Three-dimensional modelling and simulation of vibration marks on surface generation in ultra-precision grinding

2018 ◽  
Vol 53 ◽  
pp. 221-235 ◽  
Author(s):  
Shanshan Chen ◽  
Chi Fai Cheung ◽  
Feihu Zhang ◽  
Chenyang Zhao
Keyword(s):  
Three Dimensional ◽  
Modelling And Simulation ◽  
Surface Generation ◽  
Precision Grinding ◽  
Ultra Precision

Fabrication of Micro V-Grooves in Ultra-Precision Grinding

2016 ◽  
Vol 679 ◽  
pp. 179-183
Author(s):  
Ze Qin Lin ◽  
Su Juan Wang ◽  
Xin Du Chen
Keyword(s):  
Fiber Optics ◽  
Surface Quality ◽  
Prediction Models ◽  
High Surface ◽  
Surface Generation ◽  
Precision Grinding ◽  
High Surface Quality ◽  
Ductile Mode ◽  
Ultra Precision ◽  
General Aspects

Ultra-precision grinding is an effective method to machine the optical micro v-groove, which is one of microstructures applied to the fiber-optics connectors, displays and other photonics devices. The ultra-precision grinding technology directly obtains high surface quality for brittle materials when the grinding process is under the ductile mode. This paper introduces general aspects of ultra-precision grinding technology in the fabrication of the micro v-grooves structures and introduces the essential features of ultra-precision grinding. The process of the manufacturing of the optical micro v-grooves components is presented in this paper. It contains the prediction models of surface roughness and form accuracy in the ultra-precision grinding and the optimization model under the consideration of the influences of grinding parameters,grinder factors and the material properties on the surface quality and machining efficiency. This study therefore contributes to providing a further understanding on the mechanisms of material removal and surface generation in ultra-precision girnding.

scholarly journals Study on the Algorithm of Three-Dimensional Surface Residual Material Height of Nano-ZrO2 Ceramics under Ultra-Precision Grinding

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1363
Author(s):  
Yanyan Yan ◽  
Zhaoqing Zhang ◽  
Junli Liu ◽  
Haozhe Yan ◽  
Xiaoxu Wang
Keyword(s):  
Surface Quality ◽  
Calculation Method ◽  
Material Removal ◽  
Three Dimensional ◽  
Brittle Materials ◽  
Precision Grinding ◽  
Removal Process ◽  
Residual Material ◽  
Hard And Brittle Materials ◽  
Ultra Precision

A large number of studies have shown that the height of a residual material is the key factor affecting the surface quality of ultra-precision grinding. However, the grinding process contains several random factors, such as the randomness of grinding particle size and the random distribution of grinding particles, which cause the complexity of the material removal process. In this study, taking the Nano-ZrO2 as an example, the removal process of surface materials in ultra-precision grinding of hard and brittle materials was analyzed by probability. A new calculation method for the height of surface residual materials in ultra-precision grinding of Nano-ZrO2 was proposed, and the prediction model of the three-dimensional roughness Sa and Sq were established by using this calculation method. The simulation and experimental results show that this calculation method can obtain the more accurate surface residual material height value which accords with the characteristics of three-dimensional roughness sampling, which provides a theoretical reference for the analysis of the material removal process and the surface quality evaluation of ultra-precision grinding of hard and brittle materials.

Compliant Mesoscale Grinding of 3-Dimensional Free Form Shapes in Silicon Wafers

2002 ◽  
Author(s):  
B. Jiang ◽  
M. A. Shannon ◽  
M. L. Philpott
Keyword(s):  
Force Feedback ◽  
Defect Formation ◽  
Three Dimensional ◽  
Silicon Wafers ◽  
Free Form ◽  
Precision Grinding ◽  
New Approach ◽  
3 Dimensional ◽  
Grinding Method ◽  
Ultra Precision

