The boron diffusion in three kinds of group IV semiconductors: silicon, silicon carbide
and synthetic diamond has been studied by secondary ion mass spectrometry. Ion implantation of
300 keV, 11B-ions to a dose of 21014 cm-2 has been performed. The samples are subsequently
annealed at temperatures ranging from 800 to 1650 °C for 5 minutes up to 8 hours. In silicon and
silicon carbide, the boron diffusion is attributed to a transient process and the level of out-diffusion
is correlated to intrinsic carrier concentration. No transient, out-diffused, boron tail is revealed in
diamond at these temperatures.