Enhancing electrical conductivity and electrical thermal characteristics of a PEDOT:PSS thin layer by using solvent treatment and adding Ag nanoparticle solution

2015 ◽  
Vol 42 ◽  
pp. 143-150
Author(s):  
Satomitsu Imai
2016 ◽  
Vol 73 (2) ◽  
pp. 198-206 ◽  
Author(s):  
Takuya IKEDA ◽  
Tomoki TAKATA ◽  
Juri TAKAGI ◽  
Kaoru ADACHI ◽  
Yasuhisa TSUKAHARA

2011 ◽  
Vol 26 (3) ◽  
pp. 256-261
Author(s):  
Jingjing Yang ◽  
Wenxia Yuan ◽  
Xiaopeng Zeng

We reported the surface morphology and electrical property of super-thin Pt films, ∼2 nm thick, deposited on 6H-SiC (0001) substrates and subsequently annealed from 400 to 1000 °C. The surfaces of the films were found to have a feature of islands growth, and the sizes of the islands increased with increasing annealing temperature. Free carbon, produced by selective reactions between Pt and SiC, diffused toward the top surface across the product layers due to low solubility and composition gradient of carbon throughout the reaction zone. A dramatic change of electrical conductivity of the films was observed. A mechanism analysis reveals that the origin came from the contribution of aggregation of islands on the surface and formation of Pt silicides and a thin layer of crystalline graphite.


2019 ◽  
Vol 25 (10) ◽  
pp. 50-60
Author(s):  
Israa Mawlood Atiyah ◽  
Basma Abbas Abdul-Majeed

Large quantities of contaminated carwash wastewater are produced per day from carwash places. Extensively it contains large quantities of chemicals from detergents, oil, grease, heavy metals, suspended solids, types of hydrocarbons, and biological contents. A novel electrocoagulation treatment by foil electrodes was conducted to remove COD, turbidity, Total Dissolved Solids (TDS) from contaminated carwash wastewater and decrease its Electrical Conductivity (EC). A thin layer of aluminum foil is used as an electrode in this treatment process. The effects of different voltage and treatment times were studied. The best result was found at a voltage of 30 volts and treatment time 90 minute where the removal efficiency of COD, turbidity, TDS, and EC were 97.94%, 99.90%, 25.31%, 15.57% respectively.    


1993 ◽  
Vol 297 ◽  
Author(s):  
Shin-Ichi Ishihara ◽  
Deyan He ◽  
Tetsuya Akasaka ◽  
Yuzoh Araki ◽  
Isamu Shimizu

Poly-Si thin films with grains 100–200 nm in dia. showing a highly ordered texture were grown from fluorinated precursors, SiFnHm (n+m=3), on a glass substrate at 300–400 °C with the aid of atomic hydrogen. According to the in situ observation by ellipsometry, the reconstruction was undergone in a solid phase stimulated by impinging atomic hydrogens within a thin layer of about 10 nm thick owing to the strong chemical interaction of the pair of H and F in Si-network. Both H and F were released efficiently from the network to the levels of 2 × 1020 cm−3 and (2−5) × 1019 cm−3, respectively. Dangling bonds were also efficiently passivated down to 4 × 1016 cm−3 with hydrogens diffused through the network. P-doped films showing electrical conductivity of 10−2 S/cm (300 °K) with the activation energy of 0.24 eV was obtained by alternately repeating the deposition of thin layer and the treatment with atomic hydrogens.


Author(s):  
A. M. Shulpekov ◽  
O. V. Lapshin

The paper provides experimental research and mathematical models of wave synthesis and thermal explosion in a thin-layer CuO–B–glass system. It is found that burning front propagation has a multi-source behavior and its rate depends on reacting layer thickness by the parabolic law with a maximum at d = 4·10–4m. Increased reacting layer thickness improves thermal explosion properties in this system, and dilution with an inert component makes it possible to obtain copper coatings featuring good electrical conductivity. X-ray phase analysis and optical microscopy demonstrated that the coating consists of metallic copper drops fused together and surrounded by boron-lead silicate glass melt. Coatings have high electrical conductivity comparable with that of metals. It is found that layer thickness increased over 4·10–4m results in a significantly reduced layer propagation rate due to initial mixture loosening under the evaporation effect of water vapors and gases adsorbed on powders, and, as a consequence, it results in reduced heat transfer in the burning front. These coatings are not electrically conductive. Mathematical models of wave synthesis and thermal explosion in a thin-layer CuO–B–glass system using macroscopic approximation. Process dynamics are numerically calculated. Theoretical estimates correspond satisfactorily to experimental values. Thermophysical and thermokinetic process constants are determined by the inverse problem method. Experimental data obtained and mathematical models developed made it possible to obtain prototypes of electric film heaters with high electrical conductivity and operating temperature.


Author(s):  
Shinji Angata ◽  
Eiichi Ide ◽  
Akio Hirose ◽  
Kojiro F. Kobayashi

We propose a novel bonding process using Ag metallo-organic nanoparticles as a new application of nanotechnologies. The average size of the Ag nanoparticle is approximately 11 nm, and each nanoparticle is covered with an organic shell. Usually, the agglomeration of metallic nanoparticles is unavoidable due to its large surface energy. However, on the account of the organic shell, these Ag nanoparticles exist individually, and once the organic shell has been removed, these Ag nanoparticles turn activated and abruptly agglomerate. We analyzed its thermal characteristics, applied the agglomerating of the nanoparticles to Cu-to-Cu joining, and researched the influence of the bonding condition, such as bonding pressure, temperature or holding time, upon the joint strengths. The joint strengths using the nanoparticles were 30–40 MPa, which is strong enough to be applied as a solder. In addition, it came to the conclusion that the strengths increased in accord with the aforesaid three parameters.


Author(s):  
Masanori Yamagiwa ◽  
Qiang Yu ◽  
Masato Fujita

Silicon Carbide Power (SiC) Devices which are operable under high temperature are focused, since the cooling system for the power modules can be miniaturized. In the conventional power devices, the thermal stress that is caused by the thermal expansion mismatch between the Si chip and the substrate can be absorbed by the deformation of solder joint. As a result, the thermal fatigue reliability of the conventional structures is secured. However, the solder materials cannot be used to mount the high temperature operable device like SiC because the operating temperature is higher than their melting temperature. In this study, a kind of Ag nanoparticle thin layer joint is proposed to the mount high temperature operable device. The feature of the Ag nanoparticle is to joint the chip on the substrate by low temperature sintering, and the melting point of the thin layer after mounting process is equal to the bulk Ag. To evaluate the reliability potential of proposed structure, the nonlinear material properties of the thin layer is required. However, it is difficult to measure these properties by the current method. Since it is considered the thin layer has different micro structure from that of the bulk Ag, and it is difficult to prepare a bulk specimen made of the Ag nanoparticle material. Therefore, it is necessary to measure the properties of Ag nanoparticle in the state of a thin layer. In this research, a new approach was proposed to measure the nonlinear properties in the state of thin layer by using a bi-metal fixture which is composed of two different materials whose CTEs are different. When the fixture is heated, micro displacement can be generated between two materials. The thin layer which is formed between the two metals in the fixture deformed in shear direction by the displacement. During the heating, the shear deformation of the thin layer is measured by a digital image correlation method. The load on the thin layer is measured by strain gauge attached at fixture. In this study, the nonlinear properties of Ag nanoparticle thin layer were measured by this method. In addition, properties of solder were measured by this method too as a reference, and the results were compared with the property of bulk solder to confirm the accuracy of the method using bi-metal fixture.


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