Hollow Interior Structure of Spin-Coated Polymer Thin Films Revealed by ToF-SIMS Three-Dimensional Imaging

2012 ◽  
Vol 84 (20) ◽  
pp. 8497-8504 ◽  
Author(s):  
Xianwen Ren ◽  
Lu-Tao Weng ◽  
Chi-Ming Chan ◽  
Kai-Mo Ng
Keyword(s):  
Thin Films ◽  
Polymer Thin Films ◽  
Three Dimensional ◽  
Interior Structure ◽  
Three Dimensional Imaging ◽  
Tof Sims ◽  
Hollow Interior

Investigating the chain conformations of spin-coated polymer thin films by ToF-SIMS depth profiling

2015 ◽  
Vol 47 (10) ◽  
pp. 953-960 ◽  
Author(s):  
Xianwen Ren ◽  
Lu-Tao Weng ◽  
Yi Fu ◽  
Kai-Mo Ng ◽  
Chi-Ming Chan
Keyword(s):  
Thin Films ◽  
Polymer Thin Films ◽  
Depth Profiling ◽  
Tof Sims ◽  
Chain Conformations ◽  
Sims Depth Profiling

Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration

2001 ◽  
Vol 710 ◽  
Author(s):  
Y. Kwon ◽  
J.-Q. Lu ◽  
R. P. Kraft ◽  
J. F. McDonald ◽  
R.J. Gutmann ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Stability ◽  
Wafer Bonding ◽  
Polymer Thin Films ◽  
Three Dimensional ◽  
Bonding Process ◽  
3D Integration ◽  
Razor Blade ◽  
Chemical Structures ◽  
Dielectric Polymer

ABSTRACTA key process in our approach to monolithic three-dimensional (3D) integration is the bonding of 200-mm wafers using dielectric polymer thin films as bonding glues. After discussing the desired properties of polymer thin films, we describe how bonding protocols are evaluated using silicon and glass wafers. After bonding, the fraction of bonded area was inspected optically and a razor blade method was used to indicate bonding strength. Thermal stability and bonding integrity were evaluated using thermal cycling and backside grinding and polishing. To date, we have studied benzocyclobutene (BCB), Flare™, and methylsilsesquioxane (MSSQ) and Parylene-N as bonding glues. Wafer pairs bonded using BCB showed a larger fraction of bonded area, and those using Flare indicated higher thermal stability. Both BCB and Flare glues provided good bonding integrity after backside grinding tests. Changes in the chemical structures of BCB and Flare glue during bonding were analyzed using FTIR in order to understand the bonding mechanism and to improve the bonding process.

Additive quantification on polymer thin films by ToF-SIMS: aging sample effects

2004 ◽  
Vol 231-232 ◽  
pp. 269-273 ◽  
Author(s):  
Claude Poleunis ◽  
Nicolas Médard ◽  
Patrick Bertrand
Keyword(s):  
Thin Films ◽  
Polymer Thin Films ◽  
Tof Sims

The Role of Three-Dimensional Imaging in Evaluation of the Sinonasal Mass

1996 ◽  
Vol 34 (1) ◽  
pp. 27
Author(s):  
Sue Yon Shim ◽  
Ki Joon Sung ◽  
Young Ju Kim ◽  
In Soo Hong ◽  
Myung Soon Kim ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Three Dimensional Imaging ◽  
Sinonasal Mass

Synchrotron and neutron laminography for three-dimensional imaging of devices and flat material specimens

2012 ◽  
Vol 103 (2) ◽  
pp. 170-173 ◽  
Author(s):  
Lukas Helfen ◽  
Thilo F. Morgeneyer ◽  
Feng Xu ◽  
Mark N. Mavrogordato ◽  
Ian Sinclair ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Three Dimensional Imaging
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