scholarly journals Influence of Film and Substrate Structure on Photoelectron Momentum Maps of Coronene Thin Films on Ag(111)

2017 ◽  
Vol 121 (22) ◽  
pp. 12285-12293 ◽  
Author(s):  
Christian Udhardt ◽  
Felix Otto ◽  
Christian Kern ◽  
Daniel Lüftner ◽  
Tobias Huempfner ◽  
...  
Keyword(s):  
Thin Films ◽  
Momentum Maps ◽  
Substrate Structure

Substrate Latent Heat Effects in The Calculations for Pulsed Laser Irradiated Thin Films

1983 ◽  
Vol 13 ◽  
Author(s):  
J.J. Cao ◽  
K. Rose ◽  
O. Aina ◽  
W. Katz ◽  
J. Norton
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Pulsed Laser ◽  
Phase Changes ◽  
Morphological Observation ◽  
Substrate Structure ◽  
Heat Effects ◽  
Film Substrate ◽  
Scanning Electron ◽  
Pulsed Laser Irradiation

ABSTRACTWe present a numerical model for the calculation of the temperature rise caused by pulsed laser irradiation of a thin film/substrate structure. This model includes phase changes in both the thin film and the substrate. The inclusion of phase changes results in more complex thermal behavior and significantly affects melt durations. This model was applied to the AuGe/GaAs system. Morphological observation using the scanning electron microscope and SIMS profiles provides experimental verification for the numerical calculations.

Substrate structure dependence of the growth modes of p-quaterphenyl thin films on gold

2005 ◽  
Vol 484 (1-2) ◽  
pp. 408-414 ◽  
Author(s):  
S. Müllegger ◽  
S. Mitsche ◽  
P. Pölt ◽  
K. Hänel ◽  
A. Birkner ◽  
...  
Keyword(s):  
Thin Films ◽  
Structure Dependence ◽  
Substrate Structure ◽  
Growth Modes

Effect of Substrate on the Early Stages of the Growth of YBa2Cu3O7-δ Thin-Films

1990 ◽  
Vol 191 ◽  
Author(s):  
M. Grant Norton ◽  
C. Barry Carter
Keyword(s):  
Thin Films ◽  
Growth Process ◽  
Critical Role ◽  
Pulsed Laser ◽  
Pulsed Laser Ablation ◽  
High Quality ◽  
Ceramic Substrates ◽  
Early Stages ◽  
Substrate Structure ◽  
Transmission Electron

ABSTRACTThe fabrication of high-quality thin-films often depends on the early stages of the growth process during which epitaxy is established. The substrate structure and orientation generally play a critical role at this stage through epitaxy and interaction or reaction. Many different materials are being used as substrates to support thin-films of the YBa2Cu3O7-δ superconductors. In this study the early stages of the growth of YBa2Cu3O7-δ thin-films have been investigated using transmission electron microscopy (TEM). Using pulsed-laser ablation, ultra-thin films were formed directly onto self-supporting, ion-thinned, single-crystal ceramic substrates. The substrates used were (001)-oriented MgO, (001)-oriented SrTiO3 and (001)-oriented LaAlO3.

Influence of substrate structure on the growth of CdTe thin films

2001 ◽  
Vol 89 (11) ◽  
pp. 5944-5948 ◽  
Author(s):  
Y. Yan ◽  
R. G. Dhere ◽  
K. M. Jones ◽  
M. M. Al-Jassim
Keyword(s):  
Thin Films ◽  
Substrate Structure ◽  
Cdte Thin Films ◽  
Influence Of Substrate

The study of interfacial reactions of nickel thin films on GaAs

1983 ◽  
Vol 41 ◽  
pp. 156-157
Author(s):  
L.J. Chen ◽  
Y.F. Hsieh
Keyword(s):  
Thin Films ◽  
Integrated Circuits ◽  
Interfacial Reactions ◽  
Metal Contacts ◽  
Nickel Thin Films ◽  
Thin Foils ◽  
The Status ◽  
Si Doped ◽  
Electron Microscopes

One measure of the maturity of a device technology is the ease and reliability of applying contact metallurgy. Compared to metal contact of silicon, the status of GaAs metallization is still at its primitive stage. With the advent of GaAs MESFET and integrated circuits, very stringent requirements were placed on their metal contacts. During the past few years, extensive researches have been conducted in the area of Au-Ge-Ni in order to lower contact resistances and improve uniformity. In this paper, we report the results of TEM study of interfacial reactions between Ni and GaAs as part of the attempt to understand the role of nickel in Au-Ge-Ni contact of GaAs.N-type, Si-doped, (001) oriented GaAs wafers, 15 mil in thickness, were grown by gradient-freeze method. Nickel thin films, 300Å in thickness, were e-gun deposited on GaAs wafers. The samples were then annealed in dry N2 in a 3-zone diffusion furnace at temperatures 200°C - 600°C for 5-180 minutes. Thin foils for TEM examinations were prepared by chemical polishing from the GaA.s side. TEM investigations were performed with JE0L- 100B and JE0L-200CX electron microscopes.

