A review on material removal mechanism in electrochemical discharge machining (ECDM) and possibilities to enhance the material removal rate

2016 ◽  
Vol 45 ◽  
pp. 1-17 ◽  
Author(s):  
Mudimallana Goud ◽  
Apurbba Kumar Sharma ◽  
Chandrashekhar Jawalkar
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Electrochemical Discharge Machining ◽  
Electrochemical Discharge

Modeling of Material Removal Mechanism in Micro Electric Discharge Milling of Ti-6Al-4V

2014 ◽  
Vol 592-594 ◽  
pp. 516-520 ◽  
Author(s):  
Basil Kuriachen ◽  
Jose Mathew
Keyword(s):  
Material Removal Rate ◽  
Feed Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Milling Process ◽  
Work Piece ◽  
Machining Parameters ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Electric Discharge Milling

Micro EDM milling process is accruing a lot of importance in micro fabrication of difficult to machine materials. Any complex shape can be generated with the help of the controlled cylindrical tool in the pre determined path. Due to the complex material removal mechanism on the tool and the work piece, a detailed parametric study is required. In this study, the influence of various process parameters on material removal mechanism is investigated. Experiments were planned as per Response Surface Methodology (RSM) – Box Behnken design and performed under different cutting conditions of gap voltage, capacitance, electrode rotation speed and feed rate. Analysis of variance (ANOVA) was employed to identify the level of importance of machining parameters on the material removal rate. Maximum material removal rate was obtained at Voltage (115V), Capacitance (0.4μF), Electrode rotational Speed (1000rpm), and Feed rate (18mm/min). In addition, a mathematical model is created to predict the material removal

Study on Chemical Mechanical Polishing Removal Mechanism of Monocrystalline Silicon

2014 ◽  
Vol 538 ◽  
pp. 40-43
Author(s):  
Hong Wei Du ◽  
Yan Ni Chen
Keyword(s):  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
Silicon Wafers ◽  
Monocrystalline Silicon ◽  
Mechanical Polishing ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Polishing Pressure

In this paper, material removal mechanism of monocrystalline silicon by chemical etching with different solutions were studied to find effective oxidant and stabilizer. Material removal mechanism by mechanical loads was analyzed based on the measured acoustic signals in the scratching processes and the observation on the scratched surfaces of silicon wafers. The chemical mechanical polishing (CMP) processes of monocrystalline silicon wafers were analyzed in detail according to the observation and measurement of the polished surfaces with XRD. The results show that H2O2 is effective oxidant and KOH stabilizer. In a certain range, the higher concentration of oxidant, the higher material removal rate; the higher the polishing liquid PH value, the higher material removal rate. The polishing pressure is an important factor to obtain ultra-smooth surface without damage. Experimental results obtained silicon polishing pressure shall not exceed 42.5kPa.

Material Removal Mechanism in Vibration-Assisted Finishing

2009 ◽  
Vol 69-70 ◽  
pp. 158-162 ◽  
Author(s):  
Yu Wang ◽  
Shao Hui Yin ◽  
Takeo Shinmura
Keyword(s):  
Material Removal Rate ◽  
Vibration Frequency ◽  
Material Removal ◽  
Removal Rate ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Finishing Process ◽  
Vibration Assistance

In this paper, it is explored the material removal mechanism in vibration-assisted finishing process. On the basis of some experiments, the finishing characteristics are represented summarily. Though the analysis, it is shown that the vibration assistance method may increase cutting distance and speed of abrasive and material removal in per unit finishing distance which is affected by vibration frequency and amplitude, in-process abrasives behavior. What more, the increase in material removal rate is mainly due to an increase in material removal per unit finishing distance which is affected by the effects of abrasives cross-cutting.

scholarly journals Modeling and Analysis of the Material Removal Rate for Ultrasonic Vibration-assisted Polishing of Optical Glass BK7

