Grain boundary flux penetration and resistivity in large grain niobium sheet

2006 ◽  
Vol 441 (1-2) ◽  
pp. 126-129 ◽  
Author(s):  
P.J. Lee ◽  
A.A. Polyanskii ◽  
A. Gurevich ◽  
A.A. Squitieri ◽  
D.C. Larbalestier ◽  
...  
Keyword(s):  
Grain Boundary ◽  
Flux Penetration ◽  
Boundary Flux

Grain-boundary flux pinning by the electron-scattering mechanism

1982 ◽  
Vol 46 (5) ◽  
pp. 523-537 ◽  
Author(s):  
Wilson E. Yetter ◽  
Donald A. Thomas ◽  
Edward J. Kramer
Keyword(s):  
Grain Boundary ◽  
Electron Scattering ◽  
Flux Pinning ◽  
Scattering Mechanism ◽  
Boundary Flux

Flux penetration into grain boundary of YBa2Cu3O7−δ bicrystalline films with tilted surface

2005 ◽  
Vol 426-431 ◽  
pp. 79-82 ◽  
Author(s):  
M. Oishi ◽  
N. Chikumoto ◽  
J. Kato ◽  
S. Tajima ◽  
M. Otsuka
Keyword(s):  
Grain Boundary ◽  
Flux Penetration ◽  
Tilted Surface

Extensions of thermal grooving for arbitrary grain‐boundary flux

1995 ◽  
Vol 78 (6) ◽  
pp. 3833-3838 ◽  
Author(s):  
L. M. Klinger ◽  
E. E. Glickman ◽  
V. E. Fradkov ◽  
W. W. Mullins ◽  
C. L. Bauer
Keyword(s):  
Grain Boundary ◽  
Boundary Flux

The anisotropy ofHc2and its implications to grain‐boundary flux pinning in V3Si

1975 ◽  
Vol 46 (10) ◽  
pp. 4595-4596 ◽  
Author(s):  
Edward J. Kramer ◽  
G. S. Knapp
Keyword(s):  
Grain Boundary ◽  
Flux Pinning ◽  
Boundary Flux

Effect of grain-boundary flux pinning in MgB2 with columnar structure

2009 ◽  
Vol 469 (15-20) ◽  
pp. 1059-1062 ◽  
Author(s):  
D.H. Kim ◽  
T.J. Hwang ◽  
Y.J. Cha ◽  
W.K. Seong ◽  
W.N. Kang
Keyword(s):  
Grain Boundary ◽  
Flux Pinning ◽  
Columnar Structure ◽  
Boundary Flux

Grain Boundary Flux Pinning Mechanism of Liquid-Phase-Sintered Bulk YBa2Cu3Ox

2007 ◽  
Vol 46 (2) ◽  
pp. 574-580 ◽  
Author(s):  
Yasuji Yamada ◽  
Taiki Kuwahara ◽  
Takafumi Donishi ◽  
Shugo Kubo
Keyword(s):  
Liquid Phase ◽  
Grain Boundary ◽  
Flux Pinning ◽  
Pinning Mechanism ◽  
Boundary Flux

Effect of Surface and Grain-Boundary Diffusion on Interconnect Reliability

1995 ◽  
Vol 391 ◽  
Author(s):  
L. M. Klinger ◽  
E. E. Glickman ◽  
V. E. Fradkov ◽  
W. W. Mullins ◽  
C. L. Bauer
Keyword(s):  
Grain Size ◽  
Steady State ◽  
Grain Boundary ◽  
Boundary Diffusion ◽  
Grain Boundary Diffusion ◽  
Polycrystalline Materials ◽  
Interconnect Reliability ◽  
The Stability ◽  
Boundary Flux ◽  
Effect Of Surface

AbstractThe effect of surface and grain-boundary diffusion on interconnect reliability is addressed by extending the theory of thermal grooving to arbitrary grain-boundary flux. For a periodic array of grain boundaries, three regimes are identified: (1) equilibrium, (2) global steady state, and (3) local steady state. These regimes govern the stability of polycrystalline materials subjected to large electric (electromigration) or mechanical (stress voiding) fields, especially in thin films where grain size approximates film thickness.

Dependence of Intergranular Fracture on Boundary Topography and Cohesion

1973 ◽  
Vol 31 ◽  
pp. 150-151
Author(s):  
J. E. Doherty ◽  
A. F. Giamei ◽  
B. H. Kear ◽  
C. W. Steinke
Keyword(s):  
Grain Boundary ◽  
Room Temperature ◽  
Nickel Base Superalloy ◽  
Boundary Shear ◽  
Room Temperature Ductility ◽  
Solid Solution Matrix ◽  
Nickel Base ◽  
Solution Matrix ◽  
Different Levels ◽  
Base Superalloy

Recently we have been investigating a class of nickel-base superalloys which possess substantial room temperature ductility. This improvement in ductility is directly related to improvements in grain boundary strength due to increased boundary cohesion through control of detrimental impurities and improved boundary shear strength by controlled grain boundary micros true tures.For these investigations an experimental nickel-base superalloy was doped with different levels of sulphur impurity. The micros tructure after a heat treatment of 1360°C for 2 hr, 1200°C for 16 hr consists of coherent precipitates of γ’ Ni3(Al,X) in a nickel solid solution matrix.

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