scholarly journals Quasi-liquid Layers in Grooves of Grain Boundaries and on Grain Surfaces of Polycrystalline Ice Thin Films

2020 ◽  
Vol 20 (11) ◽  
pp. 7188-7196 ◽  
Author(s):  
Jialu Chen ◽  
Takao Maki ◽  
Ken Nagashima ◽  
Ken-ichiro Murata ◽  
Gen Sazaki
Keyword(s):  
Thin Films ◽  
Grain Boundaries ◽  
Polycrystalline Ice

Piezoelectric Response and Polarization-Dependent Conductivity of Grain Boundaries in BiFeO3 Thin Films

2019 ◽  
Author(s):  
D.O. Alikin ◽  
Y. Fomichov ◽  
S.P. Reis ◽  
A.S. Abramov ◽  
D.S. Chezganov ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Boundaries ◽  
Piezoelectric Response ◽  
Bifeo3 Thin Films

Atomic structure of [0001]-tilt grain boundaries in ZnO:  A high-resolution TEM study of fiber-textured thin films

2004 ◽  
Vol 70 (12) ◽  
Author(s):  
Fumiyasu Oba ◽  
Hiromichi Ohta ◽  
Yukio Sato ◽  
Hideo Hosono ◽  
Takahisa Yamamoto ◽  
...  
Keyword(s):  
Thin Films ◽  
High Resolution ◽  
Grain Boundaries ◽  
Atomic Structure ◽  
High Resolution Tem

scholarly journals Structural and Electrical Studies on ZnO-Based Thin Films by Laser Irradiation

2016 ◽  
Vol 2016 ◽  
pp. 1-6 ◽  
Author(s):  
Shanyue Zhao ◽  
Yinqun Hua ◽  
Ruifang Chen ◽  
Jian Zhang ◽  
Ping Ji
Keyword(s):  
Thin Films ◽  
Grain Size ◽  
Electrical Properties ◽  
Grain Boundaries ◽  
Laser Irradiation ◽  
Nonlinear Coefficient ◽  
Acceptor State ◽  
Xrd Pattern ◽  
Electrical Studies ◽  
Structural And Electrical Properties

The effects of laser irradiation on the structural and electrical properties of ZnO-based thin films were investigated. The XRD pattern shows that the thin films were highly textured along thec-axis and perpendicular to the surface of the substrate. Raman spectra reveal that Bi2O3segregates mainly at ZnO-ZnO grain boundaries. After laser irradiation processing, the grain size of the film was reduced significantly, and the intrinsic atomic defects of grain boundaries and Bi element segregated at the grain boundary were interacted frequently and formed the composite defects of acceptor state. The nonlinear coefficient increased to 24.31 and the breakdown voltage reduced to 5.34 V.

scholarly journals Charge transport mechanism in copper phthalocyanine thin films with and without traps

RSC Advances ◽  
2017 ◽  
Vol 7 (86) ◽  
pp. 54911-54919 ◽  
Author(s):  
Varsha Rani ◽  
Akanksha Sharma ◽  
Pramod Kumar ◽  
Budhi Singh ◽  
Subhasis Ghosh
Keyword(s):  
Thin Films ◽  
Charge Transport ◽  
Grain Boundaries ◽  
Transport Mechanism ◽  
Copper Phthalocyanine ◽  
Organic Thin Films ◽  
Interface States ◽  
Charge Transport Mechanism ◽  
Density Of Interface States

We investigate the charge transport mechanism in copper phthalocyanine thin films with and without traps. We find that the density of interface states at the grain boundaries can decide the mechanism of charge transport in organic thin films.

scholarly journals Polymer Charge Transport: Charge-Transport Anisotropy Due to Grain Boundaries in Directionally Crystallized Thin Films of Regioregular Poly(3-hexylthiophene) (Adv. Mater. 16/2009)

2009 ◽  
Vol 21 (16) ◽  
pp. NA-NA
Author(s):  
Leslie H. Jimison ◽  
Michael F. Toney ◽  
Iain McCulloch ◽  
Martin Heeney ◽  
Alberto Salleo
Keyword(s):  
Thin Films ◽  
Charge Transport ◽  
Grain Boundaries ◽  
Regioregular Poly

scholarly journals Increasing contribution of grain boundary compliance to polycrystalline ice elasticity as temperature increases

