Fabrication of nanoporous copper surface by leaching of chill-zone Cu–Zr–Hf alloys

2015 ◽  
Vol 104 ◽  
pp. 64-66 ◽  
Author(s):  
Daria Barsuk ◽  
Min Zhang ◽  
Nikolaos T. Panagiotopoulos ◽  
Alberto M. Jorge ◽  
Konstantinos Georgarakis ◽  
...  
Keyword(s):  
Copper Surface ◽  
Nanoporous Copper ◽  
Chill Zone

Enhanced boiling performance of a nanoporous copper surface by electrodeposition and heat treatment

2016 ◽  
Vol 53 (3) ◽  
pp. 947-958 ◽  
Author(s):  
Jiao Gao ◽  
Long-Sheng Lu ◽  
Jia-Wei Sun ◽  
Xiao-Kang Liu ◽  
Biao Tang
Keyword(s):  
Heat Treatment ◽  
Copper Surface ◽  
Nanoporous Copper ◽  
Enhanced Boiling

scholarly journals Hydrophilic Nanoporous Copper Surface Prepared by Modified Formic Acid Vapor Treatment

2021 ◽  
pp. 101620
Author(s):  
Lap-Hong Chan ◽  
Kiyokazu Yasuda ◽  
Jenn-Ming Song ◽  
Tadatomo Suga
Keyword(s):  
Formic Acid ◽  
Copper Surface ◽  
Acid Vapor ◽  
Nanoporous Copper ◽  
Vapor Treatment

Flaky and Dense Lithium Deposition Enabled by a Nanoporous Copper Surface Layer on Lithium Metal Anode

2020 ◽  
Vol 2 (4) ◽  
pp. 358-366 ◽  
Author(s):  
Feihu Guo ◽  
Chen Wu ◽  
Shengli Chen ◽  
Xinping Ai ◽  
Faping Zhong ◽  
...  
Keyword(s):  
Surface Layer ◽  
Copper Surface ◽  
Lithium Metal ◽  
Metal Anode ◽  
Lithium Metal Anode ◽  
Nanoporous Copper ◽  
Lithium Deposition

scholarly journals Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications

Polymers ◽  
2021 ◽  
Vol 13 (11) ◽  
pp. 1721
Author(s):  
Mario Mora ◽  
Hippolyte Amaveda ◽  
Luis Porta-Velilla ◽  
Germán F. de la Fuente ◽  
Elena Martínez ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Bonding Strength ◽  
Copper Surface ◽  
Heat Sinks ◽  
Electrical Insulation ◽  
Cryogenic Temperatures ◽  
Shear Tests ◽  
Patterned Structures ◽  
Different Temperatures ◽  
Mechanical Tensile

The objective of this work is the enhancement of metal-to-metal bonding to provide high thermal conductivity together with electrical insulation, to be used as heat sinks at room and cryogenic temperatures. High thermal conductive metal (copper) and epoxy resin (Stycast 2850FT) were used in this study, with the latter also providing the required electrical insulation. The copper surface was irradiated with laser to induce micro- and nano-patterned structures that result in an improvement of the adhesion between the epoxy and the copper. Thus, copper-to-copper bonding strength was characterized by means of mechanical tensile shear tests. The effect of the laser processing on the thermal conductivity properties of the Cu/epoxy/Cu joint at different temperatures, from 10 to 300 K, is also reported. Using adequate laser parameters, it is possible to obtain high bonding strength values limited by cohesive epoxy fracture, together with good thermal conductivity at ambient and cryogenic temperatures.

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