Experimental performance evaluation and modeling of jet impingement cooling for thermal management of photovoltaics

Solar Energy ◽  
2016 ◽  
Vol 135 ◽  
pp. 605-617 ◽  
Author(s):  
Haitham M.S. Bahaidarah
Keyword(s):  
Performance Evaluation ◽  
Thermal Management ◽  
Jet Impingement ◽  
Impingement Cooling ◽  
Experimental Performance

Jet Impingement Cooling Using Micro Channels in Low Temperature Cofire Ceramic (LTCC) Substrates

2005 ◽  
Author(s):  
W. Kinzy Jones ◽  
Surya Kappagantula ◽  
Marc Zampino
Keyword(s):  
Thermal Management ◽  
Flip Chip ◽  
Heat Removal ◽  
Jet Impingement ◽  
Thermal Testing ◽  
Thermal Impedance ◽  
Impingement Cooling ◽  
Micro Channels ◽  
Solder Balls ◽  
Single Jet

With power densities near 200 W/cm2 for devices, new methods for thermal management from the heat generation at the die to heat removal to the ambient must be addressed. Signal interconnect and thermal management are often decoupled, with the I/Os from the substrate to the chip through flip chip solder balls and heat removed through the backside of the chip. However, interconnect substrates could provide both first level interconnect and fluid cooling thermal management. Providing micro channels in the same dimension as the interconnect pitch in the substrate allows for new and novel cooling methods to be integrated at the lowest level of chip assembly. X-Y micro channels less than 2 5 m wide and Z dimension channels 4 5 m wide were fabricated within the LTCC substrate. The integrated micro channels allow for direct jet impingement cooling. Initial thermal testing using single jet impingement demonstrated over a 200X reduction in thermal impedance.

MEMS-Based Spatial and Temporal Thermal Management of High Heat Flux Electronics

2003 ◽  
Author(s):  
Cristina H. Amon ◽  
S. C. Yao
Keyword(s):  
Thermal Management ◽  
Surface Texturing ◽  
Jet Impingement ◽  
Heat Fluxes ◽  
Dielectric Fluid ◽  
Practical Implementation ◽  
High Heat Flux ◽  
Droplet Impingement ◽  
Micro Manufacturing ◽  
Impingement Cooling

This presentation describes the development of EDIFICE: Embedded Droplet Impingement For Integrated Cooling of Electronics. The EDIFICE project seeks to develop an integrated droplet impingement cooling device for removing chip heat fluxes over 100 W/cm2, employing latent heat of vaporization of dielectric fluids. Micro-manufacturing and MEMS (Micro Electro-Mechanical Systems) will be discussed as enabling technologies for innovative cooling schemes recently proposed. Micro-spray nozzles are fabricated to produce 50–100 micron droplets coupled with surface texturing on the backside of the chip to promote droplet spreading and effective evaporation. A novel feature to enable adaptive on-demand cooling is MEMS sensing (on-chip temperature, remote IR temperature and ultrasonic dielectric film thickness) and MEMS actuation. EDIFICE is integrated within the electronics package and fabricated using advanced micro-manufacturing technologies (e.g., Deep Reactive lon Etching (DRIE) and CMOS CMU-MEMS). The development of EDIFICE involves modeling, CFD simulations, and physical experimentation on test beds. This lecture will then examine jet impingement cooling of EDIFICE with a dielectric coolant and the influence of fluid properties, micro spray characteristics, and surface evaporation. The development of micro nozzles, micro-structured surface texturing, and the system integration of the evaporator is discussed. Results of a prototype testing of swirl nozzles with dielectric fluid HFE-7200 on a notebook PC are presented. This paper also reviews liquid and evaporative cooling research applied to thermal management of electronics. It outlines the challenges to practical implementation and future research needs.

Jet impingement cooling of triangular ribbed surface with bottom exit grill ( Category-Engineering )

2011 ◽  
Vol 3 (2) ◽  
pp. 136-137
Author(s):  
Dr. M.T. Bhoite Dr. M.T. Bhoite ◽  
◽  
Kartik Jujare ◽  
Sayali Wable
Keyword(s):  
Jet Impingement ◽  
Impingement Cooling
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