This paper presents a new approach to create three-dimensional free form shapes in silicon wafers by compliant grinding. Instead of requiring high rigidity in traditional ultra-precision grinding systems, the proposed compliant grinding method requires relatively low rigidity. It achieves the required surface roughness, form accuracy and surface integrity by utilizing grinding force feedback and adaptive control. Compliant grinding mitigates microfractures, chipping, and defect formation in the silicon substrate, so that both electronic and mechanical properties of the Si are not degraded. A prototype silicon die grinder has been built and initial rough grinding results are promising.

scholarly journals A Self-Established “Machining-Measurement-Evaluation” Integrated Platform for Taper Cutting Experiments and Applications

Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 929
Author(s):  
Xudong Yang ◽  
Zexiao Li ◽  
Linlin Zhu ◽  
Yuchu Dong ◽  
Lei Liu ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Precision Machining ◽  
Two Dimensional ◽  
Dimensional Image ◽  
Two Dimensional Image ◽  
Integrated Platform ◽  
Hard And Brittle Materials ◽  
Ultra Precision ◽  
Cutting Experiments

Taper-cutting experiments are important means of exploring the nano-cutting mechanisms of hard and brittle materials. Under current cutting conditions, the brittle-ductile transition depth (BDTD) of a material can be obtained through a taper-cutting experiment. However, taper-cutting experiments mostly rely on ultra-precision machining tools, which have a low efficiency and high cost, and it is thus difficult to realize in situ measurements. For taper-cut surfaces, three-dimensional microscopy and two-dimensional image calculation methods are generally used to obtain the BDTDs of materials, which have a great degree of subjectivity, leading to low accuracy. In this paper, an integrated system-processing platform is designed and established in order to realize the processing, measurement, and evaluation of taper-cutting experiments on hard and brittle materials. A spectral confocal sensor is introduced to assist in the assembly and adjustment of the workpiece. This system can directly perform taper-cutting experiments rather than using ultra-precision machining tools, and a small white light interference sensor is integrated for in situ measurement of the three-dimensional topography of the cutting surface. A method for the calculation of BDTD is proposed in order to accurately obtain the BDTDs of materials based on three-dimensional data that are supplemented by two-dimensional images. The results show that the cutting effects of the integrated platform on taper cutting have a strong agreement with the effects of ultra-precision machining tools, thus proving the stability and reliability of the integrated platform. The two-dimensional image measurement results show that the proposed measurement method is accurate and feasible. Finally, microstructure arrays were fabricated on the integrated platform as a typical case of a high-precision application.

scholarly journals An Investigation of the Cutting Strategy for the Machining of Polar Microstructures Used in Ultra-Precision Machining Optical Precision Measurement

Micromachines ◽  
2021 ◽  
Vol 12 (7) ◽  
pp. 755
Author(s):  
Chen-Yang Zhao ◽  
Chi-Fai Cheung ◽  
Wen-Peng Fu
Keyword(s):  
Precision Measurement ◽  
Detection Algorithm ◽  
Surface Generation ◽  
Precision Machining ◽  
Tool Geometry ◽  
Depth Of Cut ◽  
Machining Parameters ◽  
Ultra Precision ◽  
Transition Points ◽  
Cutting Strategy

In this paper, an investigation of cutting strategy is presented for the optimization of machining parameters in the ultra-precision machining of polar microstructures, which are used for optical precision measurement. The critical machining parameters affecting the surface generation and surface quality in the machining of polar microstructures are studied. Hence, the critical ranges of machining parameters have been determined through a series of cutting simulations, as well as cutting experiments. First of all, the influence of field of view (FOV) is investigated. After that, theoretical modeling of polar microstructures is built to generate the simulated surface topography of polar microstructures. A feature point detection algorithm is built for image processing of polar microstructures. Hence, an experimental investigation of the influence of cutting tool geometry, depth of cut, and groove spacing of polar microstructures was conducted. There are transition points from which the patterns of surface generation of polar microstructures vary with the machining parameters. The optimization of machining parameters and determination of the optimized cutting strategy are undertaken in the ultra-precision machining of polar microstructures.

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