Development of cloud-based automatic virtual metrology system for semiconductor industry

2015 ◽  
Vol 34 ◽  
pp. 30-43 ◽  
Author(s):  
Hsien-Cheng Huang ◽  
Yu-Chuan Lin ◽  
Min-Hsiung Hung ◽  
Chia-Chun Tu ◽  
Fan-Tien Cheng
2012 ◽  
Vol 28 (4) ◽  
pp. 559-568 ◽  
Author(s):  
Min-Hsiung Hung ◽  
Wen-Huang Tsai ◽  
Haw-Ching Yang ◽  
Yi-Jhong Kao ◽  
Fan-Tien Cheng

Author(s):  
George H. McAfee

The Scanning Electron Microscope remains one of the most universal tools in the semiconductor industry. While it gained prominence in the areas of inspection and analysis, it is also a very capable metrology tool. There is a wide selection of S.E.M.′s available that are dedicated to line width measuring; however, this article discusses film thickness measuring during cross-sectional S.E.M. analysis.As with any metrology system, a process should begin with a certified and traceable measurement standard. N.I.S.T. SRM 484f was the standard employed for this experiment. A gauge and capability study was first performed on a Nanometrics CWIKSCAN II FE S.E.M.. Long range repeatability was calculated at 1.57% Figures 1 and 2 show the micrograph and video signal data respectively from the N.I.S.T. standard. Note the cursor position and measurement value on figure 2. The 1.072μm value agrees very well with the certified value of 1.067μm.• It is important to note that the aspect ratio on most CRT screens is not 1:1. Therefore, if any electronic manipulation of the image is required for cursor alignment, the system calibration must be performed at the same orientation where the measurements will be taken.


2009 ◽  
Vol 36 (10) ◽  
pp. 12554-12561 ◽  
Author(s):  
Pilsung Kang ◽  
Hyoung-joo Lee ◽  
Sungzoon Cho ◽  
Dongil Kim ◽  
Jinwoo Park ◽  
...  

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