Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

2012 ◽  
Vol 97 ◽  
pp. 126-129 ◽  
Author(s):  
Nao Shinoda ◽  
Tetsuya Shimizu ◽  
Tso-Fu Mark Chang ◽  
Akinobu Shibata ◽  
Masato Sone
Keyword(s):  
Carbon Dioxide ◽  
Supercritical Carbon Dioxide ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Cu Electroplating ◽  
Supercritical Carbon

scholarly journals Electrochemistry in supercritical fluids

2015 ◽  
Vol 373 (2057) ◽  
pp. 20150007 ◽  
Author(s):  
Jack A. Branch ◽  
Philip N. Bartlett
Keyword(s):  
Carbon Dioxide ◽  
Supercritical Carbon Dioxide ◽  
Aspect Ratio ◽  
Double Layer ◽  
Supercritical Fluids ◽  
High Aspect Ratio ◽  
Double Layer Capacitance ◽  
Wide Range ◽  
Systems Studies ◽  
Electrodeposition Of Metals

A wide range of supercritical fluids (SCFs) have been studied as solvents for electrochemistry with carbon dioxide and hydrofluorocarbons (HFCs) being the most extensively studied. Recent advances have shown that it is possible to get well-resolved voltammetry in SCFs by suitable choice of the conditions and the electrolyte. In this review, we discuss the voltammetry obtained in these systems, studies of the double-layer capacitance, work on the electrodeposition of metals into high aspect ratio nanopores and the use of metallocenes as redox probes and standards in both supercritical carbon dioxide–acetonitrile and supercritical HFCs.

Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles

2013 ◽  
Vol 529 ◽  
pp. 29-33 ◽  
Author(s):  
Nao Shinoda ◽  
Tetsuya Shimizu ◽  
Tso-Fu Mark Chang ◽  
Akinobu Shibata ◽  
Masato Sone
Keyword(s):  
Carbon Dioxide ◽  
Supercritical Carbon Dioxide ◽  
Copper Sulfate ◽  
Cu Electroplating ◽  
Supercritical Carbon
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