Excimer laser micromachining of aspheric microlenses with precise surface profile control and optimal focusing capability

2007 ◽  
Vol 45 (1) ◽  
pp. 116-125 ◽  
Author(s):  
Yung-Chun Lee ◽  
Chun-Ying Wu
Keyword(s):  
Excimer Laser ◽  
Surface Profile ◽  
Laser Micromachining ◽  
Profile Control ◽  
Optimal Focusing

Excimer Laser Micromachining of Silicon and On-Line Machining Depth Discovery Using Laser Interferometry

2000 ◽  
Author(s):  
Senthil Theppakuttai ◽  
Shaochen Chen
Keyword(s):  
Excimer Laser ◽  
Wave Length ◽  
Michelson Interferometer ◽  
Surface Profile ◽  
Laser Micromachining ◽  
Optical Microscope ◽  
In Situ Monitoring ◽  
Depth Information ◽  
Profile Measurement

Abstract In this paper a parametric study on the excimer laser micromachining of silicon (Si) is conducted and a Michelson interferometer is used for the in-situ diagnostics of the machining depth on the sub-micron and micron scales. An excimer laser of wave length 308 nm is used for the micromachining process. A He-Ne laser of 632.8 nm wavelength is used as the light source for the interferometer and the setup consists of a beam splitter, beam expander and other optics. The interference patterns caused due to the change in the path length between the two interferometer arms gives the machined depth information. These interference patterns are captured by using a photodiode and an oscilloscope. Results from the interferometer are compared with the actual depth measurements obtained by using a surface profilometer in combination with an optical microscope. It is observed that the depths of machining obtained by the surface profile measurement are in accordance with the interferometer measurements with a very high accuracy. The experimental results demonstrate the feasibility of applying this system for the in-situ monitoring of the micromachining process.

Imaging projection lens for excimer laser micromachining

2000 ◽  
Author(s):  
Ying Wan ◽  
Tiechuan Zuo ◽  
Yijian Jiang
Keyword(s):  
Excimer Laser ◽  
Laser Micromachining ◽  
Projection Lens

Excimer laser micromachining

1993 ◽  
Vol 2 (1-2) ◽  
pp. 87-92 ◽  
Author(s):  
J. Ihlemann ◽  
H. Schmidt ◽  
B. Wolff-Rottke
Keyword(s):  
Excimer Laser ◽  
Laser Micromachining

Development of Wide Bandgap Semiconductor Photonic Device Structures by Excimer Laser Micromachining

1999 ◽  
Vol 595 ◽  
Author(s):  
Qiang Zhao ◽  
Michael Lukitsch ◽  
Jie Xu ◽  
Gregory Auner ◽  
Ratna Niak ◽  
...  
Keyword(s):  
Thin Films ◽  
Excimer Laser ◽  
Ablation Rate ◽  
Laser Micromachining ◽  
Wide Bandgap ◽  
Wide Bandgap Semiconductor ◽  
Excimer Laser Ablation ◽  
Sapphire Substrates ◽  
Aspect Ratios ◽  
Device Structures

AbstractExcimer laser ablation rates of Si (111) and AlN films grown on Si (111) and r-plane sapphire substrates were determined. Linear dependence of ablation rate of Si (111) substrate, sapphire and AlN thin films were observed. Excimer laser micromachining of the AlN thin films on silicon (111) and SiC substrates were micromachined to fabricate a waveguide structure and a pixilated structure. This technique resulted in clean precise machining of AlN with high aspect ratios and straight walls.

Etch Performance of KRF Excimer Laser Micromachining Characterization on Silicon Material

2015 ◽  
Vol 780 ◽  
pp. 29-32 ◽  
Author(s):  
M.Z. Zainol ◽  
Yufridin Wahab ◽  
H. Fazmir ◽  
A.F.M. Anuar ◽  
S. Johari ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Etch Rate ◽  
Three Dimensional ◽  
Laser Pulses ◽  
Laser Micromachining ◽  
Rate Change ◽  
Performance Parameters ◽  
Laser Parameters ◽  
Characterization Study ◽  
Krf Excimer Laser

Excimer laser micromachining enables us to overcome the conventional lithography-based microfabrication limitations and simplify the process of creating three dimensional (3D) microstructures.The objective of this study is to investigate the relation between the number of laser pulses, number of laser passes through the channel of ablation site and their etch performance. Parameters such as frequency, fluence and velocity were retained as constants. In this paper, we present a parametric characterization study on silicon using KrF excimer laser micromachining. From the result, the etch rate change were recorded as the two major laser parameters (Number of laser pulses and number of laser passes) were varied. Both parameters were showing declination profile however from comparing both graphs, it showed that etch rate dropped more steeply when varied number of laser passes rather than number of pulses.

Excimer laser micromachining and replication of 3D optical surfaces

1998 ◽  
Vol 127-129 ◽  
pp. 911-914 ◽  
Author(s):  
A. Braun ◽  
K. Zimmer ◽  
B. Hösselbarth ◽  
J. Meinhardt ◽  
F. Bigl ◽  
...  
Keyword(s):  
Excimer Laser ◽  
Laser Micromachining ◽  
Optical Surfaces
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