Phase diagram and pyroelectric response of polydomain epitaxial Ba0.6Sr0.4TiO3 thin films

2020 ◽  
Vol 599 ◽  
pp. 412576
Author(s):  
X.F. Sun ◽  
Q. Li ◽  
X.J. Qin ◽  
J.F. Lv ◽  
Y. Luo ◽  
...  
Keyword(s):  
Thin Films ◽  
Phase Diagram ◽  
Pyroelectric Response

scholarly journals Enhanced pyroelectric response at morphotropic and field-induced phase transitions in ferroelectric hafnium oxide thin films

APL Materials ◽  
2021 ◽  
Vol 9 (5) ◽  
pp. 051120
Author(s):  
Clemens Mart ◽  
Thomas Kämpfe ◽  
Kati Kühnel ◽  
Malte Czernohorsky ◽  
Sabine Kolodinski ◽  
...  
Keyword(s):  
Thin Films ◽  
Phase Transitions ◽  
Hafnium Oxide ◽  
Oxide Thin Films ◽  
Pyroelectric Response

Pyroelectric response of ferroelectric thin films

2004 ◽  
Vol 95 (7) ◽  
pp. 3618-3625 ◽  
Author(s):  
A. Sharma ◽  
Z.-G. Ban ◽  
S. P. Alpay ◽  
J. V. Mantese
Keyword(s):  
Thin Films ◽  
Ferroelectric Thin Films ◽  
Pyroelectric Response

Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films

2002 ◽  
Vol 17 (7) ◽  
pp. 1612-1621 ◽  
Author(s):  
M. Li ◽  
F. Zhang ◽  
W. T. Chen ◽  
K. Zeng ◽  
K. N. Tu ◽  
...  
Keyword(s):  
Thin Films ◽  
Phase Diagram ◽  
Solid State ◽  
Brittle Failure ◽  
Ternary Phase ◽  
Interfacial Microstructure ◽  
Snagcu Solder ◽  
Ball Shear ◽  
Aging Study ◽  
Eutectic Snpb

The evolution of interfacial microstructure of eutectic SnAgCu and SnPb solders on Al/Ni(V)/Cu thin films was investigated after various heat treatments. In the eutectic SnPb system, the Ni(V) layer was well protected after 20 reflow cycles at 220 °C. In the SnAgCu solder system, after 5 reflow cycles at 260 °C, the (Cu,Ni)6Sn5 ternary phase formed and Sn was detected in the Ni(V) layer. After 20 reflow cycles, the Ni(V) layer disappeared and spalling of the (Cu,Ni)6Sn5 was observed, which explains the transition to brittle failure mode after ball shear testing. The different interfacial reactions that occurred in the molten SnAgCu and SnPb systems were explained in terms of different solubilities of Cu in the two systems. The dissolution and formation of the (Cu,Ni)6Sn5phase were discussed on the basis of a Sn–Ni–Cu phase diagram. In the solid-state aging study of the SnAgCu samples annealed at 150 °C for up to 1000 h, the Ni(V) layer was intact and the intermetallic compound formed was Cu6Sn5 and not (Cu,Ni)6Sn5, which is the same as was observed for the eutectic SnPb system.

scholarly journals From zirconia to yttria: Sampling the YSZ phase diagram using sputter-deposited thin films

AIP Advances ◽  
2016 ◽  
Vol 6 (2) ◽  
pp. 025119 ◽  
Author(s):  
Thomas Götsch ◽  
Wolfgang Wallisch ◽  
Michael Stöger-Pollach ◽  
Bernhard Klötzer ◽  
Simon Penner
Keyword(s):  
Thin Films ◽  
Phase Diagram ◽  
Sputter Deposited

scholarly journals Unabridged phase diagram for single-phased FeSexTe1-x thin films

2014 ◽  
Vol 4 (1) ◽  
Author(s):  
Jincheng Zhuang ◽  
Wai Kong Yeoh ◽  
Xiangyuan Cui ◽  
Xun Xu ◽  
Yi Du ◽  
...  
Keyword(s):  
Thin Films ◽  
Phase Diagram

scholarly journals Pyroelectric response of lead zirconate titanate thin films on silicon: Effect of thermal stresses

2013 ◽  
Vol 114 (20) ◽  
pp. 204101 ◽  
Author(s):  
M. T. Kesim ◽  
J. Zhang ◽  
S. Trolier-McKinstry ◽  
J. V. Mantese ◽  
R. W. Whatmore ◽  
...  
Keyword(s):  
Thin Films ◽  
Lead Zirconate Titanate ◽  
Thermal Stresses ◽  
Lead Zirconate ◽  
Zirconate Titanate ◽  
Pyroelectric Response
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