Interaction effects in high density magnetic particulate media

2004 ◽  
Vol 343 (1-4) ◽  
pp. 48-52 ◽  
Author(s):  
Mihai Cerchez ◽  
Laurentiu Stoleriu ◽  
Alexandru Stancu
1994 ◽  
Vol 18 (S_1_PMRC_94_1) ◽  
pp. S1_443-446
Author(s):  
Shigeru SHIKAMA ◽  
Yuji SATOH ◽  
Mitsuhiro KATAOKA ◽  
Yoshitoshi SOUTOME ◽  
Hiroaki MORITA

1980 ◽  
Vol 16 (5) ◽  
pp. 973-975 ◽  
Author(s):  
T. Roscamp ◽  
G. Roberts ◽  
P. Frank

Author(s):  
Saketh Mahalingam ◽  
Shashikant Hegde ◽  
Gnyaneshwar Ramakrishna ◽  
Raghuram V. Pucha ◽  
Suresh K. Sitaraman

This paper studies several base substrate materials and interlayer dielectric materials for High Density Interconnect (HDI) boards, addressing reliability issues such as warpage, dielectric cracking and microvia cracking. Design of simulation models with an optimization technique is developed to study material interaction effects on the HDI reliability. A plastic strain gradient-based computational algorithm is developed to study the thermo-mechanical deformation of fine-feature microvia structures.


2010 ◽  
Vol 322 (24) ◽  
pp. 3869-3875 ◽  
Author(s):  
Jehyun Lee ◽  
Markus Fuger ◽  
Josef Fidler ◽  
Dieter Suess ◽  
Thomas Schrefl ◽  
...  

2001 ◽  
Vol 235 (1-3) ◽  
pp. 159-164 ◽  
Author(s):  
Toshiyuki Suzuki ◽  
Terumitsu Tanaka ◽  
Kaoru Ikemizu

1988 ◽  
Vol 24 (6) ◽  
pp. 2868-2870 ◽  
Author(s):  
R.G. Simmons ◽  
D.K. Lee

Sign in / Sign up

Export Citation Format

Share Document