Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles

2013 ◽  
Vol 529 ◽  
pp. 29-33 ◽  
Author(s):  
Nao Shinoda ◽  
Tetsuya Shimizu ◽  
Tso-Fu Mark Chang ◽  
Akinobu Shibata ◽  
Masato Sone
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