Improved efficiency of CdZnS thin-film solar cells

1985 ◽  
Vol 63 (6) ◽  
pp. 716-718 ◽  
Author(s):  
S. Chandrasekhar ◽  
S. Martinuzzi ◽  
F. Z. Nataren

For low Zn concentrations i.e., x < 0.1, the performance of the Cd1−xZnxS–Cu2S solar cells can be improved by reducing the grain-boundary recombination. This has been achieved by growing well-oriented, homogeneous, ternary compound films.It was found that the Cd1−xZnxS films grown on the polycrystalline CdS films achieved the same larger grain size as that of the base layer. These films had fewer misorientations and had a unimodal grain-size distribution. There is a continuity in the crystallites from the CdS base to the Cd1−xZnxS overlayer, and the bifilms thus grown are less resistive than Cd1−xZnxS single layers.

1972 ◽  
Vol 27 (8-9) ◽  
pp. 1286-1294
Author(s):  
L. Küfe ◽  
G. Schneider

Abstract CdS thin film solar cells with a p-Cu2S - n-CdS-heterojunction were made by vacuum evaporation of CdS films on Mo substrates and dipping of these films into Cu+-ion solution. The influence of various annealing times and repeated dipping into Cu+-ion solution were investigated and discussed. Etching the CdS films with various etchants gave different results. In this way the solar cells yielded efficiencies up to 5.2%. The influence of interfaces of Ag and Zn between the Mo-substrat and the CdS film was studied.


1998 ◽  
Vol 523 ◽  
Author(s):  
Wei Chen ◽  
Joe Hooker ◽  
Kathy Monarch ◽  
Peter Fejes ◽  
Peir Chu

AbstractMicrostructures of Barium Strontium Titanate (Ba, Sr)TiO3 [BST] thin film play an important role in determining the electrical properties of BST. In particular, it is found that the grain size distribution as a function of deposition conditions correlates with the dielectric constant of BST film. Traditionally, Transmission Electron Microscopy (TEM) provides an accurate method for determining microstructures such as interface structure between BST and electrodes and BST grain size distribution. However, TEM analysis relies heavily upon successful sample preparation, and film adhesion for BST proves to be a difficult problem to overcome for successful sample preparation. With the state of the art Scanning Electron Microscope (SEM) and Atomic Force Microscopy (AFM), useful information can be obtained for BST and electrode microstructures requiring little or no sample preparation. A good correlation among TEM, SEM and AFM techniques is achieved which allows useful information of BST grain size distribution to he obtained via SEM and AFM analyses. Power spectral density (PSD) analysis of contrast enhanced AFM images proves to be an efficient method for estimating BST grain size distribution.


2020 ◽  
Vol 29 (9) ◽  
pp. 098802
Author(s):  
Jun Wang ◽  
Yuquan Wang ◽  
Cong Liu ◽  
Meiling Sun ◽  
Cao Wang ◽  
...  

2019 ◽  
Vol 128 ◽  
pp. 421-427 ◽  
Author(s):  
Hadi Nazem ◽  
Hedayat Pourasiab Dizaj ◽  
Nima E. Gorji

2019 ◽  
Vol 87 (3) ◽  
Author(s):  
Abhilash Molkeri ◽  
Ankit Srivastava ◽  
Shmuel Osovski ◽  
Alan Needleman

Abstract The influence of grain size distribution on ductile intergranular crack growth resistance is investigated using full-field microstructure-based finite element calculations and a simpler model based on discrete unit events and graph search. The finite element calculations are carried out for a plane strain slice with planar grains subjected to mode I small-scale yielding conditions. The finite element formulation accounts for finite deformations, and the constitutive relation models the loss of stress carrying capacity due to progressive void nucleation, growth, and coalescence. The discrete unit events are characterized by a set of finite element calculations for crack growth at a single-grain boundary junction. A directed graph of the connectivity of grain boundary junctions and the distances between them is used to create a directed graph in J-resistance space. For a specified grain boundary distribution, this enables crack growth resistance curves to be calculated for all possible crack paths. Crack growth resistance curves are calculated based on various path choice criteria and compared with the results of full-field finite element calculations of the initial boundary value problem. The effect of unimodal and bimodal grain size distributions on intergranular crack growth is considered. It is found that a significant increase in crack growth resistance is obtained if the difference in grain sizes in the bimodal grain size distribution is sufficiently large.


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