scholarly journals An analysis of three dimensional radiation patterns from intrinsic Josephson junctions with hot spot

2013 ◽  
Vol 491 ◽  
pp. 35-39 ◽  
Author(s):  
Hidehiro Asai ◽  
Masashi Tachiki ◽  
Kazuo Kadowaki
Keyword(s):  
Josephson Junctions ◽  
Hot Spot ◽  
Three Dimensional ◽  
Radiation Patterns ◽  
Intrinsic Josephson Junctions

scholarly journals Hot-spot formation in stacks of intrinsic Josephson junctions in Bi2Sr2CaCu2O8

2012 ◽  
Vol 86 (9) ◽  
Author(s):  
B. Gross ◽  
S. Guénon ◽  
J. Yuan ◽  
M. Y. Li ◽  
J. Li ◽  
...  
Keyword(s):  
Josephson Junctions ◽  
Hot Spot ◽  
Intrinsic Josephson Junctions ◽  
Hot Spot Formation ◽  
Spot Formation

Intrinsic Josephson junctions formed inside ultra-thin BSCCO single crystals

2006 ◽  
Vol 20 (2) ◽  
pp. S28-S33 ◽  
Author(s):  
A Yurgens ◽  
L X You ◽  
M Torstensson ◽  
D Winkler
Keyword(s):  
Single Crystals ◽  
Josephson Junctions ◽  
Intrinsic Josephson Junctions

scholarly journals Tunneling characteristics for nm-thick mesas consisting of a few intrinsic Josephson junctions

2008 ◽  
Vol 129 ◽  
pp. 012033 ◽  
Author(s):  
Minoru Suzuki ◽  
Masayuki Ohmaki ◽  
Ryota Takemura ◽  
Kenji Hamada ◽  
Takao Watanabe ◽  
...  
Keyword(s):  
Josephson Junctions ◽  
Intrinsic Josephson Junctions

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

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