Polydimethylsiloxane-Assisted Catalytic Printing for Highly Conductive, Adhesive, and Precise Metal Patterns Enabled on Paper and Textiles

2021 ◽  
Author(s):  
Ruisheng Guo ◽  
Haodong Li ◽  
Haoran Wang ◽  
Xiangyuan Zhao ◽  
Hong Yu ◽  
...  
Keyword(s):  
Conductive Adhesive

Anti-oxidation of Epoxy Resin Conductive Adhesive Copper Powder

2013 ◽  
Vol 30 (6) ◽  
pp. 677 ◽  
Author(s):  
Shimei DAI ◽  
Guangshuai HAN ◽  
Caigang DU ◽  
Yanmin GAO
Keyword(s):  
Epoxy Resin ◽  
Copper Powder ◽  
Conductive Adhesive

Experimental Investigation of Laser Sintering of Conductive Adhesive for Functional Prototypes Produced by Embedding Stereolithography

2014 ◽  
Vol 1038 ◽  
pp. 75-81
Author(s):  
Bernd Niese ◽  
Philipp Amend ◽  
Uwe Urmoneit ◽  
Stephan Roth ◽  
Michael Schmidt
Keyword(s):  
Thermal Damage ◽  
Laser Sintering ◽  
Conductive Adhesive ◽  
Flexible Production ◽  
Sintering Process ◽  
Building Process ◽  
In Situ Generation ◽  
Functional Components

Embedding stereolithography (eSLA) is an additive, hybrid process, which provides a flexible production of 3D components and the ability to integrate electrical and optical conductive structures and functional components within parts. However, the embedding of conductive circuits in stereolithography (SLA) parts assumes usage of process technologies, which enables their direct integration of conductive circuits during the layer-wise building process. In this context, a promising method for in-situ generation of conductive circuits is dispensing of conductive adhesive on the current surface of the SLA part and its subsequent sintering. In this paper, the laser sintering (λ = 355 nm) of conductive adhesive mainly consisting of silver nanoparticles is investigated. The work intends to evaluate the curing behavior of the conductive adhesive, the beam-matter-interactions and the thermal damage of the SLA substrate. The investigations revealed a fast and flexible laser sintering process for the generation of conductive circuits with sufficient electrical conductivity and sufficient current capacity load. In this context, a characterization of the conductive structures is done by measuring their electrical resistance and their potential current capacity load.

An investigation on shielding effectiveness of conductive adhesive

2020 ◽  
Vol 106 ◽  
pp. 113593
Author(s):  
Ligang Tan ◽  
Ziwen Li ◽  
Ning He ◽  
Yunxiu Xiang ◽  
Yanjing Zhang ◽  
...  
Keyword(s):  
Conductive Adhesive ◽  
Shielding Effectiveness

Study on a Conformal Shielding Structure With Conductive Adhesive Coated on Molding Compound in 3-D Packages

2016 ◽  
Vol 58 (2) ◽  
pp. 442-447 ◽  
Author(s):  
Yi He ◽  
Jun Li ◽  
Gengxin Tian ◽  
Fengman Liu ◽  
Liqiang Cao
Keyword(s):  
Conductive Adhesive ◽  
Molding Compound
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