Thermal Stress and Failure Location Analysis for Through Silicon via in 3D Integration

2015 ◽  
Vol 32 (1) ◽  
pp. 47-53 ◽  
Author(s):  
H.-Y. Tsai ◽  
C.-W. Kuo
Keyword(s):  
Thermal Expansion ◽  
Thermal Stress ◽  
High Temperature ◽  
Stress Distribution ◽  
Surface Area ◽  
Dielectric Material ◽  
Three Dimensional ◽  
3D Integration ◽  
Element Analysis ◽  
Through Silicon Via

AbstractThrough silicon via (TSV) is the critical structure for three dimensional (3D) integration, which provides vertical interconnection between stacking dies. In TSV structure, large coefficient differences of thermal expansion exist between silicon substrate, dielectric material, and filled metal. Due to the large thermal mismatch, the high thermal stress occurring at the interface of different materials would result in delamination. Therefore, thermal-mechanical reliability is a key issue for 3D integration. In this study, we investigated the thermal-mechanical stress distribution of TSV under the condition of the accelerated thermal cycling loading by finite element analysis based on a 3D model of TSV structure. Due to the thermal expansion, that the TSV structure squeezed the surface area between TSVs at a high temperature resulted in compressive stresses at the surface area between TSVs. Therefore, a proper distance between the stress-sensitive device and the TSV should be kept. The stress analysis shows that the maximum thermal stress occurs in the outside region of TSV interface and in the annular region of TSV at a high temperature and at a low temperature, respectively. This study helps to obtain a clear thermal stress distribution of TSV and possible failure regions can be determined.

scholarly journals Three-Dimensional Finite Element Analysis of Stress Distribution in a Tooth Restored with Full Coverage Machined Polymer Crown

2021 ◽  
Vol 11 (3) ◽  
pp. 1220
Author(s):  
Azeem Ul Yaqin Syed ◽  
Dinesh Rokaya ◽  
Shirin Shahrbaf ◽  
Nicolas Martin
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Distribution ◽  
Three Dimensional ◽  
Intraoral Scanner ◽  
Element Analysis ◽  
Dental Ceramic ◽  
Dimensional Finite Element ◽  
Three Dimensional Finite Element ◽  
Ceramic Crown

The effect of a restored machined hybrid dental ceramic crown–tooth complex is not well understood. This study was conducted to determine the effect of the stress state of the machined hybrid dental ceramic crown using three-dimensional finite element analysis. Human premolars were prepared to receive full coverage crowns and restored with machined hybrid dental ceramic crowns using the resin cement. Then, the teeth were digitized using micro-computed tomography and the teeth were scanned with an optical intraoral scanner using an intraoral scanner. Three-dimensional digital models were generated using an interactive image processing software for the restored tooth complex. The generated models were imported into a finite element analysis software with all degrees of freedom concentrated on the outer surface of the root of the crown–tooth complex. To simulate average occlusal load subjected on a premolar a total load of 300 N was applied, 150 N at a buccal incline of the palatal cusp, and palatal incline of the buccal cusp. The von Mises stresses were calculated for the crown–tooth complex under simulated load application was determined. Three-dimensional finite element analysis showed that the stress distribution was more in the dentine and least in the cement. For the cement layer, the stresses were more concentrated on the buccal cusp tip. In dentine, stress was more on the cusp tips and coronal 1/3 of the root surface. The conventional crown preparation is a suitable option for machined polymer crowns with less stress distribution within the crown–tooth complex and can be a good aesthetic replacement in the posterior region. Enamic crowns are a good viable option in the posterior region.

Finite Element Analysis of Poor Distal Contact of the Femoral Component of a Cementless Hip Endoprosthesis

1993 ◽  
Vol 207 (4) ◽  
pp. 255-261 ◽  
Author(s):  
M Taylor ◽  
E W Abel
Keyword(s):  
Finite Element ◽  
Stress Distribution ◽  
Influencing Factor ◽  
Three Dimensional ◽  
Stress Distributions ◽  
Element Analysis ◽  
Hip Endoprosthesis ◽  
Applied Loading ◽  
Femoral Geometry ◽  
Contact Models

The difficulty of achieving good distal contact between a cementless hip endoprosthesis and the femur is well established. This finite element study investigates the effect on the stress distribution within the femur due to varying lengths of distal gap. Three-dimensional anatomical models of two different sized femurs were generated, based upon computer tomograph scans of two cadaveric specimens. A further six models were derived from each original model, with distal gaps varying from 10 to 60 mm in length. The resulting stress distributions within these were compared to the uniform contact models. The extent to which femoral geometry was an influencing factor on the stress distribution within the bone was also studied. Lack of distal contact with the prosthesis was found not to affect the proximal stress distribution within the femur, for distal gap lengths of up to 60 mm. In the region of no distal contact, the stress within the femur was at normal physiological levels associated with the applied loading and boundary conditions. The femoral geometry was found to have little influence on the stress distribution within the cortical bone. Although localized variations were noted, both femurs exhibited the same general stress distribution pattern.

