Single Point Diamond Turning of Silicon by Using Micro-Laser Assisted Machining Technique

2014 ◽  
Author(s):  
Hossein Mohammadi ◽  
H. Bogac Poyraz ◽  
Deepak Ravindra ◽  
John A. Patten
Keyword(s):  
Fiber Laser ◽  
Cutting Tool ◽  
Single Point ◽  
Diamond Turning ◽  
Depth Of Cut ◽  
Beam Diameter ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Diamond Cutting Tool ◽  
Si Wafer

In this study, single point diamond turning (SPDT) is coupled with the micro-laser assisted machining (μ-LAM) technique. The μ-LAM system is used to preferentially heat and thermally soften the work piece material in contact with a diamond cutting tool. In μ-LAM the laser and cutting tool are integrated into a single package, i.e. the laser energy is delivered by a single mode fiber laser to and through a diamond cutting tool. This hybrid method can potentially increase the critical depth of cut (DoC), i.e., a larger ductile-to-brittle transition (DBT) depth, in ductile regime machining, resulting in a higher material removal rate (MRR). An IR continuous wave (CW) fiber laser, wavelength of 1064nm and max power of 100W with a beam diameter of 10μm, is used in this investigation. In the current study SPDT tests were employed on single crystal silicon (Si) wafer which is very brittle and hard to machine by conventional methods. Different outputs such as surface roughness and depth of cut for different set of experiments were analyzed. Results show that an unpolished surface of a Si wafer can be machined in one pass to get a very good surface finish. The Ra was brought down from 1.2μm to 275nm only in one pass which is a very promising result for machining the Si wafer.

An Experimental Study on Single Point Diamond Turning of an Unpolished Silicon Wafer via Micro-Laser Assisted Machining

2014 ◽  
Vol 1017 ◽  
pp. 175-180 ◽  
Author(s):  
Hossein Mohammadi ◽  
H. Bogac Poyraz ◽  
Deepak Ravindra ◽  
John A. Patten
Keyword(s):  
Single Point ◽  
High Hardness ◽  
Industrial Applications ◽  
Diamond Turning ◽  
Shear Stresses ◽  
Workpiece Material ◽  
Crystal Silicon ◽  
Laser Assisted Machining ◽  
Diamond Cutting Tool ◽  
Si Wafer

Single Pointe Diamond Turning (SPDT) of silicon can be an extremely abrasive process due to the hardness of this material. In this research SPDT is coupled with the micro-laser assisted machining (μ-LAM) technique to machine an unpolished single crystal silicon (Si) wafer. Si is increasingly being used for industrial applications as it is hard, strong, inert, light weight and has great optical and electrical properties. Manufacturing this material without causing surface and subsurface damage is extremely challenging due to its high hardness, brittle characteristics and poor machinability. However, ductile regime machining of Si is possible due to the high pressure phase transformation (HPPT) occurring in the material caused by the high compressive and shear stresses induced by the single point diamond tool tip. The μ-LAM system is used to preferentially heat and thermally soften the workpiece material in contact with a diamond cutting tool. Different outputs such as surface roughness (Ra, Rz) and depth of cuts (DoC) for different set of experiments with and without laser were analyzed. Results show that an unpolished surface of a Si wafer can be machined in two passes to get a very good surface finish.

Microtexture Generation Using Controlled Chatter Machining in Ultraprecision Diamond Turning

2015 ◽  
Vol 3 (2) ◽  
Author(s):  
Syed Adnan Ahmed ◽  
Jeong Hoon Ko ◽  
Sathyan Subbiah ◽  
Swee Hock Yeo
Keyword(s):  
Cutting Tool ◽  
Cutting Speed ◽  
Diamond Turning ◽  
Diamond Cutting ◽  
Machined Surface ◽  
Excited Vibration ◽  
Mass And Heat Transfer ◽  
Tool Shank ◽  
Diamond Cutting Tool