2018 ◽  
Vol 64 (246) ◽  
pp. 669-674
Author(s):  
COLIN M. SAYERS
Keyword(s):  
Grain Boundary ◽  
Grain Boundaries ◽  
Orientation Distribution ◽  
Resonant Ultrasound Spectroscopy ◽  
Wave Velocities ◽  
Polycrystalline Ice ◽  
Resonant Ultrasound ◽  
Increasing Temperature ◽  
Shear Compliance

ABSTRACTMeasured elastic stiffnesses of ice polycrystals decrease with increasing temperature due to a decrease in grain boundary stiffness with increasing temperature. In this paper, we represent grain boundaries as imperfectly bonded interfaces, across which traction is continuous, but displacement may be discontinuous. We express the additional compliance due to grain boundaries in terms of a second-rank and a fourth-rank tensor, which quantify the effect on elastic wave velocities of the orientation distribution as well as the normal and shear compliances of the grain boundaries. Measurement of the elastic stiffnesses allows determination of the components of these tensors. Application of the method to resonant ultrasound spectroscopy measurements made on ice polycrystals enables determination of the ratio BN/BS of the normal to shear compliance of the grain boundaries, which are found to be more compliant in shear than in compression. The ratio BN/BS is small at low temperatures, but increases as temperature increases, implying that the normal compliance increases relative to the shear compliance as temperature increases.

scholarly journals The effect of 45° grain boundaries and associated Fe particles on Jc and resistivity in Ba(Fe0.9Co0.1)2As2 thin films

2014 ◽  
Author(s):  
J. Hänisch ◽  
K. Iida ◽  
F. Kurth ◽  
T. Thersleff ◽  
S. Trommler ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Boundaries

Improvement of Thermal Conductivity of Electroplated Copper Thin-Film Interconnections by Controlling Their Micro Texture

2014 ◽  
Author(s):  
Pornvitoo Rittinon ◽  
Ken Suzuki ◽  
Hideo Miura
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Thermal Conductivity ◽  
Grain Boundaries ◽  
Diffraction Method ◽  
Electron Back Scatter Diffraction ◽  
High Resistivity ◽  
Copper Thin Film ◽  
Electroplated Copper ◽  
The Relationship

Copper thin films are indispensable for the interconnections in the advanced electronic products, such as TSV (Trough Silicon Via), fine bumps, and thin-film interconnections in various devices and interposers. However, it has been reported that both electrical and mechanical properties of the films vary drastically comparing with those of conventional bulk copper. The main reason for the variation can be attributed to the fluctuation of the crystallinity of grain boundaries in the films. Porous or sparse grain boundaries show very high resistivity and brittle fracture characteristic in the films. Thus, the thermal conductivity of the electroplated copper thin films should be varied drastically depending on their micro texture based on the Wiedemann-Franz’s law. Since the copper interconnections are used not only for the electrical conduction but also for the thermal conduction, it is very important to quantitatively evaluate the crystallinity of the polycrystalline thin-film materials and clarify the relationship between the crystallinity and thermal properties of the films. The crystallinity of the interconnections were quantitatively evaluated using an electron back-scatter diffraction method. It was found that the porous grain boundaries which contain a significant amount of vacancies increase the local electrical resistance in the interconnections, and thus, cause the local high Joule heating. Such porous grain boundaries can be eliminated by control the crystallinity of the seed layer material on which the electroplated copper thin film is electroplated.

scholarly journals Preferential void formation at crystallographically ordered grain boundaries in nanotwinned copper thin films

2015 ◽  
Vol 96 ◽  
pp. 284-291 ◽  
Author(s):  
Thomas LaGrange ◽  
Kazuto Arakawa ◽  
Hidehiro Yasuda ◽  
Mukul Kumar
Keyword(s):  
Thin Films ◽  
Grain Boundaries ◽  
Void Formation
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