on improving the wettability. In addition, it is shown that the thickness of interfacial IMC during thermal cycling decreased first and then increased; the shear strength of solder joint increased with the increase of Bi.

Sign in / Sign up

Export Citation Format

Share Document