2021 ◽  
Author(s):  
Yingdong Liang ◽  
Chao Zhang ◽  
Xin Chen ◽  
Tianqi Zhang ◽  
Tianbiao Yu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Material Removal Rate ◽  
Material Removal ◽  
Optical Glass ◽  
Removal Rate ◽  
Machining Accuracy ◽  
Removal Mechanism ◽  
Material Removal Mechanism ◽  
Abrasive Particles ◽  
Material Removal Model

Abstract The emergence of ultrasonic vibration-assisted polishing technology has effectively improved the machining accuracy and efficiency of hard and brittle materials in modern optical industry, however, the material removal mechanism of ultrasonic vibration-assisted polishing (UVAP) still needs to be further revealed. This paper focuses on the material removal mechanism of ultrasonic vibration-assisted polishing of optical glass (BK7), the application of ultrasonic vibration to axial vibration and the atomization of polishing slurry, the material removal model was established. Based on the analysis of the relationship between the nominal distance d of the polishing pad and the actual contact area distribution, the prediction of the material removal profile is realized. In addition, the effects of different parameters on the material removal rate (MRR) were analyzed, including polishing force, spindle speed, abrasive particle size, ultrasonic amplitude, feed rate, and flow-rate of polishing slurry. Based on the motion equation of abrasive particles, the trajectory of abrasive particles in the polishing slurry was simulated, and the simulation results show that the introduction of the ultrasonic vibration field changes the motion state and trajectory of embedded and free abrasive particles. The new model can not only qualitatively analyze the influence of different process parameters on MRR, but also predict the material removal depth and MRR, providing a possibility for deterministic material removal and a theoretical basis for subsequent polishing of complex curved surfaces of optical glass.

Experimental Investigation of Drilling Incorporated Electrochemical Discharge Machining

2014 ◽  
Author(s):  
Baoyang Jiang ◽  
Shuhuai Lan ◽  
Jun Ni
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Process ◽  
Hole Drilling ◽  
Tool Electrode ◽  
Drilling Process ◽  
Electrochemical Discharge Machining ◽  
Electrochemical Discharge ◽  
Micro Drilling

Electrochemical discharge machining (ECDM) is a non-conventional micromachining technology, and is highlighted for non-conductive brittle materials. However, the outcomes of ECDM have many restrictions in application due to limitations on efficiency, accuracy, and machining quality. In this paper, a drilling incorporated ECDM process is presented and analyzed to enhance material removal rate in ECDM drilling process. Incorporating micro-drilling into ECDM significantly increases the rate of material removal, especially in deep hole drilling. As fundamentals of the machining process, material removal mechanisms have been investigated to account for the increment in material removal rate by incorporating micro-drilling. Vibration of tool electrode, induced by a piezo-actuator, was introduced to further enhance material removal rate. Quantitative studies were conducted to determine the appropriate process parameters of drilling incorporated ECDM with tool vibration.

Micro-Machining of Glass Using Electrochemical Discharge Assisted Cutting

2016 ◽  
Author(s):  
Baoyang Jiang ◽  
Jun Ni
Keyword(s):  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Machining Process ◽  
Geometric Accuracy ◽  
Machine Material ◽  
Hybrid Machining ◽  
Electrochemical Discharge Machining ◽  
Electrochemical Discharge ◽  
Hybrid Machining Process

Glass is a hard-to-machine material with vast industrial application. Electrochemical discharge machining (ECDM) is a non-traditional machining technology that has shown potential for effective glass machining. However, ECDM has not been widely used in industry despite being studied for over a decade. Major challenges of ECDM include limited machinable depth and low material removal rate. In this paper, an innovative hybrid machining process combining ECDM and traditional cutting is presented, namely electrochemical discharge assisted cutting. The material removal rate of the hybrid ECDM process is significantly higher than conventional processes. Experimental results are presented to prove the feasibility and capability of the process. Discussion concentrates on the improvement of geometric accuracy and surface integrity through experimentation.

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