This paper describes a new method of microtexture generation in precision machining through self-excited vibrations of a diamond cutting tool. Conventionally, a cutting tool vibration or chatter is detrimental to the quality of the machined surface. In this study, an attempt is made to use the cutting tool's self-excited vibration during a cutting beneficially to generate microtextures. This approach is named as “controlled chatter machining (CCM).” Modal analysis is first performed to study the dynamic behavior of the cutting tool. Turning processes are then conducted by varying the tool holder length as a means to control vibration. The experimental results indicate that the self-excited diamond cutting tool can generate microtextures of various shapes, which depend on the cutting tool shank, cutting speed, feed, and cutting depth. The potential application of this proposed technique is to create microtextures in microchannels and microcavities to be used in mass and heat transfer applications.

Force Analysis, Mechanical Energy and Laser Heating Evaluation of Scratch Tests on Silicon Carbide (4H-SiC) in Micro-Laser Assisted Machining (µ-LAM) Process

2009 ◽  
Author(s):  
Amir R. Shayan ◽  
Huseyin Bogac Poyraz ◽  
Deepak Ravindra ◽  
Muralidhar Ghantasala ◽  
John A. Patten
Keyword(s):  
Laser Beam ◽  
Cutting Forces ◽  
Laser Heating ◽  
Cutting Tool ◽  
Work Piece ◽  
Force Analysis ◽  
Diamond Cutting ◽  
Laser Assisted Machining ◽  
Scratch Tests ◽  
Diamond Cutting Tool

The purpose of applying a laser beam in the micro-laser assisted machining (μ-LAM) process is to preferentially heat and thermally soften the surface layer of the work piece material (4H-SiC) at the interface with a diamond cutting tool. In the μ-LAM process the laser beam (1480 nm and 400 mW) is delivered to the work piece material through a transparent diamond cutting tool. Thus the cutting tool and the laser system are integrated and coupled; in contrast with other LAM processes where the cutting tool and laser are separate and distinct systems. Scratches were made on a 4H-SiC substrate using the μ-LAM process. The characteristics of the scratches, such as depth and width, are principally a function of the cutting tool geometry, applied forces, cutting speed, and laser heating. White light interferometer microscopy and Atomic Force Microscopy (AFM) techniques were used to measure the geometry (depth and width) of the scratches. Force analysis was carried out to evaluate the laser heating effect on the cutting forces and the measured depth of cut. The force analysis included an evaluation of the mechanical work, specific energy, and understanding the effect of laser heating on the cutting process. The scratch tests performed on 4H-SiC with the laser heating showed that there is a greater than 50% reduction in relative calculated hardness values of work piece material, resulting in a significant reduction in cutting forces.

Thermal and Structural Deformations During Diamond Turning of Rotationally Symmetric Structured Surfaces

2008 ◽  
Vol 130 (4) ◽  
Author(s):  
Stefan Rakuff ◽  
Paul Beaudet
Keyword(s):  
Cutting Tool ◽  
Diamond Turning ◽  
Machining Process ◽  
Diamond Cutting ◽  
Structured Surfaces ◽  
Optical Films ◽  
Single Crystal Diamond ◽  
Structural Loop ◽  
Diamond Cutting Tool ◽  
Aerostatic Spindle

Diamond turning of microstructures on the surface of large cylindrical workpieces has become important with advances made in roll-to-roll manufacturing processes of optical films, drag reduction films, microfluidic devices, and organic electronic components. Micromachined cylindrical workpieces are used as production masters in various printing, embossing, and coating processes. The microstructures machined in this study were 18μm in height and had a pitch of 35μm. These dimensions required control of the location of the single crystal diamond cutting tool that was used for machining to submicrometer levels. The significant error sources identified in the machining process were thermal effects and deflections of the structural loop of the diamond turning machine (DTM) that led to registration errors of the cutting tool between consecutive passes. Environmental temperature variation errors (ETVEs) were measured and modeled as a function of long-term ambient temperature fluctuations. Also studied was the mechanical compliance of the structural loop of the DTM. The height adjustable tool stack and aerostatic spindle were identified as the most compliant components. The cutting forces for radius and V-shaped diamond cutting tools at various depths of cut were measured using the known compliance of the aerostatic bearing to predict workpiece deflections.