Finite Element Analysis of Thermal Stress Distribution in Planar SOFC

2019 ◽  
Vol 7 (1) ◽  
pp. 1977-1986 ◽  
Author(s):  
Chih-Kuang Lin ◽  
Tsung-Ting Chen ◽  
An-Shin Chen ◽  
Yau-Pin Chyou ◽  
Lieh-Kwang Chiang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Thermal Stress ◽  
Stress Distribution ◽  
Element Analysis ◽  
Thermal Stress Distribution

scholarly journals Three-Dimensional Finite Element Analysis of the Veneer—Framework Thickness in an All-Ceramic Implant Supported Fixed Partial Denture

Ceramics ◽  
2021 ◽  
Vol 4 (2) ◽  
pp. 199-207
Author(s):  
Lohitha Kalluri ◽  
Bernard Seale ◽  
Megha Satpathy ◽  
Josephine F. Esquivel-Upshaw ◽  
Yuanyuan Duan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Distribution ◽  
Three Dimensional ◽  
Ct Scanner ◽  
Element Analysis ◽  
Partial Denture ◽  
Fixed Partial Denture ◽  
Occlusal Surfaces ◽  
All Ceramic

This study was performed as an adjunct to an existing clinical study to validate the effect of veneer: framework thickness ratio on stress distribution in an implant-supported all-ceramic fixed partial denture. Two commercially available titanium dental implants with corresponding customized abutments and a patient-retrieved all-ceramic fixed partial denture were scanned using a high-resolution micro-CT scanner. Reconstructed 3D objects, along with a simulated bone surface, were incorporated into a non-manifold assembly and meshed simultaneously using Simpleware software (Synopsys Simpleware ScanIP Version P-2019.09; Mountain View, CA). Three such volume meshes (Model A, Model B, Model C) corresponding to veneer: framework thickness ratios of 3:1, 1:1, and 1:3 respectively were created, and exported to a finite element analysis software (ABAQUS). An axial load of 110 N was applied uniformly on the occlusal surfaces to calculate the static stresses and contour plots were generated in the post-processing module. From the data obtained, we observed optimum stress distribution in Model B. Also, the tensile stresses were concentrated in the posterior connector region of the prosthesis in all three models tested. Within the limitations of this study, we can conclude that equal thickness of veneer and framework layers would aid in better stress distribution.

scholarly journals Biomechanical assessment of different fixation methods in mandibular high sagittal oblique osteotomy using a three-dimensional finite element analysis model

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Charles Savoldelli ◽  
Elodie Ehrmann ◽  
Yannick Tillier
Keyword(s):  
Finite Element ◽  
Stress Distribution ◽  
Three Dimensional ◽  
Von Mises Stress ◽  
Analysis Model ◽  
Element Analysis ◽  
Fixation Methods ◽  
Oblique Osteotomy ◽  
Von Mises

AbstractWith modern-day technical advances, high sagittal oblique osteotomy (HSOO) of the mandible was recently described as an alternative to bilateral sagittal split osteotomy for the correction of mandibular skeletal deformities. However, neither in vitro nor numerical biomechanical assessments have evaluated the performance of fixation methods in HSOO. The aim of this study was to compare the biomechanical characteristics and stress distribution in bone and osteosynthesis fixations when using different designs and placing configurations, in order to determine a favourable plating method. We established two finite element models of HSOO with advancement (T1) and set-back (T2) movements of the mandible. Six different configurations of fixation of the ramus, progressively loaded by a constant force, were assessed for each model. The von Mises stress distribution in fixations and in bone, and bony segment displacement, were analysed. The lowest mechanical stresses and minimal gradient of displacement between the proximal and distal bony segments were detected in the combined one-third anterior- and posterior-positioned double mini-plate T1 and T2 models. This suggests that the appropriate method to correct mandibular deformities in HSOO surgery is with use of double mini-plates positioned in the anterior one-third and posterior one-third between the bony segments of the ramus.

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

scholarly journals Fabrication of Optimally Micro-Textured Copper Substrates by Plasma Printing for Plastic Mold Packaging

2020 ◽  
Vol 14 (2) ◽  
pp. 200-207 ◽  
Author(s):  
Tatsuhiko Aizawa ◽  
Yasuo Saito ◽  
Hideharu Hasegawa ◽  
Kenji Wasa ◽  
◽  
...  
Keyword(s):  
Stress Distribution ◽  
Copper Substrate ◽  
Three Dimensional ◽  
Picosecond Laser ◽  
Numerical Control ◽  
Uniform Stress ◽  
Element Analysis ◽  
Micro Grooving ◽  
Plastic Mold ◽  
Screen Printed

Micro-embossing using plasma printed micro-punch was proposed to form micro-groove textures into the copper substrate for plastic packaging of hollowed GaN HEMT-chips. In particular, the micro-groove network on the copper substrate was optimized to attain uniform stress distribution with maximum stress level being as low as possible. Three-dimensional finite element analysis was employed to investigate the optimum micro-grooving texture-topology and to attain the uniform stress distribution on the joined interface between the plastic mold and the textured copper substrate. Thereafter, plasma printing was utilized to fabricate the micro-punch for micro-embossing of the micro-grooving network into the copper substrate as a designed optimum micro-texture. This plasma printing mainly consisted of three steps. Two-dimensional micro-pattern was screen-printed onto the AISI316 die surface as a negative pattern of the optimum CAD data. The screen-printed die was plasma nitrided at 673 K for 14.4 ks at 70 Pa under the hydrogen-nitrogen mixture for selective nitrogen supersaturation onto the unprinted die surfaces. A micro-punch was developed by mechanically removing the printed parts of die material. Then, fine computer numerical control (CNC) stamping was used to yield the micro-embossed copper substrate specimens. Twelve micro-textured substrates were molded into packaged specimens by plastic molding. Finally, gross leak testing was employed to evaluate the integrity of the joined interface. The takt time required to yield the micro-grooved copper substrate by the present method was compared to the picosecond laser micro-grooving; the former showed high productivity based on this parameter.

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