Studies on Water in the Hydration Chamber of a Modified Electron Microscope

1970 ◽  
Vol 28 ◽  
pp. 544-545
Author(s):  
R. C. Moretz ◽  
G. G. Hausner ◽  
D. F. Parsons
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Electron Microscope ◽  
Steady State ◽  
Room Temperature ◽  
Small Mass ◽  
Equilibrium Pressure ◽  
Biological Objects ◽  
Mechanical Pump ◽  
Differential Pumping

Use of the electron microscope to examine wet objects is possible due to the small mass thickness of the equilibrium pressure of water vapor at room temperature. Previous attempts to examine hydrated biological objects and water itself used a chamber consisting of two small apertures sealed by two thin films. Extensive work in our laboratory showed that such films have an 80% failure rate when wet. Using the principle of differential pumping of the microscope column, we can use open apertures in place of thin film windows.Fig. 1 shows the modified Siemens la specimen chamber with the connections to the water supply and the auxiliary pumping station. A mechanical pump is connected to the vapor supply via a 100μ aperture to maintain steady-state conditions.

Nucleation and Early Growth of Sputtered thin Films

1970 ◽  
Vol 28 ◽  
pp. 516-517
Author(s):  
Dudley M. Sherman ◽  
Thos. E. Hutchinson
Keyword(s):  
Thin Films ◽  
Electron Beam ◽  
Ion Beam ◽  
Ion Source ◽  
Water Cooling ◽  
Stages Of Growth ◽  
Lens Assembly ◽  
Microscope Technique ◽  
Ion Beam Sputter Deposition

The in situ electron microscope technique has been shown to be a powerful method for investigating the nucleation and growth of thin films formed by vacuum vapor deposition. The nucleation and early stages of growth of metal deposits formed by ion beam sputter-deposition are now being studied by the in situ technique.A duoplasmatron ion source and lens assembly has been attached to one side of the universal chamber of an RCA EMU-4 microscope and a sputtering target inserted into the chamber from the opposite side. The material to be deposited, in disc form, is bonded to the end of an electrically isolated copper rod that has provisions for target water cooling. The ion beam is normal to the microscope electron beam and the target is placed adjacent to the electron beam above the specimen hot stage, as shown in Figure 1.

Macromolecular structures of biological specimens are not obscured by controlled osmium impregnation

1983 ◽  
Vol 41 ◽  
pp. 606-607
Author(s):  
Klaus-Ruediger Peters ◽  
Samuel A. Green
Keyword(s):  
Thin Films ◽  
Electrical Conductivity ◽  
Critical Point ◽  
Metal Films ◽  
High Magnification ◽  
Osmium Impregnation ◽  
Instrumental Resolution ◽  
20 Nm ◽  
Continuous Metal

High magnification imaging of macromolecules on metal coated biological specimens is limited only by wet preparation procedures since recently obtained instrumental resolution allows visualization of topographic structures as smal l as 1-2 nm. Details of such dimensions may be visualized if continuous metal films with a thickness of 2 nm or less are applied. Such thin films give sufficient contrast in TEM as well as in SEM (SE-I image mode). The requisite increase in electrical conductivity for SEM of biological specimens is achieved through the use of ligand mediated wet osmiuum impregnation of the specimen before critical point (CP) drying. A commonly used ligand is thiocarbohvdrazide (TCH), first introduced to TEM for en block staining of lipids and glvcomacromolecules with osmium black. Now TCH is also used for SEM. However, after ligand mediated osinification nonspecific osmium black precipitates were often found obscuring surface details with large diffuse aggregates or with dense particular deposits, 2-20 nm in size. Thus, only low magnification work was considered possible after TCH appl ication.

The Precipitation of Si in AlCuSi Thin Films

1973 ◽  
Vol 31 ◽  
pp. 34-35 ◽  
Author(s):  
R. M. Anderson
Keyword(s):  
Electron Microscopy ◽  
Thin Films ◽  
Heat Treatment ◽  
Solid Solution ◽  
Integrated Circuit ◽  
Copper Film ◽  
Solution Concentration ◽  
X Ray ◽  
Silicon Thin Films ◽  
Before And After

Aluminum-copper-silicon thin films have been considered as an interconnection metallurgy for integrated circuit applications. Various schemes have been proposed to incorporate small percent-ages of silicon into films that typically contain two to five percent copper. We undertook a study of the total effect of silicon on the aluminum copper film as revealed by transmission electron microscopy, scanning electron microscopy, x-ray diffraction and ion microprobe techniques as a function of the various deposition methods.X-ray investigations noted a change in solid solution concentration as a function of Si content before and after heat-treatment. The amount of solid solution in the Al increased with heat-treatment for films with ≥2% silicon and decreased for films <2% silicon.

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