Effect of grain size distribution on the grain boundary electrical response of 2D and 3D polycrystals

2006 ◽  
Vol 177 (35-36) ◽  
pp. 3117-3121 ◽  
Author(s):  
G DEZANNEAU ◽  
A MORATA ◽  
A TARANCON ◽  
F PEIRO ◽  
J MORANTE
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Size Distribution ◽  
Grain Size Distribution ◽  
Electrical Response ◽  
2D And 3D

scholarly journals Influence of Grain Size Distribution on Ductile Intergranular Crack Growth Resistance

2019 ◽  
Vol 87 (3) ◽  
Author(s):  
Abhilash Molkeri ◽  
Ankit Srivastava ◽  
Shmuel Osovski ◽  
Alan Needleman
Keyword(s):  
Grain Size ◽  
Finite Element ◽  
Grain Boundary ◽  
Size Distribution ◽  
Crack Growth ◽  
Grain Size Distribution ◽  
Intergranular Crack ◽  
Crack Growth Resistance ◽  
Full Field ◽  
Finite Element Calculations

Abstract The influence of grain size distribution on ductile intergranular crack growth resistance is investigated using full-field microstructure-based finite element calculations and a simpler model based on discrete unit events and graph search. The finite element calculations are carried out for a plane strain slice with planar grains subjected to mode I small-scale yielding conditions. The finite element formulation accounts for finite deformations, and the constitutive relation models the loss of stress carrying capacity due to progressive void nucleation, growth, and coalescence. The discrete unit events are characterized by a set of finite element calculations for crack growth at a single-grain boundary junction. A directed graph of the connectivity of grain boundary junctions and the distances between them is used to create a directed graph in J-resistance space. For a specified grain boundary distribution, this enables crack growth resistance curves to be calculated for all possible crack paths. Crack growth resistance curves are calculated based on various path choice criteria and compared with the results of full-field finite element calculations of the initial boundary value problem. The effect of unimodal and bimodal grain size distributions on intergranular crack growth is considered. It is found that a significant increase in crack growth resistance is obtained if the difference in grain sizes in the bimodal grain size distribution is sufficiently large.

Simulation of the Kinetics of Grain-Boundary Nucleated Phase Transformations

2011 ◽  
Vol 172-174 ◽  
pp. 1128-1133 ◽  
Author(s):  
Eric A. Jägle ◽  
Eric J. Mittemeijer
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Phase Transformations ◽  
Size Distribution ◽  
Grain Size Distribution ◽  
Kinetic Models ◽  
Micro Structure ◽  
Boundary Area ◽  
Random Nucleation ◽  
Kinetics Of

The kinetics of phase transformations for which nucleation occurs on parent-micro-structure grain boundaries, and the resulting microstructures, were investigated by means ofgeometric simulations. The influences of parent microstructure grain-boundary area density,parent grain-size distribution and parent→product kinetics were analysed. Additionally, thesimulated kinetics were compared with predictions from two kinetic models, namely a modelproposed for spatially random nucleation and a model proposed for grain-boundary nucleation.It was found that the simulated transformed fraction as function of time lies in between the twomodel predictions for all investigated parent microstructures and parent→product kinetics.

Improved efficiency of CdZnS thin-film solar cells

1985 ◽  
Vol 63 (6) ◽  
pp. 716-718 ◽  
Author(s):  
S. Chandrasekhar ◽  
S. Martinuzzi ◽  
F. Z. Nataren
Keyword(s):  
Thin Film ◽  
Grain Size ◽  
Solar Cells ◽  
Grain Boundary ◽  
Size Distribution ◽  
Grain Size Distribution ◽  
Ternary Compound ◽  
Thin Film Solar Cells ◽  
Base Layer ◽  
Cds Films

For low Zn concentrations i.e., x < 0.1, the performance of the Cd1−xZnxS–Cu2S solar cells can be improved by reducing the grain-boundary recombination. This has been achieved by growing well-oriented, homogeneous, ternary compound films.It was found that the Cd1−xZnxS films grown on the polycrystalline CdS films achieved the same larger grain size as that of the base layer. These films had fewer misorientations and had a unimodal grain-size distribution. There is a continuity in the crystallites from the CdS base to the Cd1−xZnxS overlayer, and the bifilms thus grown are less resistive than Cd1−xZnxS single layers.

scholarly journals Influence of Grain Size Distribution on Ductile Intergranular Crack Growth Resistance

2020 ◽  
Author(s):  
Abhilash Molkeri ◽  
Ankit Srivastava ◽  
shmuel osovski ◽  
Alan Needleman
Keyword(s):  
Grain Size ◽  
Finite Element ◽  
Grain Boundary ◽  
Size Distribution ◽  
Crack Growth ◽  
Grain Size Distribution ◽  
Intergranular Crack ◽  
Crack Growth Resistance ◽  
Full Field ◽  
Finite Element Calculations

The influence of grain size distribution on ductile intergranular crack growth resistance is investigated using full-field microstructure-based finite element calculations and a simpler model based on discrete unit events and graph search. The finite element calculations are carried out for a plane strain slice with planar grains subjected to mode I small-scale yielding conditions. The finite element formulation accounts for finite deformations, and the constitutive relation models the loss of stress carrying capacity due to progressive void nucleation, growth, and coalescence. The discrete unit events are characterized by a set of finite element calculations for crack growth at a single-grain boundary junction. A directed graph of the connectivity of grain boundary junctions and the distances between them is used to create a directed graph in J-resistance space. For a specified grain boundary distribution, this enables crack growth resistance curves to be calculated for all possible crack paths. Crack growth resistance curves are calculated based on various path choice criteria and compared with the results of full-field finite element calculations of the initial boundary value problem. The effect of unimodal and bimodal grain size distributions on intergranular crack growth is considered. It is found that a significant increase in crack growth resistance is obtained if the difference in grain sizes in the bimodal grain size distribution is sufficiently large.

Grain-boundary resistivity versus grain size distribution in three-dimensional polycrystals

2006 ◽  
Vol 88 (14) ◽  
pp. 141920 ◽  
Author(s):  
G. Dezanneau ◽  
A. Morata ◽  
A. Tarancón ◽  
M. Salleras ◽  
F. Peiró ◽  
...  
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Size Distribution ◽  
Grain Size Distribution ◽  
Three Dimensional ◽  
Grain Boundary Resistivity

Effect of Grain Size Distribution on the Local Mechanical Behavior of Nanocrystalline Materials

2011 ◽  
Vol 682 ◽  
pp. 153-158
Author(s):  
Ying Guang Liu ◽  
Jian Qiu Zhou
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Size Distribution ◽  
Grain Size Distribution ◽  
Boundary Diffusion ◽  
Mechanical Response ◽  
Grain Boundary Sliding ◽  
Internal Stresses ◽  
Boundary Sliding ◽  
Log Normal

A theoretical model based on self-consistent approximation is proposed to explore the effect of grain size distribution on the local mechanical response of nanocrystalline (nc) materials. The representative volume element (RVE) is composed of grains randomly distributed with a grain size distribution following a log-normal statistical function. The grain interior and grain boundary are taken as an integral object to sustain deformation mechanisms of grain-boundary sliding, grain-boundary diffusion and grain-interior plasticity. Local plastic strains and internal stresses, developing within the RVE, have been recorded and discussed.

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