Influence of Cutting Condition on Surface Roughness in Single Point Diamond Turning of Zr-Based Bulk Metallic Glass

2016 ◽  
Author(s):  
Shu Sakata ◽  
Akio Hayashi ◽  
Takeshi Terajima ◽  
Yohichi Nakao
Keyword(s):  
Metallic Glass ◽  
Bulk Metallic Glass ◽  
High Speed ◽  
Single Point ◽  
Diamond Turning ◽  
Cutting Conditions ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Diamond Cutting ◽  
Substitute Materials

Bulk metallic glass (BMG) is an amorphous alloy. Thus, it does not have anisotropy and material defect due to its irregular atomic configuration. In addition, it has excellent mechanical properties. For these reasons, the BMG is expected to be substitute materials in various fields. Until now, a number of studies focusing on precise forming have been carried out. However, if the part geometries are complex, controls of the temperature and wettability are difficult. Therefore, single point diamond cutting of the BMG is needed to produce fine surfaces. However, only a few studies on the single point diamond cutting for the BMG have been reported. Thus, appropriate single point diamond cutting technique of the BMG is not established yet. Therefore, single point diamond turning of Zr-based bulk metallic glass was conducted. In the paper, the influences of the depth of cut, feed rate and cutting atmosphere on the chip generation and finished surfaces are investigated. Visualization of the cutting chip generation with different cutting conditions was made with a high-speed camera. The influences of the cutting conditions on the finished surface are considered based on the observation and the measurement of chip and machined surfaces.

scholarly journals Stability analysis for a single-point cutting tool deflection in turning operation

2019 ◽  
Vol 11 (6) ◽  
pp. 168781401985318
Author(s):  
Amon Gasagara ◽  
Wuyin Jin ◽  
Angelique Uwimbabazi
Keyword(s):  
Cutting Forces ◽  
High Speed ◽  
Cutting Tool ◽  
Single Point ◽  
Three Dimensional ◽  
High Speed Steel ◽  
Cutting Parameters ◽  
Depth Of Cut ◽  
Beam Model ◽  
Tool Deflection

In this article, a new model of regenerative vibrations due to the deflection of the cutting tool in turning is proposed. The previous study reported chatter as a result of cutting a wavy surface of the previous cut. The proposed model takes into account cutting forces as the main factor of tool deflection. A cantilever beam model is used to establish a numerical model of the tool deflection. Three-dimensional finite element method is used to estimate the tool permissible deflection under the action of the cutting load. To analyze the system dynamic behavior, 1-degree-of-freedom model is used. MATLAB is used to compute the system time series from the initial value using fourth-order Runge–Kutta numerical integration. A straight hard turning with minimal fluid application experiment is used to obtain cutting forces under stable and chatter conditions. A single-point cutting tool made from high-speed steel is used for cutting. Experiment results showed that for the cutting parameters above 0.1mm/rev feed and [Formula: see text]mm depth of cut, the system develops fluctuations and higher chatter vibration frequency. Dynamic model vibration results showed that the cutting tool deflection induces chatter vibrations which transit from periodic, quasi-periodic, and chaotic type.

Effect of texture shape on machining performance of textured diamond cutting tool

2019 ◽  
Vol 60 ◽  
pp. 21-27 ◽  
Author(s):  
Noritaka Kawasegi ◽  
Takumi Kawashima ◽  
Noboru Morita ◽  
Kazuhito Nishimura ◽  
Makoto Yamaguchi ◽  
...  
Keyword(s):  
Cutting Tool ◽  
Machining Performance ◽  
Diamond Cutting ◽  
Diamond Cutting Tool
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