Development and machining performance of a textured diamond cutting tool fabricated with a focused ion beam and heat treatment

2017 ◽  
Vol 47 ◽  
pp. 311-320 ◽  
Author(s):  
Noritaka Kawasegi ◽  
Kazuma Ozaki ◽  
Noboru Morita ◽  
Kazuhito Nishimura ◽  
Makoto Yamaguchi
Keyword(s):  
Heat Treatment ◽  
Focused Ion Beam ◽  
Cutting Tool ◽  
Ion Beam ◽  
Machining Performance ◽  
Diamond Cutting ◽  
Diamond Cutting Tool

0401 Fabrication of a diamond cutting tool utilizing focused ion beam and its cutting properties

2013 ◽  
Vol 2013.50 (0) ◽  
pp. 040101-040102
Author(s):  
Tomoyuki NIWATA ◽  
Noritaka KAWASEGI ◽  
Noboru TAKANO ◽  
Shigeru YAMADA ◽  
Noboru MORITA ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Cutting Tool ◽  
Ion Beam ◽  
Diamond Cutting ◽  
Diamond Cutting Tool

Effect of texture shape on machining performance of textured diamond cutting tool

2019 ◽  
Vol 60 ◽  
pp. 21-27 ◽  
Author(s):  
Noritaka Kawasegi ◽  
Takumi Kawashima ◽  
Noboru Morita ◽  
Kazuhito Nishimura ◽  
Makoto Yamaguchi ◽  
...  
Keyword(s):  
Cutting Tool ◽  
Machining Performance ◽  
Diamond Cutting ◽  
Diamond Cutting Tool

Controllability Study of Single-Crystal Diamond Cutting Tool Focus Ion Beam Milling with Different Beam Current and Tilting Angle

2016 ◽  
Vol 1136 ◽  
pp. 430-434 ◽  
Author(s):  
Seung Yub Baek ◽  
Woong Kirl Choi ◽  
Young Jae Choi ◽  
Eun Sang Lee
Keyword(s):  
Cutting Tool ◽  
Ion Beam ◽  
Beam Current ◽  
Diamond Cutting ◽  
Tilting Angle ◽  
Tool Edge ◽  
Single Crystal Diamond ◽  
Processing Procedure ◽  
Edge Sharpness ◽  
Diamond Cutting Tool

Micro/nanoscale diamond cutting tools used in ultra-precision machining can be fabricated by precision grinding, but it is hard to fabricate a tool with a nanometric cutting edge and complex configurations. High-precision geometry accuracy and special shapes for microcutting tools with sharp edges can be achieved by focused ion beam (FIB) milling. However, in the FIB milling process, the surface properties of the substrate (such as a diamond substrate) are affected by the amorphous damage layer caused by the FIB gallium ion collision and implantation and these influence the diamond cutting tool edge sharpness and increase the processing procedure. In this study, to reduce the diamond cutting tool edge sharpness and processing procedure, FIB milling beam current and tilting angle characteristics of single-crystal diamond were investigated, along with method for decreasing the FIB-induced damage on diamond tools by platinum (Pt) coating on the diamond substrate. Experimental results revealed that optimize beam current, tilting angle and platinum (Pt) coating could lead to relatively few processing procedure and sharp cutting tool edge. The obtained results are an endeavor to enhance the controllability of the diamond cutting tool FIB milling.

Removal of Ion Irradiation-Induced Affected Layers from Diamond Cutting Tools to Improve Machining Performance

2014 ◽  
Vol 1017 ◽  
pp. 479-484
Author(s):  
Noritaka Kawasegi ◽  
Kazuma Ozaki ◽  
Noboru Morita ◽  
Kazuhito Nishimura ◽  
Hideki Sasaoka
Keyword(s):  
Focused Ion Beam ◽  
Ion Irradiation ◽  
Ion Beam ◽  
Effective Means ◽  
Cutting Tools ◽  
Machining Performance ◽  
Diamond Cutting ◽  
Diamond Tools ◽  
Tool Performance ◽  
Diamond Cutting Tools

A focused ion beam (FIB) is an effective means of fabricating micro-to submicro-scale shapes on diamond cutting tools. However, ion irradiation of diamond tools causes ion implantation, defects, and non-diamond phases, all of which degrade the tool performance. To remove affected layers from FIB-irradiated diamond tools, heat treatment in air was applied, and the effect of the heating parameters on the etchability of the irradiated area was investigated. It was found that the affected layer could be etched and removed from the diamond tool surface, even at 500 °C. In machining experiments on aluminum alloy and nickel phosphorus, machining performance was improved by the applied heating technique, and the cutting forces and machined surfaces were similar to those obtained with the non-irradiated tool. These results indicate that the proposed heating technique is effective for diamond cutting tools shaped by FIB.

Microtexture Generation Using Controlled Chatter Machining in Ultraprecision Diamond Turning

2015 ◽  
Vol 3 (2) ◽  
Author(s):  
Syed Adnan Ahmed ◽  
Jeong Hoon Ko ◽  
Sathyan Subbiah ◽  
Swee Hock Yeo
Keyword(s):  
Cutting Tool ◽  
Cutting Speed ◽  
Diamond Turning ◽  
Diamond Cutting ◽  
Machined Surface ◽  
Excited Vibration ◽  
Mass And Heat Transfer ◽  
Tool Shank ◽  
Diamond Cutting Tool

This paper describes a new method of microtexture generation in precision machining through self-excited vibrations of a diamond cutting tool. Conventionally, a cutting tool vibration or chatter is detrimental to the quality of the machined surface. In this study, an attempt is made to use the cutting tool's self-excited vibration during a cutting beneficially to generate microtextures. This approach is named as “controlled chatter machining (CCM).” Modal analysis is first performed to study the dynamic behavior of the cutting tool. Turning processes are then conducted by varying the tool holder length as a means to control vibration. The experimental results indicate that the self-excited diamond cutting tool can generate microtextures of various shapes, which depend on the cutting tool shank, cutting speed, feed, and cutting depth. The potential application of this proposed technique is to create microtextures in microchannels and microcavities to be used in mass and heat transfer applications.

Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

2014 ◽  
Author(s):  
Hossein Mohammadi ◽  
H. Bogac Poyraz ◽  
Deepak Ravindra ◽  
John A. Patten
Keyword(s):  
Fiber Laser ◽  
Cutting Tool ◽  
Single Point ◽  
Diamond Turning ◽  
Depth Of Cut ◽  
Beam Diameter ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Diamond Cutting Tool ◽  
Si Wafer

In this study, single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (μ-LAM) technique. The μ-LAM system is used to preferentially heat and thermally soften the work piece material in contact with a diamond cutting tool. In μ-LAM the laser and cutting tool are integrated into a single package, i.e. the laser energy is delivered by a single mode fiber laser to and through a diamond cutting tool. This hybrid method can potentially increase the critical depth of cut (DoC), i.e., a larger ductile-to-brittle transition (DBT) depth, in ductile regime machining, resulting in a higher material removal rate (MRR). An IR continuous wave (CW) fiber laser, wavelength of 1064nm and max power of 100W with a beam diameter of 10μm, is used in this investigation. In the current study SPDT tests were employed on single crystal silicon (Si) wafer which is very brittle and hard to machine by conventional methods. Different outputs such as surface roughness and depth of cut for different set of experiments were analyzed. Results show that an unpolished surface of a Si wafer can be machined in one pass to get a very good surface finish. The Ra was brought down from 1.2μm to 275nm only in one pass which is a very promising result for machining the Si wafer.

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